• Title, Summary, Keyword: Electronic and thermal properties

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Effect of Nano-silicate on the Mechanical, Electrical and Thermal Properties of Epoxy/Micro-silica Composite

  • Park, Jae-Jun
    • Transactions on Electrical and Electronic Materials
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    • v.13 no.3
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    • pp.153-156
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    • 2012
  • In order to develop electrical insulation materials, epoxy/micro-silica composite (EMC) and epoxy/micro-silica/nano-silicate composite (EMNC) were prepared, and their tensile and flexural strength, AC insulation breakdown strength and thermal conductivity and thermal expansion coefficient were compared. Nano-silicate was prepared in an epoxy matrix by our AC electric field process. All properties of the neat epoxy were improved by the addition of micro-silica, which was improved much further by the addition of nano-silicate to the EMC system.

Evaluation of Thermal Deformation in Electronic Packages

  • Beom, Hyeon-Gyu;Jeong, Kyoung-Moon
    • Journal of Mechanical Science and Technology
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    • v.14 no.2
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    • pp.251-258
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    • 2000
  • Thermal deformation in an electronic package due to thermal strain mismatch is investigated. The warpage and the in-plane deformation of the package after encapsulation is analyzed using the laminated plate theory. An exact solution for the thermal deformation of an electronic package with circular shape is derived. Theoretical results are presented on the effects of the layer geometries and material properties on the thermal deformation. Several applications of the exact solution to electronic packaging product development are illustrated. The applications include lead on chip package, encapsulated chip on board and chip on substrate.

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Properties of EMNC according to Addition Contents Variation for Nanosilica (1) -For Thermal Properties (나노실리카 충진함량 변화에 따른 EMNC의 특성연구 (1) -열적특성 중심으로-)

  • Choi, Woon-Shik;Park, Jae-Jun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.10
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    • pp.798-804
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    • 2012
  • This paper focuses on thermal properties of a newly prepared composite material by nano-silica and micro-silica mixture. Nano-silica and micro-silica mixture composites were made by dispersing surface treated nano-silica(average radius: 10 nm) and micro-size silica in epoxy resin. To investigate the effects of nano-silica and micro-size silica mixture(ENMC), the glass transition temperature (Tg), coefficients of thermal expansion(CTE) and elastic modulus of DMA properties by DSC, TMA and DMA devices were measured for the ENMC according to increase nano-silica addition contents and EMC. All properties of the neat epoxy were improved by the addition of micro-silica, which was improved much further by the addition of surface treated nano-silica to the EMC system.

A study on the heat dissipation characteristic of thermal interface materials with Graphene, Cu and Ag nano powders (Graphene, Cu와 Ag 나노 파우더를 이용한 열전도재의 방열 특성에 관한 연구)

  • Park, Sang-Hyeok;Im, Sung-Hoon;Kim, Hyun-Ji;Noh, Jung-Pil;Huh, Sun-Chul
    • Journal of the Korean Society of Industry Convergence
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    • v.22 no.6
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    • pp.767-773
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    • 2019
  • The thermal diffusion performance of the electronic device is a factor for evaluating the stability of the electronic device. Therefore, many of research have been conducted to improve the thermal characteristics of thermal interface materials, which are materials for thermal diffusion of electronic products. In this study, nano thermal grease was prepared by blending graphene, silver and copper nano powders into a thermal grease, a type of thermal interface materials, and the heat transfer rate was measured and compared for the purpose of investigating the improved thermal properties. As a result, the thermal properties were good in the order of graphene, silver and copper, which is thought to be due to the different thermal properties of the nano powder itself.

Thermal, Mechanical, and Electrical Properties for EMNC_60 and EMNC_65 (EMNC_60과 EMNC_65에 대한 열적, 기계적, 전기적 특성 연구)

  • Park, Jae-Jun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.11
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    • pp.895-901
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    • 2012
  • In order to application for high voltage heavy electric equipments, epoxy/microsilica 60 wt%/nano layered silicate composites (EMNC_60) and epoxy/microsilica 65 wt%/nano layered silicate composites (EMNC_65) respectively was synthesized by our electric field dispersion method and the result was obtained completely dispersion state. Thermal properties such as glass transition temperature (Tg) and thermal expansion coefficient, and DMA characteristics were studied, and mechanical properties such as tensile and flexural tests were performed. AC electrical insulation strength was also tested. The study on thermal property, EMNC_65 was better than EMNC_60 and mechanical, electrical properties much improved EMNC_60 compared with EMNC_65.

Electrical Properties and Temperature Effects of PET Films with Interface Layers

  • Dong-Shick kim;Lee, Kwan-Woo;Park, Dae-Hee;Lee, Jong-Bok;Seun Hwangbo
    • Transactions on Electrical and Electronic Materials
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    • v.1 no.4
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    • pp.25-29
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    • 2000
  • In this paper, PET(Ployethylene Terephthalate) films with semiconducting and interface layers were investigated, The electrical properties, such as volume resistivity, tan$\delta$(dissipation factor) and breakdown strength at various temperatures were measured. Thermal analysis of PET and semiconducting films were measured and compared by differential scanning calorimeter(DSC) of each film. It is found that the volume resistivity of films(dependence on semiconducting interface layers)and electrical properties of PET films are changed ,Breakdown strength and dissipation factor of PET films with semiconducting layer (PET/S/PET) are decreased more greatly than PET and PET/PET films, due to the increase of charge density of charges at two contacted interfaces between PET and semiconductor, The dissipation factor of each films in increased with temperature,. For PET/S/PET film, is depended on temperature more than PET of PET/PET. However, the breakdown strength is increased up to 85$\^{C}$ and then decreased over 100$\^{C}$The electrical properties of PET films with semiconducting/interface layer are worse than without it It is due to a result of temperature dependency, which deeply affects thermal resistance property of PET film more than semiconducting/interface layers.

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A Study on the Thermal Properties of CNT reinforced Semiconductive Shield Materials Used in Power Cables

  • Yang, Hoon;Bang, Jeong-Hwan;Chang, Hong-Soon;Nah, Chang-Woon;Park, Dae-Hee
    • Journal of Electrical Engineering and Technology
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    • v.3 no.1
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    • pp.115-120
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    • 2008
  • Use of the carbon nanotube is superior to general powder state materials of mechanical and electrical properties. Because its ratio of diameter and length (aspect ratio) is very large, it has been known as a type of ideal nano-reinforcement material. Based on this advantage, the existing carbon black of semiconductive shield materials used in power cables can acquire excellent properties by using a small amount of carbon nanotubes. Thus, we investigated the thermal properties of the carbon nanotube, such as thermal conductivity, specific heat, and DSC (Differential Scanning Calorimetry). We found that a high thermal resistance level is demonstrated by using a small amount of carbon nanotubes. As a result, this tendency confirms high cross-linking density in a new network in which the carbon nanotube between carbon black constitute molecules shows a bond by similar constructive properties.

Synthesis and Characterization of Graphene Based Unsaturated Polyester Resin Composites

  • Swain, Sarojini
    • Transactions on Electrical and Electronic Materials
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    • v.14 no.2
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    • pp.53-58
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    • 2013
  • Graphene-based polymer nanocomposites are very promising candidates for new high-performance materials that offer improved mechanical, barrier, thermal and electrical properties. Herein, an approach is presented to improve the mechanical, thermal and electrical properties of unsaturated polyester resin (UPR) by using graphene nano sheets (GNS). The extent of dispersion of GNS into the polymer matrix was also observed by using the scanning electron microscopy (SEM) which indicated homogeneous dispersion of GNS through the UPR matrix and strong interfacial adhesion between the GNS and UPR matrix were achieved in the UPR composite, which enhanced the mechanical properties. The tensile strength of the nanocomposites improved at a tune of 52% at a GNS concentration of 0.05%. Again the flexural strength also increased around 92% at a GNS concentration of 0.05%. Similarly the thermal properties and the electrical properties for the nanocomposites were also improved as evidenced from the differential scanning caloriemetry (DSC) and dielectric strength measurement.

The Effects of Alloying-Element Additions to Ag Sheath on Thermal Conductivity and Properties of Bi-2223 Superconductor Tapes (합금원소 첨가에 따른 Ag 피복 Bi-2223 초전도 선재의 열전도도 측정 및 특성평가)

  • ;;;;;;John Slavko Volf;Hua Kun Liu;Miles Apperley
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.7
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    • pp.627-633
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    • 2003
  • The effects of alloying-element additions to Ag sheath on thermal conductivity and mechanical properties of Bi-2223 superconductor tapes have been evaluated. In order to evaluate the effects of sheath alloys and their configuration on the properties of tape, various combinations of Ag and Ag alloys were selected as the inner and outer sheath. Thermal conductivity of the tapes was evaluated by using thermal integral method at 10 ∼120 K. It was observed that the addition of Mg, Sb, and Au to Ag sheath significantly decreased the thermal conductivity at low temperature probably due to the alloying effect. Specifically, the thermal conductivity of AgMg, AgSb, and AgAu at 40 K were 411.4, 142.3, and 109.7 W/(m·K), respectly, which is about 2∼9 times lower than that of Ag (1004.6 W/(m·K)). In addition, the thermal conductivity of alloy-sheathed tape was significantly dependent on their thermal conductivities of constituent sheath materials. The mechanical properties of alloy-sheathed tapes were also evaluated. Yield strength and tensile strength were improved but workability decreased for alloy-sheathed tapes.

Fabrication Process and Analysis of Thermal Properties of High Volume Fraction SiCpi/Al Metal Matrix Composites for Heatsink Materials (반도체 heatsink용 고부피분율 SiCp/Al 금속복합재료의 제조공정 및 열적특성분석)

  • 이효수;홍순형
    • Proceedings of the Korean Society For Composite Materials Conference
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    • pp.58-62
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    • 2000
  • The fabrication process and analysis of thermal properties of 50~76vo1% SiCp/Al metal matrix composites(MMCs) for heatsink materials in electronic packaging were investigated. The 50~76vo1% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 85~170W/mK and coefficient of thermal expansion(CTE) were ranged 10~6ppm1k. Specially, the thermal conductivity and CTE of 71vo1%SiCp/Al MMCs were ranged 115~156W/mK and 6~7ppm/K. respectively, which showed a improved thermal properties than the conventional electronic packaging materials such as ceramics and metals.

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