• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.11a
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• pp.163-168
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• 2006

In a micro-unit of electronic-machine, vibration can be excited by a small impact, and this vibration acts as a fatigue load. To measure the vibration effect on the micro unit, a micro dynamic tester is needed to test a micro specimen. In this paper, it has confirmed a movement of the PZT(piezo actuator) to use a sine signal. And, it has confirmed a fracture of specimens by using a tension-tension input signal in PZT. A metal-material property in the micro scale has been tested to compare with the macro scale. A fatigue test has been conducted by using PZT actuator to give a bending-tension effect.

• Journal of the Korean Society of Safety
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• v.14 no.3
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• pp.69-77
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• 1999

As the use of automatic handling equipment for sensitive semiconductor devices is rapidly increased, manufacturers of electronic components and equipment need to be more alert to the problem of electrostatic discharges(ESD). Semiconductor devices such as IC, LSI, VLSI become a high density pattern of being more fragile by ESD phenomena. One of the most common causes of electrostatic damage is the direct transfer of electrostatic charge from the human body or a charged material to the electrostatic discharge sensitive devices. Accordingly, characteristics of electrostatic attenuation in domestic semiconductor devices is investigated to evaluate the ESD phenomina in the semiconductors in this paper. The required data are obtained by Static Honestmeter. Also The results in this paper can be used for the prevention of semiconductor failure by ESD.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.119-124
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• 2001

Currently knowledge of strain in welds has mainly been obtained form strain gaging method:; that is directly attaching most of the material to the gate. The very few non-contact method are still in the early stage. One of the non-contact methods is by the use of the laser that has high-level of the accuracy for the measurement, and this laser also has excellent characteristics on which many studies for its applications are focused throughout the many fields. The dissertation is on the measurement of the strain caused by the characteristics and the temperature changes of the TIG welded zone which is used with 3D ESPI system that is functionally modified through the laser ESPI system. This system employed the aluminum sheet-metal which are mainly used for the steel plate such as for the electronics, chemisry, food instrument and electronic appliances.

• Fibers and Polymers
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• v.2 no.1
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• pp.135-139
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• 2001

Poly(hydroxamic acid) resin beads were prepared and complexed with various metal ions. We used IR spectroscopy to investigate the structure of metal complex. It proved that the products formed by introduction of metal ions gave stable and colored complex. It was found that the resin bead as synthesized would be a good column packing material for continuous extraction. Energy dispersive spectroscopy was use to study the distribution of metal ions in the resin matrix. It could be tentatively concluded that adsorption and diffusion of metal ions in the chelating resins mainly depended on the loading of the resin matrix which indicated interacting sites with metal ions.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.155-161
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• 2001

Currently knowledge of strain in welds has mainly been obtained from strain gaging method; that is directly attaching most of the material to the gage. The very few non-contact method are still in the early stage. One of the non-contact methods is by the use of the laser that has high-level of the accuracy for the measurement, and this laser also has excellent characteristics on which many studies for its applications are focused throughout the many fields. The dissertation is on the measurement of the strain caused by the characteristics and the temperature changes of the TIG welded zone which is used with 3D ESPI system that is functionally modified through the laser ESPI system. This system employed the aluminum sheet-metal which are mainly used for the steel plate such as for the electronics, chemistry, food instrument and electronic appliances.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.833-836
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• 1997

Magnesium alloys are one of light weight material. Strength and stiffness of Magnesium alloys are enough to use for commercial product. Demand for strong, lightweight parts several computer and electronics have driven much of Magnesium injection molding's growth so far. And it is eighth most abundant resource on earth. In electronic device, electromagnetic interface and electrostatic discharge can affect performance. Magnesium injection molding is similar to normal plastic injection molding process. But some process condition is different. Especially injection speed and process temperature are so differs from other injection molding system. It just start for make something. But Magnesium injection molding is one of best alternate process for producing metal alloy part.

• Proceedings of the Korea Concrete Institute Conference
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• 2000.04a
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• pp.136-141
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• 2000

Concrete has been used for many years as a composite material that has excellent mechanical properties and durability for construction. However, concrete ia a poor electrical conductor, especially under dry conditions. Concrete that is excellent in both mechanical and electrical conductivity properties may have important applications in the electrical, electronic, military and construction industry (e.g for de-icing road from snow). The purpose of this investigation is to improve the electrical conductive of cement mortar preparared with graphite as filler. From the test result, as the ratio of graphite/cement increased, fluidity, fluidity and strength decreased but resistivity decreased. The resistivity of electrical conductive cement mortar is effect by water/cement ratio and water content of specimen. From this study, it is enough to assure the use of graphite as a conductive filler for electrical conducive cement mortar.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.481-485
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• 2000

A new type of compliant press-fit pin has been developed and evaluated for use packaging of electronic telecommunications equipments. Main requirements for design are defined the upper limit of pin insertion force and the lower limit of pin retention force. Upper limit of pin insertion force is set to protect the copper plate of the inner PTH wall. Lower limit of pin retention force is set to satisfy a wire-wrapping specification. Results are represented by insertion force and retention force variations according to the front angle, rear angle and material, etc.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.614-615
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• 2005

The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, roll-to-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate ($LEXAN^{(R)}$) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen,chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate ($LEXAN^{(R)}$) films and its compatibility with OLED device fabrication processes.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.620-622
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• 2005

DuPont Teijin Films (DTF) have developed a family of films engineered specifically for the flexible electronics market. $Teonex^{(R)}Q65A$ is a biaxially oriented crystalline polyester with an engineered surface and it is emerging as a competitive material for the base substrate in OLED displays and active matrix backplanes. This contribution will describe the properties of this film, its uniquely different property set compared to amorphous high performance films and discuss examples of the film in use in flexible electronic applications.