• Title/Summary/Keyword: Electronic Heating

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System Implementation for Fair Automatic Heating Operation Based on Spatial Distributing and Zonal Calorie Measuring (공간분활 및 영역열량측정에 의한 공평 자동난방운영시스템 구현)

  • Han, Sang Cheol;Ryu, Kwang Ryol
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.23 no.8
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    • pp.910-916
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    • 2019
  • This paper describes the system implementation of the heating operation based on spatial distributing and zonal calorie measuring and analyzing of houses to calculate the fair amount of the heating meterage automatically. The heating space is distributed into 4 zones, which the flow rate and calories are checked by one meter respectively. The system is composed of a heating sources, adjuster of thermostat, valve controller, PC converter and total monitering. The returning temperature in the spatial zones is measured for the heating calorie to calculate the zonal calories according to the rooms temperature. The proposed system results in error by 1% or less in comparing with the dedicated experimental equipment, and reduces energy cost by 7% from conventional system. The fair checking system will be enhanced with building energy management system in the future.

Development of Cooling System for Electronic Devices using Oscillating Capillary Tube Heat Pipe (진동세관형 히트파이프를 이용한 전자기기 냉각에 대한 연구)

  • Kim Jong-Soo;Ha Soo-Jung
    • Journal of Advanced Marine Engineering and Technology
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    • v.29 no.4
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    • pp.436-442
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    • 2005
  • Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices. In this paper, characteristics on oscillating heat pipe according to operating conditions (environment temperature, charging ratio of working fluid, inclination) based on experimental study was investigated From the experimental results $25^{\circ}C$(environment temperature) R-141b (working fluid) $40\%$ (charging ratio) was best performace at others of inclination angle and the top heating mode of OCHP performed $80\%$ efficiency of the bottom heating mode.

Magnetic Induction Soldering Process for Mounting Electronic Components on Low Heat Resistance Substrate Materials (저 내열 기판소재 전자부품 실장을 위한 자기유도 솔더링)

  • Youngdo Kim;Jungsik Choi;Min-Su Kim;Dongjin Kim;Yong-Ho Ko;Myung-Jin Chung
    • Journal of the Microelectronics and Packaging Society
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    • v.31 no.2
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    • pp.69-77
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    • 2024
  • Due to the miniaturization and multifunctionality of electronic devices, a surface mount technology in the form of molded interconnect devices (MID), which directly forms electrodes and circuits on the plastic injection parts and mounts components and parts on them, is being introduced to overcome the limitations in the mounting area of electronic components. However, when using plastic injection parts with low thermal stability, there are difficulties in mounting components through the conventional reflow process. In this study, we developed a process that utilizes induction heating, which can selectively heat specific areas or materials, to melt solder and mount components without causing any thermal damage to the plastic. We designed the shape of an induction heating Cu coil that can concentrate the magnetic flux on the area to be heated, and verified the concentration of the magnetic flux and the degree of heating on the pad part through finite element method (FEM). LEDs, capacitors, resistors, and connectors were mounted on a polycarbonate substrate using induction heating to verify the mounting process, and their functionality was confirmed. We presented the applicability of a selective heating process through magnetic induction that can overcome the limitations of the reflow method.

Effect of Radiation Heat Transfer on the Control of Temperature Gradient in the Induction Heating Furnace for Growing Single Crystals (전자기 유도가열식 단결정 성장로의 온도 구배제어에 있어 복사열 전달의 효과)

  • Park, Tae-Yong;Shin, Yun-Ji;Ha, Minh-Tan;Bae, Si-Young;Lim, Young-Soo;Jeong, Seong-Min
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.6
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    • pp.522-527
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    • 2019
  • In order to fabricate high-quality SiC substrates for power electronic devices, various single crystal growing methods were prepared. These include the physical vapor transport (PVT) and top seeded solution growth (TSSG) methods. All the suggested SiC growth methods generally use induction-heating furnaces. The temperature distribution in this system can be easily adjusted by changing the hot-zone design. Moreover, precise temperature control in the induction-heating furnace is favorably required to grow a high-quality crystal. Therefore, in this study, we analyzed the heat transfer in these furnaces to grow SiC crystals. As the growth temperature of SiC crystals is very high, we evaluated the effect of radiation heat transfer on the temperature distribution in induction-heating furnaces. Based on our simulation results, a heat transfer strategy that controls the radiation heat transfer was suggested to obtain the optimal temperature distribution in the PVT and TSSG methods.

Degradation Mechanism of MoxW1-xSi2 Heating Elements Fabricated by SHS Process (SHS 공정에 의해 제조된 MoxW1-xSi2 발열체의 열화메커니즘)

  • Lee, Dong-Won;Lee, Sang-Hun;Kim, Yong-Nam;Lee, Sung-Chul;Koo, Sang-Mo;Oh, Jong-Min
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.10
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    • pp.631-636
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    • 2017
  • The degradation mechanism of $Mo_xW_{1-x}Si_2$ ultrahigh-temperature heating elements fabricated by self-propagating high-temperature synthesiswas investigated. The $Mo_xW_{1-x}Si_2$ specimens (with and without post-annealing) were subjected to ADTs (accelerated degradation tests) at temperatures up to $1,700^{\circ}C$ at heating rates of 3, 4, 5, 7, and $14^{\circ}C/min$. The surface loads of all the specimen heaters were increased with the increase in the target temperature. For the $Mo_xW_{1-x}Si_2$ specimens without annealing, many pores and secondary-phase particles were observed in the microstructure; the surface load increased to $23.9W/cm^2$ at $1,700^{\circ}C$, while the bending strength drastically reduced to 242 MPa. In contrast, the $Mo_xW_{1-x}Si_2$ specimens after post-annealing retained $single-Mo_xW_{1-x}Si_2$ phases and showed superior durability after the ADT. Consequently, it is thought that the formation of microcracks and coarse secondary phases during the ADT are the main causes for the degraded performance of the $Mo_xW_{1-x}Si_2$ heating elements without post-annealing.

A Study on the Characteristics of Variable Optical Attenuators Using Heat Insulating Structures (열절연 구조를 이용한 가변광감쇠기의 특성에 관한 연구)

  • Yang Dong-Pyeong;Kim Jeong-Geun
    • Proceedings of the IEEK Conference
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    • 2004.06a
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    • pp.321-324
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    • 2004
  • In this paper, attenuation characteristics of silica-based variable optical attenuator (VOA) with heat insulating structures are investigated by variations of structural parameters and heating power at wavelength 1.55${\mu}m$. The characteristics of power dissipation and attenuation at this VOA was optimized in terms of heating insulating width, under-cladding height and over-cladding height. The optimized maximum attenuation of this VOA was achieved about 31dB at heating power 150mW.

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Bonding Technology for PZT and Connection board using a High Frequency Heating Machine. (고주파 가열기를 이용한 PZT와 연결기판의 접합기술)

  • Lee, Jong-Hyun;Choi, Sie-Young
    • Journal of Sensor Science and Technology
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    • v.8 no.1
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    • pp.89-94
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    • 1999
  • In this study, a new technology to bond the PZT with connection board, which is a core technology for the fabrication of medical micro high frequency sensors, was developed. Two technologies were adopted. One is bonding of In using thermal heating, he other is bonding of Pb using a high frequency heating machine. In case of thermal eating, bonding was failed because of the contaminations of In surface. But, when using high frequency healing machine, we developed good bonding characteristics at various experimental conditions and thickness of the electrode material.

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Effects of Annealing Temperature on Properties of Al-Doped ZnO Thin Films prepared by Sol-Gel Dip-Coating

  • Jun, Min-Chul;Koh, Jung-Hyuk
    • Journal of Electrical Engineering and Technology
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    • v.8 no.1
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    • pp.163-167
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    • 2013
  • Aluminum doped zinc oxide (AZO) thin films have been prepared on the glass substrates (Corning 1737) by sol-gel dip-coating method employing zinc acetate and aluminum chloride hexahydrate for the transparent conducting oxide (TCO) applications. 1 at% Al was doped to the ZnO thin films. The effects of post-heating temperature on the crystallization, optical and electrical properties of the AZO films have been investigated. Experimental results showed that post-heating temperature affected the microstructure, electrical resistance, and optical transmittance of the AZO films. From the X-ray diffraction analysis, all films have hexagonal wurtzite crystal structure. Optical transmittance spectra of the AZO films exhibited transmittance higher than about 80% within the visible wavelength region and the optical direct band gap ($E_g$) of these films was increased with increasing post-heating temperature. A minimum resistivity of $2.5{\times}10^{-3}{\Omega}cm$ was observed at $650^{\circ}C$.

Condition Monitoring Technique for Heating Cables by Detecting Discharge Signal (방전신호 검출에 의한 히팅 케이블의 상태감시기술)

  • Kim, Dong-Eon;Kim, Nam-Hoon;Lim, Seung-Hyun;Kil, Gyung-Suk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.34 no.2
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    • pp.136-141
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    • 2021
  • Heating cables, widely used in office buildings, factories, streets and railways, deteriorate in electrical insulation during operation. The insulation deterioration of heating cables leads to electric discharges that can cause electrical fires. With this background, this paper dealt with a condition monitoring technique for heating cables by the analysis of discharge signals to prevent electrical fires. Insulation deterioration was simulated using an arc generator specified in UL1699 under AC operation, and the characteristic and propagation of discharge signals were analyzed on a 100 meter-long heating cable. Discharge signals produced by insulation deterioration were detected as a voltage pulse because they are as small as a few mV and they are attenuated through propagation path. The frequency spectrum of discharge signals mainly existed in the range from 70 kHz to 110 kHz, and the maximum attenuation of the signal was 84.8% at 100 meters away from the discharge point. Based on the experimental results, a monitoring device, which is composed of a high pass filter with the cut-off frequency of 70 kHz, a comparator, a wave shaper and a microprocessor, was designed and fabricated. Also, an algorithm was designed to discriminate the discharge signal in the presence of noise, compared with the pulse repetition period and the number of pulse counts per 100ms. In the experiment, the result showed that the prototype monitoring device could detect and discriminate the discharge signals produced at every discharge point on a heating cable.

EO Performances of Flexible TN-LCD using in-situ Ultraviolet Exposure during Imidization of Polyimide on the Polymer Film

  • Moon, Hyun-Chan;Hwang, Jeoung-Yeon;Lee, Whee-Won;Seo, Dae-Shik
    • Transactions on Electrical and Electronic Materials
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    • v.6 no.3
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    • pp.106-109
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    • 2005
  • We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with in-situ photoalignment method on polyimide (PI) surfaces using polymer films. Especially, we studied in-situ photoalignment changing heating temperature from $50^{\circ}C\;to\;120^{\circ}C$ on the polymer film. The LC aligning capabilities and pretilt angle on the polymer substrates were better than those on the glass substrate using in-situ photoalignment method. It is considered that this increase in pretilt angle may be attributed to the roughness of the micro-groove substrate induced by the in-situ photoalignment. As temperature of heated subtrate and UV exposure time increase, pretilt angle of the cell used polymer film increased. It is considered that the heating temperature of substrate is attributed to generate pretilt angle. Also, electro-optical performances of the in-situ photoaligned TN cell using the polymer substrate are almost the same as that of the TN cell using the glass substrate.