• Title/Summary/Keyword: Electron diffusion

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The Breakdown Phenomena of N2 gas by RF Electric Field (라디오 주파수전계에 의한 질소가스의 브레이크 다운 현상)

  • 황기웅;노영수
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.35 no.5
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    • pp.199-204
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    • 1986
  • The breakdown phenomena of N2 gas by 13.56MHz electric field are very different from those under steady field. In this paper we analyzed the breakdown phenomena by using electron distribution function and diffusion equation. The second-order differential equation derived from the Boltzmann equation is solved for the electron distribution function. The ionization rate and diffusion coefficient are calculated using kinetic theory formulas. The breakdown condition is that the number of electrons produced by ionization equal the number diffusing to the walls of the discharge chamber. Theses theoretical breakdown electric fields are calculated by the computer and compared with the experimental values.

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A study on the relationships between plasma parameters and magnetic field (플라즈마 파라메타와 자계의 상관관계에 관한 연구)

  • 김두환;장윤석;조정수;박정후
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.45 no.3
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    • pp.426-431
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    • 1996
  • It is well known that the understanding of the complex mechanism of magnetoplasma is closely related with understanding of the collective behavior of discharge plasma parameters such as the cathode-sheath potential, cathode-sheath thickness, electron temperature, electron density, and ambipolar diffusion. In this paper, some of the relationships between these plasma parameters and magnetic field is investigated experimentally with a Langmuir probe in the magnetoplasma generated by D.C diode system. It is found that when magnetic field is increased, cathode-sheath potential, cathode-sheath thickness, and ambipolar diffusion are decreased. In addition, peak ion density obtained as a parameter of ionic signal voltage by Faraday cup method is independent of magnetic field. (author). 9 refs., 11 figs.,1 tab.

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Mechanical and metallurgical properties of diffusion bonded AA2024 Al and AZ31B Mg

  • Mahendran, G.;Balasubramanian, V.;Senthilvelan, T.
    • Advances in materials Research
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    • v.1 no.2
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    • pp.147-160
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    • 2012
  • In the present study, diffusion bonding was carried out between AZ31B magnesium and AA2024 aluminium in the temperature range of $405^{\circ}C$ to $475^{\circ}C$ for 15 min to 85 min and 5MPa to 20 MPa uniaxial loads was applied. Interface quality of the joints was assessed by microhardness and shear testing. Also, the bonding interfaces were analyzed by means of optical microscopy, scanning electron microscopy, energy dispersive spectrometer and XRD. The maximum bonding and shear strength was obtained at $440^{\circ}C$, 12 MPa and 70 min. The maximum hardness values were obtained from the area next to the interface in magnesium side of the joint. The hardness values were found to decrease with increasing distance from the interface in magnesium side while it remained constant in aluminium side. It was seen that the diffusion transition zone near the interface consists of various phases of $MgAl_2O_4$, $Mg_2SiO_4$ and $Al_2SiO_5$.

Programming characteristics of single-poly EEPROM (Single-poly EEPROM 의 프로그램 특성)

  • 한재천;나기열;이성철;김영석
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.2
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    • pp.131-139
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    • 1996
  • Inthis apper wa analyzed the channel-hot-electron programming characteristics of the single-poly EEPROM with different control gate and drain structures. The single-poly EEPROM uses the p$^{+}$/n$^{+}$-diffusion in the n-well as a control gate instead of the second poly-silicon. The program and erase characteristics of the single-poly EEPROM were verified using the two-dimensional device simulator, MEDICI. The single-poly EEPROM was fabricated using 0.8$\mu$m ASIC CMOS process, and its CHE programming characteristics were measured using HP4155 parameteric analyzer and HP8110 pulse gnerator. Especially we investigated the CHE programming characteristics of the single-poly EEPROM with the p$^{+}$-diffusion or n$^{+}$-diffusion in the n-well as a control gate and the LDD or single-drain structure. The single-poly EEPROM with p$^{+}$-diffusion in the n-well as a control gate and single-drain structure was programmed to about VT$\thickapprox$5V with VDS=6V, VCG=12V(1ms pulse width).th).

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Improvement of ESD Protection Performance of High Voltage Operating EDNMOS Device with Double Polarity Source (DPS) Structure (DPS(Double Polarity Source) 구조를 갖는 고전압 동작용 EDNMOS 소자의 정전기 보호 성능 개선)

  • Seo, Yong-Jin;Yang, Jun-Won
    • Journal of Satellite, Information and Communications
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    • v.9 no.2
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    • pp.12-17
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    • 2014
  • In this paper, modified EDNMOS device with DPS (double polarity source) structure are suggested to realize stable and robust ESD (electrostatic discharge) protection performance of high voltage operating microchip. This DPS structure inserts the P+ diffusion layer on N+ source side, which in intended to block lateral extension of the electron rich region from N+ source side. Based on our simulation results, the inserted P+ diffusion layer effectively prevents the formation of deep electron channeling induced by high electron injection. As a result, our proposed DPS_EDNMOS devices could overcome the double snapback effect of conventional Std_EDNMOS device.

The Measurement of Junction Depth by Scanning Electron Microscopy (전자현미경에 의한 확산 깊이 측정)

  • 허창우
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2004.05b
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    • pp.623-626
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    • 2004
  • The purpose of this paper is to determinate and to confirm p-n junction depth with nondestructive method by using electron beam. By measuring the critical short circuit current on the p-n junction which induced by electron beam and calculating generation range, the diffusion depth can be obtained. It ran be seen that values destructively measured by constant angle lapping and nondestructively by this study almost concur. As this result, it is purposed that diffusion depth of p-n junction can be easily measured by non-destruction. And this nondestructive method ran be recommended highly to the industrial analysis.

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A study on the electron transport coefficients using monte carlo method in argon gas (몬테칼로법을 이용한 Ar기체의 전자수송계수에 관한 연구)

  • 하성철;전병훈
    • Electrical & Electronic Materials
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    • v.8 no.6
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    • pp.685-692
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    • 1995
  • The electron transport coefficients in argon gas is studied over the range of E/N values from 85 to 566 Td by the Monte Carlo method considering the latest cross section data. The result of the Monte Carlo method analysis shows that the value of the electron transport coefficients such as the electron drift velocity, the ratio of the longitudinal and transverse diffusion coefficients to the mobility. It is also found that the electron transport coefficients calculated by the two-term approximation analysis agree well with those by Monte Carlo calculation. The electron energy distributions function were analysed in argon at E/N=283, and 566 Td for a case of the equilibrium region in the mean electron energy. A momentum transfer cross section for the argon atom which was consistent with both of the present electron transport coefficients was derived over the range of mean electron energy from 10.3 to 14.5 eV, also suggested as a set of electron cross section for argon atom. The validity of the results obtained has been confirmed by a Monte Carlo simulation method.

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Electron Collision Cross Section of Electron Transport Coefficients in Hydrogen-Argon Mixtures ($H_2$ + Ar 혼합기체의 전자수송계수에서의 전자충돌 단면적)

  • Jo, Doo-Yong;Phan, Thi Lan;Jeon, Byung-Hoon
    • Proceedings of the KIEE Conference
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    • 2011.07a
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    • pp.1540-1541
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    • 2011
  • We calculated the electron transport coefficients in $H_2$+Ar gas calculated E/N values 0.01 ~ 1 Td by the Boltzmann equation method. This study gained the values of the electron swarm parameters such as the electron drift velocity and the transverse diffusion coefficients for $H_2$+Ar gas at a range of E/N. The transport coefficient W and Dt/u have been calculated in mixtures of 0.5% and 4% hydrogen in argon. All values were made at 293 K.

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A study on the electron transport coefficients in $GeH_4$ gas ($GeH_4$기체의 전자수송계수에 관한 연구)

  • Ryu, Sun-Mi;Jeon, Byung-Hoon
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1404_1405
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    • 2009
  • For quantitative understanding of gas discharge phenomena, we should know electron collision cross section. $GeH_4$ is used in many applications with $Si_2H_6$ gas, such as amorphous alloy, a thin film of silicon and solar cell. Therefore, we understand the electron transport characteristics and analysed the electron transport coefficients, the electron drift velocity W, the longitudinal and transverse diffusion coefficient $ND_L$ and $ND_T$, and the ionization coefficient $\alpha$/N in $GeH_4$gas over the E/N range from 0.01 to 1000 Td by two-term approximation of the Boltzmann equation.

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Analysis of Electron Transport Coefficients in Binary Mixtures of TEOS Gas with Kr, Xe, He and Ne Gases for Using in Plasma Assisted Thin-film Deposition

  • Tuan, Do Anh
    • Journal of Electrical Engineering and Technology
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    • v.11 no.2
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    • pp.455-462
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    • 2016
  • The electron transport coefficients in not only pure atoms and molecules but also in the binary gas mixtures are necessary, especially on understanding quantitatively plasma phenomena and ionized gases. Electron transport coefficients (electron drift velocity, density-normalized longitudinal diffusion coefficient, and density-normalized effective ionization coefficient) in binary mixtures of TEOS gas with buffer gases such as Kr, Xe, He, and Ne gases, therefore, was analyzed and calculated by a two-term approximation of the Boltzmann equation in the E/N range (ratio of the electric field E to the neutral number density N) of 0.1 - 1000 Td (1 Td = 10−17 V.cm2). These binary gas mixtures can be considered to use as the silicon sources in many industrial applications depending on mixture ratio and particular application of gas, especially on plasma assisted thin-film deposition.