• Transactions of the Korean hydrogen and new energy society
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• v.4 no.2
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• pp.23-28
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• 1993

The $(LM)Ni_{4.5}Co_{0.1}Mn_{0.2}Al_{0.2}$ hydrogen storage alloy powders were conducted 25wt% electroless copper plating in an acidic bath. For the preparation of a hydride electrodes, the copper coated alloy powder was mixed with Si-sealant(organosilicon) and compacted with $6t/cm^2$ at room temperature. The electrode characteristics were examined through electrochemical measurements in a half cell. As a sealant contents increased, the initial discharge capacity of si-sealant bounded electrode was lower and the activation rate in high current density was slower. For extended cycles, however, the electrodes with the Si-sealant were superior in a high rate discharge and useful range of temperature over the sealant-free electrode. In addition, the cycle life increased with increasing the amount of Si-sealant added. It can be suggested from the results that the Si-sealant as a binder could be applied to the preparation of the metal hydride electrode.

• Journal of the Korean institute of surface engineering
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• v.28 no.4
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• pp.199-206
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• 1995

A kinetic study on the electrodeposition of Ni-Zn-P ternary alloys onto a steel in chloride solutions was carried out using a rotating disc electrode. The coatings were characterized using SEM/EPMA and A. A. analysis. The results showed that the plating rates of three components were increased with applied potential, disc rotating speed and temperature. The activation energies of Ni, Zn and P of the coatings were 6.1, 5.1 and 8.0 kcal/mole respectively. Therefore, the deposition rates were controlled partly by surface electrochemical reaction and partly by mass transport. As the potential, temperature of bath and rotating speed of cathode disc were raised, the vol. % ratios of Ni and P of coating layer were increased but that of Zn decreased. The effect of coating parameters on the surface morphology was also examined.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.76-77
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• 2012

전기 도금 시스템에서 전산모사 해석을 이용하여 도금층 두께를 정확히 예측하기 위해서 음극 표면의 확산층이 고려된 도금 Simulator를 개발하였다. 특정 형상의 경우 도금액 교반이 원활하지 않아 불균일한 도금이 이루어지는 경우가 있기 때문에 이를 예측하기 위해서는 교반 영향을 나타내는 확산층을 고려해야 한다. 유동해석을 통해 도금액 교반 조건 및 형상에 따른 음극 표면의 유속을 결정하고 유속별 도금액 DB를 구성하여 음극의 위치별 분극곡선을 차별화하여 유동 조건에 따른 확산층 변화를 고려하는 형태로 구현하였다. 유속별 도금액 DB는 실험 데이터 및 해석 데이터를 종합하여 구축하였다. 교반의 영향을 많이 받는 시스템을 대상으로 개발된 Simulator 결과의 타당성을 검증하였고 확산층 적용에 따른 도금 결과의 차이를 확인하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.168-168
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• 2016

최근 크로메이트 피막의 대체로서 실란 커플링제를 사용한 화성처리가 주목되고 있다. 실란 커플링제는 $R^{\prime}-(CH_2)_n-Si(OR)_3$로 나타내며 OR은 가수분해 가능한 메톡시기, 에톡시기 등의 알콕시기이다. OR기는 가수분해하여 반응성이 높은 시라놀기(-SiOH)를 생성하여 금속표면에 흡착하기 쉽다. 이후, 건조할 때 탈수 축합하여 공유결합이 가능하다. R'는 탄화수소에 한정되지 않고 성질이 다른 원소의 관능기를 나타내며 아미노(amino)기, 글리시딜(glycidyl)기, 멜캅토(melcapto)기, 비닐(vinyl)기를 들 수 있다. 실란 커플링제 가운데 아미노기를 갖는 실란 커플링제는 아연도금 강판을 포함한 다양한 금속의 내식성을 향상시킬 수 있는 화합물의 하나이다. 본 연구에서는 아미노기를 함유한 실란 커플링제에 인산 수용액을 도포하여 수세하지 않고 건조하여 피막을 형성시켰다. 또 부식거동 조사를 목적으로 아미노기를 함유한 실란 커플링제를 사용하여 초산첨가의 경우와 비교하였다.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.314-324
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• 1996

Scanning probe microscopes (SPMs) such as the scanning tunneling microscope (STM) and the atomic force microscope (AFM) were used for surface modification tools at the nanometer scale. Material surfaces, i. e., titanium, hydrogen-terminated silicon and trimethylsilyl organosilane monolayer on silicon, were locally oxidized with the best lateral spatial resolution of 20nm. The principle behind this proximal probe oxidation method is scanning probe anodization, that is, the SPM tip-sample junction connected through a water column acting as a minute electrochemical cell. An SPM-nanolithogrphy process was demonstrated using the organosilane monolayer as a resist. Area-selective chemical modifications, i. e., etching, electroless plating with gold, monolayer deposition and immobilization of latex nanoparticles; were achieved in nano-scale resolution. The area-selectivity was based on the differences in chemical properties between the SPM-modified and unmodified regions.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2008.11a
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• pp.155-157
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• 2008

High velocity oxy-fuel (HVOF) thermal spraying coating has been used widely throughout the last 60 years mainly in defense, aerospace, and power plants. Recently this coating technique is considered as a promising candidate for the replacement of the traditional electrolytic hard chrome plating (EHC) which pollutes the environment and causes lung cancer by toxic hexa-valent $Cr^{6+}$. In this study, two kinds of cermet coatings, WC-CoCr and WC-CrC-Ni, are formed by HVOF spraying. The corrosion and electrochemical properties are evaluated by polarization tests in 3.5 wt% solutions.

• Journal of the Korean institute of surface engineering
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• v.27 no.4
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• pp.223-233
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• 1994

It is well known that compositionally modulated Cu-Ni alloy can be produced by an electrochemical method in Ni sulfate solution containing trace amount of Cu. a mathematical model is presented to describe the current distribution and weight percent of Cu in Ni layer on the rotating disk electrode. The model includes convective-diffusion equation, the Laplace's equation and various overpotentials, and is solved numerically. The thickness of Cu layer is almost uniform whereas the thickness of Ni layer as well as the Ni/Cu weight ratio are increased approaching to the edge of the disk. These results agree well with the experimental values. The ohmic potential drop is suggested as a major cause of a nonuniformity in Ni layer. The optimum plating condition for the fabrication of susperlattice is proposed based on the results of this study.

• Journal of the Korean institute of surface engineering
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• v.45 no.4
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• pp.162-167
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• 2012

Ni-P/C multi-layer was synthesized by electroless plating and paste coating for better corrosion and surface conductance as a metallic bipolar plate. The Ni-P layer could be synthesized with the range of 2.6~22.4 at.% P contents and it's surface morphology and corrosion resistance depend on content of P. Corrosion resistance of the Ni-P layer in sulfuric acid by electrochemical test is similar with pure Ni. Surface resistance of pure Ni after corrosion was increased about 8% compared to pure Ni. On the other hand, that of the Ni-P/C composite with 20% carbon content was increased only 1%.

• The Journal of Korean Academy of Prosthodontics
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• v.44 no.5
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• pp.628-641
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• 2006

Statement of problem: Dental magnetic materials have been applied to removable prosthetic appliances, maxillofacial prostheses, obturator and dental implant but they still have some problems such as low corrosion resistance in oral environments. Purpose: To increase the corrosion resistance of dental magnetic materials, surfaces of Sm-Co and Nd-Fe-B based magnetic materials were plated with TiN and sealed with stainless steels. Materials and methods : Surfaces of Sm-Co and Nd-Fe-B based magnetic materials were plated with TiN and sealed with stainless steels, and then three kinds of electrochemical corrosion test were performed in 0.9% NaCl solution; potentiodynamic, potentiostatic, and electrochemical impedance test. From this study, corrosion behavior, amount of elements released, mean average surface roughness values, the changing of retention force, and magnetic force values were measured comparing with control group of non-coated magnetic materials. Results: The values of surface roughness of TiN coated Sm-Co and TiN coated Nd-Fe-B based magnetic materials were lower than those of non coated Sm-Co and Nd-Fe-B alloy. From results of potentiodynamic test, the passive current density of TiN coated Sm-Co alloy were smaller than those of TiN coated Nd-Fe-B alloy and non coated alloys in 0.9% NaCl solution. From results of potentiostatic and electrochemical impedance test, the surface stability of the TiN coated Sm-Co alloy was more drastically increased than that of the TiN coated Nd-Fe-B alloy and non-coated alloy. The retention and magnetic force after and before corrosion test did not change in the case of TiN coated magnetic alloy sealed with stainless steel. Conclusion: It is considered that the corrosion problem and improvement for surface stability of dental magnetic materials could be solved by ion plating with TiN on the surface of dental magnetic materials and by sealing with stainless steels.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.55-59
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• 2012

Defects such as voids or seams are frequently found in TSV via filling process. To achieve defect-free copper via filling, organic additives such as suppressor, accelerator and leveler were necessary in a copper plating bath. However, by-products stemming from the breakdown of these organic additives reduce the lifetime of the devices and plating solutions. In this research, the effects of levelers on copper electrodeposition were investigated without suppressor and accelerator to lower the concentration of additives. Threelevelers(janus green B, methylene violet, diazine black) were investigated to study the effects of levelers on copper deposition. Electrochemical behaviors of these levelers were different in terms of deposition rate. Filling performances were analyzed by cross sectional images and its characteristics were different with variations of levelers.