Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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The Effects of Levelers on Electrodeposition of Copper in TSV Filling

TSV 필링 공정에서 평활제가 구리 비아필링에 미치는 영향 연구

  • Jung, Myung-Won (Dept. of Materials Science and Engineering, Hongik University) ;
  • Kim, Ki-Tae (Dept. of Materials Science and Engineering, Hongik University) ;
  • Koo, Yeon-Soo (Dept. of Manufacture and Metallurgical Engineering, Gwangyang Health College) ;
  • Lee, Jae-Ho (Dept. of Materials Science and Engineering, Hongik University)
  • 정명원 (홍익대학교 신소재공학과) ;
  • 김기태 (홍익대학교 신소재공학과) ;
  • 구연수 (광양보건대학 제철금속과) ;
  • 이재호 (홍익대학교 신소재공학과)
  • Received : 2012.06.13
  • Accepted : 2012.06.25
  • Published : 2012.06.30
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Abstract

Defects such as voids or seams are frequently found in TSV via filling process. To achieve defect-free copper via filling, organic additives such as suppressor, accelerator and leveler were necessary in a copper plating bath. However, by-products stemming from the breakdown of these organic additives reduce the lifetime of the devices and plating solutions. In this research, the effects of levelers on copper electrodeposition were investigated without suppressor and accelerator to lower the concentration of additives. Threelevelers(janus green B, methylene violet, diazine black) were investigated to study the effects of levelers on copper deposition. Electrochemical behaviors of these levelers were different in terms of deposition rate. Filling performances were analyzed by cross sectional images and its characteristics were different with variations of levelers.

TSV 비아필링 과정이 진행되는 동안 내부에 void나 seam과 같은 결함이 빈번하게 발견되고 있다. 결함 없는 구리 비아필링을 위해서는 용액 내에 가속제, 억제제, 평활제 등의 유기물 첨가제가 필요하다. 공정과정중 유기물 첨가제의 분해로 인한 부산물로부터 기인한 오염은 디바이스의 신뢰도나 용액의 수명을 감소시키는 요인이 된다. 본 연구에서는 첨가제의 사용량을 줄이기 위하여 가속제와 억제제를 사용하지 않고 평활제만을 이용한 구리 비아필링에 관한 연구를 진행하였다. 세가지 종류의 첨가제(janus green B, methylene violet, diazine black)를 이용한 구리 전착에 관한 연구를 수행하였다. 각각의 첨가제에 따른 전기화학적 거동을 분석한 결과 도금속도적 측면에서 차이를 나타내는 것을 확인할 수 있었다. 비아필링 진행 후 단면을 분석하여 각각의 평활제가 비아필링에 미치는 영향을 확인하였으며, 그 특성은 다르게 나타나는 것을 확인할 수 있었다.

Keywords

References

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