• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2002.05a
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• pp.37-37
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• 2002

Diamoncl/Mo/Ni multi-layers on SKH-51 steel substrate was prepared to improve the abrasive wear resistance of a tool and die by a commercial chemical vapor deposition unit and electro-plating. The diamond after 7 hour deposition had cuba-octahedral structure with 2~5$\mu\textrm{m}$ grains. The existence of non-ferrous metals such as chromium, nickel and molybdenum between diamond and SKH-51 substrate results in forming higher quality of diamond layer by retarding carbon diffusion in the diamond layer during deposition, and also improving hardness and wear resistance. Surface cracks on the film was sometimes observed by the difference of by the thermal expansion coefficients between the steel substrate and the deposited layers during cooling.

• Polymer(Korea)
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• v.30 no.4
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• pp.332-337
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• 2006

Monodisperse polymer particles were prepared via one-step seeded polymerization using PMMA seed particles and HDDA (or EGDMA) as crosslinking monomer. For the study, the effects of 1) the ratio of the absorbed monomer or monomer mixture to the seed polymer particles (swelling ratio), 2) the ratio of EGDMA in absorbed monomer mixture, 3) the dosage of initiator, and 4) electro less Ni plating on the variation of mechanical properties of monodisperse polymer particles, such as recovery rate, K-values, breaking strength and breaking displacement, were investigated by using MCT (micro compression test). It was observed that monomer swelling ratio influenced only breaking strength, but EGDMA ratio in monomer mixture, dosage of initiator and electroless Ni plating affected both K-values and breaking strength.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.1
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• pp.21-26
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• 2013

This study presents new analysis method to predict bending behavior of packaging substrate structure by comparing finite element method simulation and measured curvature using 3D scanner. Packaging substrate is easily bent and deflected while undergoing various processes such as curing of prepreg and copper pattern plating. We prepare specimens with various conditions and measure contours of each specimen and compute the residual stresses on deposited films using analytical solution to find the principle of bending. Core and prepreg in packaging substrate are made up of resin and bundles of fiber which exist orthogonally each other. Anisotropic material properties cause peculiar bending behavior of packaging substrate. We simulate the bending deflection with finite element method and verify the simulated deflection with measured data. The plating stress of electrodeposited copper is about 58 MPa. The curing stresses of solder resist and prepreg are about 13 MPa and 6.4 MPa respectively in room temperature.

• KSBB Journal
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• v.5 no.2
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• pp.175-182
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• 1990

Protoplasts, isolated from leaf of N. tabacum NR-/SR+ and N. glottnosa were electrofused and divided with a plating efficiency of 30∼35% in AAPI 9M medium. Green callus lines were selected in protoplast-derived colonies on MSNO3 selection medium with 1.2mg/ml streptomycin sulfate on the basis of nitrate reductase proficiency and streptomycin resistance. Four putative hybrid plant lines regenerated from the green callus lines had intermediate morphology between that of parents with respect to floral shape, corolla length and ovate leaf blade. Zymograms of leaf peroxidase and esterase from these putative hybrid plant lines showed isozyme profiles derived from both parents and also, they exhibited additional and lost bands. Cytological analysis of two putative hybrid plant lines gave chromosome counts of 2n=66 in L22 and 2n=54 in L44 which were less than the expected number of N. tabacum(2n=48) and N. glutinosa(2n=24).

• Resources Recycling
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• v.24 no.2
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• pp.62-68
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• 2015

The high pure tin production was conducted from crude-tin containing waste solder by electro-refining process. The electro-refining process maintained at 0.2V produced tin with purity of 99.98%, whereas a little increase of voltage to 0.3 V resulted tin purity of 99.92%. The high pure tin of 3N in the present process was produced by fixing the voltage at 0.3V. Considering the high pure tin production, the current density was maintained within $100-120A/m^2$ with current efficiency of 94%. Addition of sulfuric acid of 20 ~ 25 g/L to the electrolyte solution was performed in order to keep Pb (lead) concentration below 100 mg/L in the final tin product. The anode slime generated during electro refining process was analyzed by X-ray diffraction (XRD) study to understand the phases of impurities in it. It detected the presence of Cu and Ag in the slime as in the form of $Cu_6Sn_5$, $Ag_3Sn$, whereas Pb occurred as $PbSO_4$ compound.

• Polymer(Korea)
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• v.30 no.6
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• pp.471-477
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• 2006

Ion exchange metal composite(IPMC) has toughness equivalent to the range of human's muscle, transformation-actuation force by relatively low voltage and the fast response time. Thus, as a new method for preparing thicker IPMC, the solution casting method to make the films of various thicknesses out of liquid nation was attempted in this study. To reduce the surface resistance of electrode, the first plated electrode prepared by Oguro method was replated with Au and Ir using ion beam assisted deposition(IBAD). The microstructures of electrode surfaces before and after IBAD plating were investigated using SEM. The change of water and ion-conductivity in IPMC were measured under applied voltage. The displacement and driving force of IPMCs with various thicknesses were measured to evaluate the driving properties.

• Journal of Powder Materials
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• v.13 no.1 s.54
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• pp.18-24
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• 2006

The brazing adhesion properties of Ag coated W-Ag electric contact on the Cu substrate have been investigated in therms of microstructure, phase equilibrium and adhesion strength. Precoating of Ag layer ($3{\mu}m$ in thickness) on the $W-40\%Ag$ contact material was done by electro-plating method. Subsequently the brazing treatment was conducted by inserting BCuP-5 filler metal (Ag-Cu-P alloy) layer between Ag coated W-Ag and Cu substrate and annealing at $710^{\circ}C$ in $H_2$ atmosphere. The optimum brazing temperature of $710^{\circ}C$ was semi-empirically calculated on the basis of the Cu atomic diffusion profile in Ag layer of commercial electric contact produced by the same brazing process. As a mechanical test of the electric contact after brazing treatment the adhesion strength between the electric contact and Cu substrate was measured using Instron. The microstructure and phase equilibrium study revealed that the sound interlayer structure was formed by relatively low brazing treatment at $710^{\circ}C$. Thin Ag electro-plated layer precoated on the electric contact ($3{\mu}m$ in thickness) is thought to be enough for high adhesion strength arid sound microstructure in interface layer.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.2102-2104
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• 2004

In this study, sheathless electrospray from PDMS/glass microchips with conducting metal emitter tip is described. A chip-based capillary electrophoresis/mass spectrometry (CE/MS) system has advantages of the CE separation and on-line electrospray detection of peptide solution. We have fabricated a new electrospray ionization(ESI) device composed of the metal emitter tip and CE separation channel monolithically in a glass microchip. The separation channel and metal emitter tip are fabricated using a glass wet etching and gold electro plating process, respectively. The fabricated micro electrospray chip was tested by spraying peptide sample for mass spectrometric analysis. Singlely-charged peak and doublely-charged peak of peptide were detected and further MS/MS fragmentation was performed in each peak. Direct comparisons with conventional glass or fused silica emitters showed very similar performance with respect to signal strength and stability.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.11
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• pp.91-99
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• 1998

A 5Gbps LiNbO$_3$ optical phase modulator was designed, packaged and it's properties were characterized for optical communications. The APE(annealed proton exchange) method was employed for the optical waveguide and the electrode of ACPS (asymmetric coplanar strip) type was formed by electro-plating on LiNbO$_3$ for applying microwave signal with a dimension of width 18${\mu}{\textrm}{m}$, gap 9${\mu}{\textrm}{m}$ and length 50mm. The fabricated single-moded modulator operated at a 1550nm wavelength exhibits its modulation bandwidth, insertion loss and driving voltage of 7㎓, 3.0dB and 6V, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.9
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• pp.749-755
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• 2007

Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.