DOI QR코드

DOI QR Code

Produce of High Purity Tin from Spent Solder by Electro Refining

폐 솔더 잉곳으로부터 전해정련에 의한 고순도 주석 생산

  • Lee, Ki-Woong (Research & Development Centre, Sungeel Hi-Tech Ltd.) ;
  • Kim, Hong-In (Research & Development Centre, Sungeel Hi-Tech Ltd.) ;
  • Ahn, Hyo-Jin (Research & Development Centre, Sungeel Hi-Tech Ltd.) ;
  • Ahn, Jae-Woo (Dept. of Materials Sci. & Eng. Daejin University) ;
  • Son, Seong-Ho (Heat Treatment & Plating Technology Service Center. Korean Institute of Industrial Technology)
  • 이기웅 (성일하이텍 부설연구소) ;
  • 김홍인 (성일하이텍 부설연구소) ;
  • 안효진 (성일하이텍 부설연구소) ;
  • 안재우 (대진대학교 신소재공학과) ;
  • 손성호 (한국생산기술연구원 표면처리연구실용화그룹)
  • Received : 2015.03.13
  • Accepted : 2015.04.17
  • Published : 2015.04.30

Abstract

The high pure tin production was conducted from crude-tin containing waste solder by electro-refining process. The electro-refining process maintained at 0.2V produced tin with purity of 99.98%, whereas a little increase of voltage to 0.3 V resulted tin purity of 99.92%. The high pure tin of 3N in the present process was produced by fixing the voltage at 0.3V. Considering the high pure tin production, the current density was maintained within $100-120A/m^2$ with current efficiency of 94%. Addition of sulfuric acid of 20 ~ 25 g/L to the electrolyte solution was performed in order to keep Pb (lead) concentration below 100 mg/L in the final tin product. The anode slime generated during electro refining process was analyzed by X-ray diffraction (XRD) study to understand the phases of impurities in it. It detected the presence of Cu and Ag in the slime as in the form of $Cu_6Sn_5$, $Ag_3Sn$, whereas Pb occurred as $PbSO_4$ compound.

폐 솔더로부터 제조된 조주석을 전해 정련을 통하여 고순도 주석으로 제조하기 위한 연구를 수행하였다. 주석 전해정련 시 인가 전압이 0.2V일 때 99.98%의 주석이 얻어지며 0.3V로 생산 시 99.92%로 3N 이상의 주석이 얻어진다. 생산량과 주석의 순도를 고려한 전류밀도는 $100{\sim}120A/m^2$이며 이때 전류효율은 94% 이상이었다. 전해액중에 황산이 20~25g/L로 유지될 경우 생산된 전해주석에서 납이 100ppm 이하로 포함됨을 알 수 있었다. 슬라임의 XRD 분석결과 양극에 포함된 Cu, Ag 등은 $Cu_6Sn_5$, $Ag_3Sn$등의 합금상으로 분석되었으며 Pb의 경우는 $PbSO_4$의 화합물 형태로 슬라임을 형성하는 것을 알 수 있었다.

Keywords

References

  1. Y. S. Kim, Y, M. Hong, Y, D. Kim, C.Y. Choi, 2006 : "Understanding of strategic metal of Tin" Korea steel & metal.News.
  2. S. K. Kang, P. A. Lauro, D. Y. Shih, D. W. Henderson, and K. J. Puttlitz, 2005 : "Microstructure and mechanical properties of lead-free solders and solder joints usedin microelectronic applications", IBM J.Res. & Dev.49, pp. 607. https://doi.org/10.1147/rd.494.0607
  3. Yu-Na Kim, Ja-Myeong Koo, Sun-Kyu Park, and Seung-Boo Jung, 2008: "Effect of Under Bump Metallization (UBM) on Interfacial Reaction and Shear Strength of Electroplated Pure Tin Solder Bump", J. Kor. Inst. Met. & Mater. 46(1), pp. 33-38.
  4. Tamas Kekesi, 2013 : "Electrorefinning in aqueous chloride media for recovering tin from waste materials", Acta Metallurgica Slovaca, 19(3), pp. 196-205.
  5. P. Halsall, 1989 : "The refining of Tin" Metall, 43, pp. 131-136.
  6. Z. Dobo, T. Kulcsar, T. Kekesi, 2012 : "Electrorefinning of tin in pure acid solutions by mechanically controlled cathode deposition and solar power utilization"Materials Science and Engineering, 37(2), pp. 19-26.
  7. Rimaszeki, G.-Kulcsar, T.-Kekesi, T, 2012.: Application of HCl solutions for recovering the pure metal from tin scrap by electrorefining. Hydrometallurgy, 125-126, pp. 55-63. https://doi.org/10.1016/j.hydromet.2012.05.012
  8. A. Mecucci and K. Scott, 2001 : Electrochemical recovery of copper, lead and tin from a nitrate and chloride leaching solution of scrap printed circuit boards. Electrochemical Society Proceedings, 23, pp. 293.
  9. A. E. C. Peres, C. A. Pereira and A.H. Matins, 2012 : "Tin recovery by recycling of printed circuit boards from obsolete computers in BRAZIL", Revista dela facultad deingenigria, 27, pp. 45-50.
  10. T. Stefanowicz, T. Golik, S. Napieralska-Zagozda and M. Osinska, 1991 : "Tin recovery from an electroplating sludge" Resources, Conservation and Recycling, 6, pp. 61-69. https://doi.org/10.1016/0921-3449(91)90006-A
  11. T. kekesi, T. Toro, G. Kabelik, 2000 : "Extraction of tin from scrap by chemical and electrochemical methods in alkaline media"Hydrometallurgy, 55, pp. 213-222. https://doi.org/10.1016/S0304-386X(99)00091-2

Cited by

  1. Study on the Surface Morphology and Control of Impurity by Organic Additive for Tin electro-refining vol.25, pp.4, 2016, https://doi.org/10.7844/kirr.2016.25.4.49