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Brazing Adhesion Properties of Ag Coated W-Ag Electric Contact on the Cu Substrate

Ag 코팅한 W-Ag 전기접점/Cu 모재간의 브레이징 접합 특성

  • Kang Hyun-Goo (Department of Metallurgy and Materials Science, Hanyang University) ;
  • Kang Yun-Sung (Department of Metallurgy and Materials Science, Hanyang University) ;
  • Lee Jai-Sung (Department of Metallurgy and Materials Science, Hanyang University)
  • 강현구 (한양대학교 금속재료공학과) ;
  • 강윤성 (한양대학교 금속재료공학과) ;
  • 이재성 (한양대학교 금속재료공학과)
  • Published : 2006.01.01

Abstract

The brazing adhesion properties of Ag coated W-Ag electric contact on the Cu substrate have been investigated in therms of microstructure, phase equilibrium and adhesion strength. Precoating of Ag layer ($3{\mu}m$ in thickness) on the $W-40\%Ag$ contact material was done by electro-plating method. Subsequently the brazing treatment was conducted by inserting BCuP-5 filler metal (Ag-Cu-P alloy) layer between Ag coated W-Ag and Cu substrate and annealing at $710^{\circ}C$ in $H_2$ atmosphere. The optimum brazing temperature of $710^{\circ}C$ was semi-empirically calculated on the basis of the Cu atomic diffusion profile in Ag layer of commercial electric contact produced by the same brazing process. As a mechanical test of the electric contact after brazing treatment the adhesion strength between the electric contact and Cu substrate was measured using Instron. The microstructure and phase equilibrium study revealed that the sound interlayer structure was formed by relatively low brazing treatment at $710^{\circ}C$. Thin Ag electro-plated layer precoated on the electric contact ($3{\mu}m$ in thickness) is thought to be enough for high adhesion strength arid sound microstructure in interface layer.

Keywords

References

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