• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.2
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• pp.82-86
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• 2000

Humidity sensors using $TiO_2$ thin films were fabricated on the multi-electrode device by Sol-Gel method and their wettability, surface potential decays and humidity sensing characteristics were investigated. Contact angle of thin films was $28^{\cic}\;at\; 400^{\circ}C$ and surface potential decayed rapidly at $400^{\circ}C$. The specimen showed best humidity sensing characteristics at $400^{\circ}C$. From the results, they were confirmed that humidity sensing characteristics of thin films have connection with contact angle and surface potential decays.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.9
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• pp.747-750
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• 2009

The TFTs have been fabricated with 3 different geometry SID electrodes which have the same channel W/L ratio (W/L = 5) due to constant channel resistance, The 3 samples have different channel widths (350, 150, and 25 ${\mu}m$) and channel lengths (70, 30, and 5 ${\mu}m$) by fixed channel W/L ratio simultaneously on one chip for reliable comparisons. Resultant on-current and field effect mobility are proportional to the channel width, while the subthreshold swing is inversely proportional to the channel width mainly due to the change of contact resistance. These results show that the contact resistance strongly affects the device performances and should be considered in the applications.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.6
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• pp.886-890
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• 2013

Uplift of contact wire and dynamic characteristics between pantograph and contact wire are key interaction performance of OCS (Overhead Catenary System). These two evaluation items are the approval criteria for the performance between OCS and pantograph. A telemetry system or DAQ (Data Acquisition) System based on wireless communication make it monitor a dynamic behavior which is measured directly in a 25 kv like parts. While permissible working time is too short time to install is too long. In this paper, it is described that optimization the telemetry measurement system for OCS and increasing accuracy, easy adaptation, and faster handling can be also achieved through the study.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.571-574
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• 2009

Metal oxide/metal bilayer structures are explored as contacts with a low injection barrier in organic thin-film transistors (OTFTs) in an effort to realize their true potential for low-cost electronics. OTFTs with a bilayer electrode of $WO_3$ (10nm) and Al shows a saturation mobility as large as 0.97 $cm^2$/Vsec which are comparable to those of Au-based control samples (~0.90 $cm^2$/Vsec). Scaling of contact resistance with respect to the thickness of $WO_3$ layer is also discussed.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1643-1645
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• 2000

The effects of pre-sintering and infiltration conditions on the electrical and physical properties of Cu-Cr contact material have been studied. Specimens were prepared by infiltration technique, aiming at the final composition of Cu50w%Cr, with varying pre-sintering and infiltration conditions. It showed that increased pre-sintering temperature had a little influence on the final microstructure of Cu-Cr contact material, but improved the surface morphology of Cr-skeleton resulting in better wettability in the followed infiltration process. It also showed that Cr grain growth and gram shape change became prominent with increasing infiltration temperature and time.

• Journal of Institute of Control, Robotics and Systems
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• v.4 no.3
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• pp.334-341
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• 1998

This paper proposes an algorithm to obtain the time-to-contact between an observer and a target and surface orientation of the target. These two physical elements are computed from the image deformation of a known shape, which is extracted by supervised classification of detected line segments based on MAP and Mahalanobis distance. The proposed algorithm was applied to the natural outdoor traffic scene and would contribute to the development for a collision avoidance system.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.34 no.4
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• pp.135-143
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• 1985

The failure and erosion of relay contacts mainly depend on the presence of particles deposited on the contact surface in various contaminated atmospheres. In this paper, the effects of sea water and circuit parameters on the arcing and quenching of magnet relay contacts are studied. The sea water pollutants of relay contact surface have led to increase the arcing numbers on making contact, and the mean arc durations on breaking contacts. Moreover, the maximum surge voltage and mean arc duration between relay contacts are also varied significantly by the circuit parameters. The effects of the spark quenching circuits using condenser of diode on the arcing of contacts are also discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.173-176
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• 2000

In this paper, we investigated the surface degradation of HTV silicone rubber used for a polymeric insulator by UV irradiation. To study the surface ageing properties by W irradiation, we used the corona discharge charging and contact angle. Therefore, we observed the change of surface charge retention and decrease of surface hydrophobicity. Also, we discussed the chemical change in the surface range using the analytic equipment such as SEM, ATR-FTIR, ESCA. Therefore, it is found that the scissor of characteristic bonding and the reattachment of oxidant bonding was developed by UV rays radiation. As discussing the corona ischarge charging and the change of contact angle, it is found the effect of UV irradiation and the mechanism of chemical reaction

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.11
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• pp.874-878
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• 2001

Solder bump was electroplated on wafer for flip chip application. The process is as follows. Ti/Cu were sputtered and thick PR was formed by several coating PR layer. Fine pitch vias were opened using via mask and then Cu stud and solder bump were electroplated. Finally solder bump was formed by reflow process. In this paper, we opened 40㎛ vias on 57㎛ thick PR layer and electroplated solder bump with 70㎛ height and 40㎛ diameter. After reflow process, we could form solder bump with 53㎛ height and 43㎛ diameter. In plating process, we improved the plating uniformity within 3% by using ring contact instead of conventional multi-point contact.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.1
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• pp.7-14
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• 2002

In this paper, neutral networks are used to build models of oxide film etched In CHF$_3$/CF$_4$ with a magnetically enhanced reactive ion etcher(MERIE). A statistical 2$\^$4-1/ experimental design plus one center point was used to characterize relationships between process factors and etch responses. The factors that were varied include radio frequence(rf) power, pressure, CHF$_3$ and CF$_4$ flow rates. Resultant 9 experiments were used to train neural networks and trained networks were subsequently tested on its appropriateness using additionally conducted 8 experiments. A total of 17 experiments were thus conducted for this modeling. The etch responses modeled are dc bias voltage, etch rate and etch uniformity A qualitative, good agreement was obtained between predicted and observed behaviors.