• 한국진공학회지
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• 제6권4호
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• pp.359-363
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• 1997

Power를 40W로 고정하고 시간을 5~120초간 변화시켜 아르곤 플라즈마로 처리시킨 n-GaAs(100)의 특성을 photoreflectance(PR) 측정으로 조사하였다. 아르곤 플라즈마 처리시 간을 증가시킴에 따라 Eo피크의 세기는 처리시간이 5초일 때 최소로 관측되었으며, 이때 표 면전기장 ($E_0$), 순수 캐리어농도(ND-NA) 및 표면상태밀도($Q_ss$)는 각각 $1.05\times10^5\textrm{V/cm},1.31\times10^{17}\textrm{cm}^{-3}$및 $1.64\times10^{-7}\textrm{C/cm}^2$로 이 값들은 bulk 시료에 비해 약 57.1, 81.4 및 56.9% 감소하였다. 반면에 5초일 때 compensation center 농도 ($N_A$)는 $5.75\times10{17}\textrm{cm}^{-3}$로 최대였다. 그리고 아르곤 플라즈마 처리시 유발된 결함들의 침투깊이는 표면에서 약450$\AA$정도였다.

• 한국산학기술학회논문지
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• 제16권3호
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• pp.2131-2134
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• 2015

본 논문에서는 종이를 기판으로 사용하고 용액공정이 가능한 강유전체 메모리 소자의 제작 가능성을 검토하였다. 유기물 강유전체인 "폴리비닐리덴트리플루오르에틸렌" 용액을 하부전극이 형성된 종이기판 위에 스핀코핑 방법을 이용하여 도포하였다. 하부전극으로는 진공증착법을 이용하여 알루미늄을 증착하였고, 도포된 "폴리비닐리덴트리플루오르에틸렌" 용액은 열처리 과정을 통해 결정화하였다. 제작된 "폴리비닐리덴트리플루오르에틸렌" 박막은 주사 전자 현미경법(SEM), 원자간력 현미경(AFM)을 이용하여 박막의 단면 및 표면의 특성을 평가하였다. 전압에 따른 분극특성 측정을 통해, 종이기판 위에 형성된 "폴리비닐리덴트리플루오르에틸렌" 박막이 매우 훌륭한 강유전체 특성을 보여주고 있음을 확인하였다. 또한, 종이기판의 응용가능성을 검토하기 위하여, 실리콘 기판위에 제작한 "폴리비닐리덴트리플루오르에틸렌" 박막과의 비교에 있어서도 손색없는 강유전체 특성을 보여주고 있음을 알 수 있었다. 이러한 결과들은 종이를 기판으로 이용하여 전자소자들을 제작 할 수 있음을 시사하며, 또한 용액공정으로 고밀도의 저렴한 강유전체 메모리 소자를 손쉽게 제작 할 수 있다는 것을 의미한다.

• Journal of Electrochemical Science and Technology
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• 제11권3호
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• pp.282-290
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• 2020

In this article, we report the effect of blended cathode materials on the performance of all-solid-state lithium-ion batteries (ASLBs) with oxide-based organic/inorganic hybrid electrolytes. LiFePO₄ material is good candidates as cathode material in PEO-based solid electrolytes because of their low operating potential of 3.4 V; however, LiFePO₄ suffers from low electric conductivity and low Li ion diffusion rate across the LiFePO₄/FePO₄ interface. Particularly, monoclinic Li₃V₂(PO₄)₃ (LVP) is a well-known high-power-density cathode material due to its rapid ionic diffusion properties. Therefore, the structure, cycling stability, and rate performance of the blended LiFePO₄/Li₃V₂(PO₄)₃ cathode material in ASLBs with oxidebased inorganic/organic-hybrid electrolytes are investigated by using powder X-ray diffraction analysis, field-emission scanning electron microscopy, Brunauer-Emmett-Teller sorption experiments, electrochemical impedance spectroscopy, and galvanostatic measurements.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.624-627
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• 2003

The BLT thin-films were one of the promising ferroelectric materials with a good leakage current and degradation behavior on Pt electrode. The BLT target was sintered at $1100^{\circ}C$ for 4 hours at the air ambient. $Bi_{3.25}La_{0.75}Ti_3O_{12}$ (BLT) thin-film deposited on $Pt/Ti/SIO_2/Si$ wafer by rf magnetron sputtering method. At annealed $700^{\circ}C$, (117) and (006) peaks appeared the high intensity. The hysteresis loop of the BLT thin films showed that the remanent polarization ($2Pr=Pr^+-Pr^-$) was $16uC/cm^2$ and leakage current density was $1.8{\times}10^{-9}A/cm^2$ at 50 kV/cm with coersive electric field when BLT thin-films were annealed at $700^{\circ}C$. Also, the thin film showed fatigue property at least up to $10^{10}$ switching bipolar pulse cycles under 7 V. Therefore, we induce access to optimum fabrication condition of memory device application by rf-magnetron sputtering method in this report.

• 전자공학회논문지A
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• 제31A권12호
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• pp.80-90
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• 1994

To develop VLSI of higher packing density with 0.5.mu.m gate length of less, semiconductor devices require shallow junction with higher doping concentration. the most common method to form the shallow junction is ion implantation, but in order to remove the implantation induced defect and activate the implanted impurities electrically, ion-implanted Si should be annealed at high temperature. In this annealing, impurities are diffused out and redistributed, creating deep PN junction. These make it more difficult to form the shallow junction. Accordingly, to miimize impurity redistribution, the thermal-budget should be kept minimum, that is. RTA needs to be used. This paper reports results of the diffusion characteristics of PSG film by varying Phosphorus weitht %/ Times and temperatures of RTA. From the SIMS.ASR.4-point probe analysis, it was found that low sheet resistance below 100 .OMEGA./ㅁand shallow junction depths below 0.2.mu.m can be obtained and the surface concentrations are measured by SIMS analysis was shown to range from 2.5*10$^{17}$ aroms/cm$^{3}$~3*10$^{20}$ aroms/cm$^{3}$. By depending on the RTA process of PSG film on Si, LDD-structured nMOSFET was fabricated. The junction depths andthe concentration of n-region were about 0.06.mu.m. 2.5*10$^{17}$ atom/cm$^{-3}$ , 4*10$^{17}$ atoms/cm$^{-3}$ and 8*10$^{17}$ atoms/cm$^{3}$, respectively. As for the electrical characteristics of nMOS with phosphorus junction for n- region formed by RTA, it was found that the characteristics of device were improved. It was shown that the results were mainly due to the reduction of electric field which decreases hot carriers.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.287-287
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• 2011

ITRS(international technology roadmap for semiconductors)에 따르면 MOS (metal-oxide-semiconductor)의 CD(critical dimension)가 45 nm node이하로 줄어들면서 poly-Si/SiO2를 대체할 수 있는 poly-Si/metal gate/high-k dielectric이 대두되고 있다. 일반적으로 metal gate를 식각시 정확한 CD를 형성시키기 위해서 plasma를 이용한 RIE(reactive ion etching)를 사용하고 있지만 PIDs(plasma induced damages)의 하나인 PICD(plasma induced charging damage)의 발생이 문제가 되고 있다. PICD의 원인으로 plasma의 non-uniform으로 locally imbalanced한 ion과 electron이 PICC(plasma induced charging current)를 gate oxide에 발생시켜 gate oxide의 interface에 trap을 형성시키므로 그 결과 소자 특성 저하가 보고되고 있다. 그러므로 본 연구에서는 이에 차세대 MOS의 metal gate의 식각공정에 HDP(high density plasma)의 ICP(inductively coupled plasma) source를 이용한 중성빔 시스템을 사용하여 PICD를 줄일 수 있는 새로운 식각 공정에 대한 연구를 하였다. 식각공정조건으로 gas는 HBr 12 sccm (80%)와 Cl2 3 sccm (20%)와 power는 300 w를 사용하였고 200 eV의 에너지로 식각공정시 TEM(transmission electron microscopy)으로 TiN의 anisotropic한 형상을 볼 수 있었고 100 eV 이하의 에너지로 식각공정시 하부층인 HfO2와 높은 etch selectivity로 etch stop을 시킬 수 있었다. 실제 공정을 MOS의 metal gate에 적용시켜 metal gate/high-k dielectric CMOSFETs의 NCSU(North Carolina State University) CVC model로 effective electric field electron mobility를 구한 결과 electorn mobility의 증가를 볼 수 있었고 또한 mos parameter인 transconductance (Gm)의 증가를 볼 수 있었다. 그 원인으로 CP(Charge pumping) 1MHz로 gate oxide의 inteface의 분석 결과 이러한 결과가 gate oxide의 interface trap양의 감소로 개선으로 기인함을 확인할 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.334-334
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• 2012

Transparent oxide semiconductors have recently attracted much attention as channel layer materials due to advantageous electrical and optical characteristics such as high mobility, high stability, and good transparency. In addition, transparent oxide semiconductor can be fabricated at low temperature with a low production cost and it permits highly uniform devices such as large area displays. A variety of thin film transistors (TFTs) have been studied including ZnO, InZnO, and InGaZnO as the channel layer. Recently, there are many studies for substitution of Ga in InGaZnO TFTs due to their problem, such as stability of devices. In this work, new quaternary compound materials, tantalum-indium-tin oxide (TaInSnO) thin films were fabricated by using co-sputtering and used for the active channel layer in thin film transistors (TFTs). We deposited TaInSnO films in a mixed gas (O2+Ar) atmosphere by co-sputtering from Ta and ITO targets, respectively. The electric characteristics of TaInSnO TFTs and thin films were investigated according to the RF power applied to the $Ta_2O_5$ target. The addition of Ta elements could suppress the formation of oxygen vacancies because of the stronger oxidation tendency of Ta relative to that of In or Sn. Therefore the free carrier density decreased with increasing RF power of $Ta_2O_5$ in TaInSnO thin film. The optimized characteristics of TaInSnO TFT showed an on/off current ratio of $1.4{\times}108$, a threshold voltage of 2.91 V, a field-effect mobility of 2.37 cm2/Vs, and a subthreshold swing of 0.48 V/dec.

• 센서학회지
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• 제9권1호
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• pp.83-89
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• 2000

TFELD의 절연층으로 사용하기 위해 ITO 유리위에 BST박막을 rf 마그네트론 스퍼터링법으로 증착시켰다. $O_2/(Ar+O_2)$의 혼합비는 10%, 기판온도는 상온에서 $500^{\circ}C$까지 변화를 주었고, 분위기압은 5 mTorr에서 30 mTorr까지 변화시켰다. 다양한 증착조건에서 성장된 BST박막의 전기적, 광학적, 구조적 및 화학량론적인 특성을 조사하였다. BST박막성장의 최적조건은 기판온도 $400^{\circ}C$, 분위기압 30 mTorr에서 구할 수 있었다. 주파수 1 kHz에서 비유전율은 254였고, 누설전류밀도는 5 MV/cm의 전계에서 $3.3{\times}10^{-7}\;A/cm^2$이하로 나타났으며, 가시광영역에서 광투과율은 82%였다.

• 천문학회보
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• 제36권2호
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• pp.91-91
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• 2011

The passage of the interplanetary discontinuity (i.e., sudden increases in the solar wind speed, density, and IMF strength) was detected by ACE near GSE (x, y, z) ~ (222, -36, 3) Re upstream of Earth around 22:48 UT on November 24, 2008. About 55 min later, this solar wind discontinuity was observed by Geotail near GSE (x, y, z) ~ (23, 18, -7) Re in front of Earth's bow shock. From the propagation time of the solar wind discontinuity between ACE and Geotail, it is expected that the discontinuity front is aligned with the Parker spiral and strikes the postnoon dayside magnetopause first. Using coordinated multi-point measurements (THEMIS and GOES) at or in geosynchronous orbit, we observed a tailward propagating sudden impulse (SI), excited by the interplanetary discontinuity, around 23:50 UT with its front retaining alignment similar to that of solar wind discontinuity. The SI event appears a negative-then-positive variation in the H component at high latitude Chokurdakh (CHD: MLAT ~ 64.7 deg) in the prenoon sector, which is opposite sense of normal SI event. During the positive deflection at CHD, the SuperDARN Hokkaido radar detected the downward motion of the ionosphere, implying westward electric field enhancement, at subauroral latitudes near CHD meridian. In our study we will discuss magnetospheric and ionospheric responses to the passage of the solar wind discontinuity using multi-point observations in space and on the ground.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 춘계학술대회 논문집
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• pp.9-9
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• 2009

Coated conductor is required to have good critical current property for high efficiency of electric power applications. Until now, long coated conductor does not show high Jc over 3 MA/$cm^2$ in thick superconducting layer because of texture degradation by thick superconducting layer. In this study, in order to overcome this issue, thicker superconducting layer was deposited with optimized conditions to reduce the degradation of critical current density. SmBCO superconducting coated conductor was deposited with 1~3 um of thickness at $750\sim850^{\circ}C$ under 15~20 mTorr of oxygen partial pressure using batch type EDDC( evaporation using drum in dual chamber). The buffered substrate for superconducting layer deposition was used IBAD-MgO template with the architecture of $LaMnO_3/MgO/Y_2O_3/Al_2O_3$/Hastelloy. After fabrication of coated conductor, critical current was measured by 4-prove method under self-magnetic field and 77K. In addition, surface morphology and texture were analyzed by SEM and XRD, respectively. 3 um thick SmBCO coated conductor shows highest $I_C$ values of 638A/cm-w in 1 m long in the world.