• 한국정밀공학회지
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• 제17권2호
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• pp.73-79
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• 2000

The part-surface of mold or stamping-dies consists of a compound surface which consists of lots of composite surfaces, and may have various types of feature shapes including convex sharp edge (CSE). Those CSE features should be considered with care in machining the surface, which necessitates extraction of CSE curves on a compound surface. This work can be done rather easily for a solid model which has a complete topology information. In case of the compound surface without topology information, however, such CSE curves must be gathered through some geometrical calculations paying much computation time. In the paper, extracting CSE curves by the construction of a CSE region-map which can reduce time, and detecting various common edge types are presented.

• 전기학회논문지
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• 제66권5호
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• pp.851-856
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• 2017

Research on the edge isolation process of typical polycrystalline silicon solar cells was carried out using laser scribing equipment. The voltage-current characteristics of the solar cell before and after laser scribing were analyzed using a solar simulator. Current density and efficiency increased as the fill factor of the solar cell remained constant after the laser scribing process. The efficiency of the solar cell can be increased in a short time by the edge isolation process performed via a laser scribing process. The polycrystalline silicon solar cell was made into a series electrode, and the efficiency of the solar cell increased because the width of the solar cell was narrowed and the active region was widened by the laser scribing process.

• 한국콘텐츠학회:학술대회논문집
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• 한국콘텐츠학회 2004년도 추계 종합학술대회 논문집
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• pp.453-456
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• 2004

본 논문은 에지와 수평 투영을 이용하여 차선 및 장애물을 검출하는 기법을 제안한다. 제안방법은 칼라 입력 영상을 그레이 영상으로 바꾼 후, 소벨 변환을 통하여 에지를 검출한다. 에지를 이용하여 차선을 검출 한 후 차선의 영역 내에서 수평 투영을 하여 장애물을 검출한다. 실험 결과, 조명의 변화가 심하지 않은 장소에서 차선과 장애물의 검출이 용이함을 확인할 수 있었다.

• 대한기계학회논문집B
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• 제26권11호
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• pp.1552-1558
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• 2002

The blade leading edge is modified to control the secondary flow generated in the turbine cascade with fence by intensifying the suction side branch of the horseshoe vortex. The incompressible Navier-Stokes equations are numerically solved with a high Reynolds number k-$\varepsilon$ turbulence closure model for investigating the vortical flows in the turbine cascade. The computational results of total pressure loss coefficients in the wake region are first compared with experiments for validation. The structure and strength of the passage vortex near the suction surface are examined by testing various geometrical parameters of the turbine blade leading edge.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집B
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• pp.422-427
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• 2000

The design of low-solidity vaned diffusers and the effect on the performance of a turbocharger compressor is discussed. The effect of vane number and turning angle was investigated while maintaining a basic design with a leading edge angle of $70^{\circ}$, leading and trailing edge radius ratios of 1.1 and 1.3. All results are compared with those obtained with the standard vaneless diffuser configuration and it was shown that all designs increased and shifted the pressure ratio to reduced flowrates. Despite the low-solidity configuration none of the vane designs provided a broad operating range, and the vane leading edge angle was not main factor that system went into the surge condition. The diffuser of higher trailing edge angle improved the flow range for the compressor to operate at lower flow region.

• 대한전자공학회논문지
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• 제26권3호
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• pp.105-112
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• 1989

에지추적, 영역채색 및 후처리 과정으로 구성된 간단한 에지기반 분할법을 새로이 제안하였다. 이 방법은 대부분 에지기반법에서 나타나는 소극문제를 해결함으로써, 영상부호화에 적용할 수 있을 정도로 완전하게 영상을 분할한다. 실험결과, 이 방법은 Perkins방법보다 3배정도 빠르고, 그 재생영상도 인식면에서 우수한 것으로 나타났다.

• 한국정보처리학회논문지
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• 제6권10호
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• pp.2830-2837
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• 1999

Image processing steps are consist of image acquisition, preprocessing, region, segmentation and recognition. But image corrupted commonly by noise reduction methods, many filters were proposed like mean filter, median filter, weighted median filter, Cheikh filter, and Kyu-cheol lee filter as spatial noise reduction filtering. We propose a new edge detection algorithm so that we find out edge existence and nonexistence. In non-edge area, we selectively apply weighted median filter based upon using information of difference value between weighted median filter's value and center pixel's value. As a result, we finally prove a better performance of noise reduction by applying adaptive weighted median filter and improvement of processing time through using simple algorithm.

• 한국시뮬레이션학회논문지
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• 제11권1호
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• pp.23-30
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• 2002

An STI(Shallow Trench Isolation) by using a CMP(Chemical Mechanical Polishing) process has been one of the key issues in the device isolation[1] In this paper we fabricated N, P-MOSFEET tall analyse hump characteristics in various rounding oxdation thickness(ex : Skip, 500, 800, 1000$\AA$). As a result we found that hump occurred at STI channel edge region by field oxide recess. and boron segregation(early turn on due to boron segregatiorn at channel edge). Therefore we improved that hump occurrence by increased oxidation thickness, and control field oxide recess( 20nm), wet oxidation etch time(19HF,30sec), STI nitride wet cleaning time(99HF, 60sec+P 90min) and fate pre-oxidation cleaning time (U10min+19HF, 60sec) to prevent hump occurring at STI channel edge.

• 한국정밀공학회지
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• 제29권3호
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• pp.289-294
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• 2012

There are several indicators to represent characteristics of chemical mechanical planarization (CMP) such as material removal rate (MRR), surface quality and removal uniformity on a wafer surface. Especially, the removal uniformity on the wafer edge is one of the most important issues since it gives a significant impact on the yield of chip production on a wafer. Non-uniform removal rate at the wafer edge (edge effect) is mainly induced by a non-uniform pressure from nonuniform pad curvature during CMP process, resulting in edge exclusion which means the region that cannot be made to a chip. For this reason, authors tried to minimize the edge exclusion by using an edge profile control (EPC) ring. The EPC ring is equipped on the polishing head with the wafer to protect a wafer from the edge effect. Experimental results showed that the EPC ring could dramatically minimize the edge exclusion of the wafer. This study shows a possibility to improve the yield of chip production without special design changes of the CMP equipment.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.849-850
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• 2008

Region adaptive demosaicing scheme based on the spectral spatial correlation is prosed in this paper. Region classification and adaptive demosaicing makes the decision of the edge direction more accurately.