• 한국안전학회지
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• 제22권3호
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• pp.22-27
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• 2007

The knowledge of the flash point of the various liquid substances is required because of process safety and control in industrial fire protection. The epoxy resin is one of versatile resins that has wide selection of using curing agents and additives to achieve various applications such as coatings, adhesives, interior materials, reinforced plastics and electrical insulation. In this study, the lower flash points for p-xylene+epoxy resin, o-xylene+epoxy resin and n-butanol+epoxy resin systems were measured by using Pensky-Martens closed cup tester. The lower flash points for p-xylene+epoxy resin, o-xylene+epoxy resin and n-butanol+epoxy resin systems rapidly increased 80wt%, 90wt% and 95wt% of epoxy resin concentration, respectively. This results serve as a guide to estimate flash point of any epoxy resin solution.

• 반도체디스플레이기술학회지
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• 제19권1호
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• Transactions on Electrical and Electronic Materials
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• 제14권4호
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• pp.199-202
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• 2013

In order to study the effect of reactive diluents on the electrical insulation breakdown strength and mechanical properties of, a polyglycol and an aliphatic epoxy were individually introduced to an epoxy system. Reactive diluents were used in order to decrease the viscosity of the epoxy system; polyglycol acted as a flexibilizer and 1,4-butanediol diglycidyl ether (BDGE) acted as an aliphatic epoxy, which then acted as a chain extender after curing reaction. The ac electrical breakdown strength was estimated in sphere-to-sphere electrodes and the electrical breakdown strength was estimated by Weibull statistical analysis. The scale parameters of the electrical breakdown strengths for the epoxy resin, epoxy-polyglycol, and epoxy-BDGE were 45.0, 46.2, and 45.1 kV/mm, respectively. The flexural and tensile strengths for epoxy-BDGE were lower than those of the epoxy resin and those for epoxy-polyglycol were lower than those of the epoxy resin.

• 공업화학
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• 제9권2호
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• pp.172-176
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• 1998

에폭시 adduct carboxyl terminated butadiene acrylonitrile(CTBN)은 CTBN과 에폭시수지를 블렌딩하여 제조하였다. CTBN과 폴리우레탄(PU) 및 에폭시수지로 CTBN/PU/epoxy를 제조하였다. CTBN이 5 wt%에서 CTBN/PU/Epoxy는 PU의 함량이 증가할 수록 damping 피크가 이동하였다. PU의 함량이 증가할수록 상용성이 증가함을 의미한다. 그러나 CTBN의 함량이 증가함에 따라 상용성은 감소하였다. CTBN/PU/epoxy에서는 PU의 함량이 10wt%에서 최대 굴곡값을 나타냈으나, PU 함량이 증가할수록 감소하였다. CTBN/epoxy에서 PU를 첨가함에 따라 파괴인성은 증가하였다. 파괴단면에서 전단변형과 공동화에 의한 응력백화현상을 보였다. CTBN의 공동화와 PU를 도입한 에폭시 매트릭스의 전단변형이 CTBN/PU/epoxy의 강인화기구이다.

• 반도체디스플레이기술학회지
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• 제16권2호
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• pp.19-26
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• 2017

The cure properties of ethoxysilyl bisphenol A type epoxy resin (Ethoxysilyl-DGEBA) systems with different hardeners were investigated, comparing with DGEBA and Diallyl-DGEBA epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The Ethoxysilyl-DGEBA epoxy resin system showed lower cure conversion rates than DGEBA and Diallyl-DGEBA epoxy resin systems. The conversion rates of these epoxy resin systems with DDM hardener are lower than those with HF-1M hardener. It can be considered that the optimum hardener for Ethoxysilyl-DGEBA epoxy resin system is Phenol Novolac type. These lower cure conversion rates in the Ethoxysilyl-DGEBA epoxy resin systems could be explained by the retardation of reaction molecule movements according to the formation of organic-inorganic hybrid network structure by epoxy and ethoxysilyl group in Ethoxysilyl- DGEBA epoxy resin system.

• 반도체디스플레이기술학회지
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• 제21권2호
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• pp.57-67
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• 2022

The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.

• Carbon letters
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• 제12권3호
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• pp.177-179
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• 2011

The use of carbon nanotubes (CNTs) as a reinforcing material in a polymer matrix has increased in various industries. In this study, the flexural behavior of CNT-modified epoxy/basalt (CNT/epoxy/basalt) composites is investigated. The effects of CNT modification with silane on the flexural properties of CNT/epoxy/basalt composites were also examined. Flexural tests were performed using epoxy/basalt, oxidized CNT/epoxy/basalt, and silanized CNT/epoxy/basalt multi-scale composites. After the flexural tests, the fracture surfaces of the specimens were examined via scanning electron microscopy (SEM) to investigate the fracture mechanisms of the CNT/epoxy/basalt multi-scale composites with respect to the CNT modification process. The flexural properties of the epoxy/basalt composites were improved by the addition of CNTs. The flexural modulus and strength of the silane-treated CNT/epoxy/basalt multi-scale composites increased by approximately 54% and 34%, respectively, compared to those of epoxy/basalt composites. A SEM examination of the fracture surfaces revealed that the improvement in the flexural properties of the silane-treated CNT/epoxy/basalt multi-scale composites could be attributed to the improved dispersion of the CNTs in the epoxy.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2009년도 추계 학술논문 발표대회
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• pp.55-59
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• 2009

The epoxy resin without hardener can harden by a ring-opening reaction in the presence of the alkalies produced by the hydration of cement in epoxy-modified mortars and concretes. This paper investigates the effect of curing conditions on the strength improvement of polymer-modified mortars using bisphenol A-type epoxy resin without hardener. The polymer-modified mortars using epoxy resin are prepared with various polymer-cement ratios, and subjected to ideal, water, dry and heat cures. In the heat cure, the epoxy-modified mortars are sealed or unsealed with a PVDC (polyvinylidene chloride) film. The epoxy-modified mortars are tested for flexural and compressive strengths at desired curing methods. The microstructures of the epoxy-modified mortars are also observed by scanning electron microscope. The effects of curing conditions on the strength development of the epoxy-modified mortars are examined. From the test results, the marked effectiveness of the heat cure under the PVDC film sealing against the development of the strength of the epoxy-modified mortar without the hardener is recognized. The flexural and compressive strengths of 7-day-90℃ heat-cured, PVDC film-sealed epoxy-modified mortars without hardener reach 7 to 17MPa and 24 to 44MPa respectively, and are two to three times of Unmodified mortar. Such high strength development of the epoxy-modified mortars may be achieved by the dense microstructure formation by cement hydrates and the hardening of the epoxy resin in the mortars.

• 한국염색가공학회지
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• 제5권1호
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• pp.10-18
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• 1993

Epoxy compound was synthesized from bisphellol-A with epichlorophydrine. Epoxy compound and siloxane were emulsified conjugative one or another. The water repellency of silk fabrics was also highly improved by the treatment of epoxy-siloxane mixed emulsions containing stannic chloride and zirconium oxychloride. The maximum wrinkle recovery was obtained from the fabrics treated under the condition 2.5%-epoxy-siloxane emulsion at 16$0^{\circ}C$. The breaking elongation, the reflectance, the tensile strength and the bending properties of silk fabrics were not degraded severely by the treatment of epoxy-siloxane emulsion.

• Carbon letters
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• 제12권4호
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• pp.249-251
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• 2011

Carbon/epoxy woven composites are prominent wear-resistant materials due to the strength, stiffness, and thermal conductivity of carbon fabric. In this study, the effect of oilabsorption on the wear behaviors of carbon/epoxy woven composites was investigated. Wear tests were performed on dry and fully oil-absorbed carbon/epoxy woven composites. The worn surfaces of the test specimens were examined via scanning electron microscopy to investigate the wear mechanisms of oil-absorbed carbon/epoxy woven composites. It was found that the oil absorption rate was 0.14% when the carbon/epoxy woven composites were fully saturated. In addition, the wear properties of the carbon/epoxy woven composites were found to be affected by oilabsorption. Specifically, the friction coefficients of dry and oil-absorbed carbon/epoxy woven composites were 0.25-0.30 and 0.55-0.6, respectively. The wear loss of the oilabsorbed carbon/epoxy woven composites was $3.52{\times}10^{-2}\;cm^3$, while that of the dry carbon/epoxy woven composites was $3.52{\times}10^{-2}\;cm^3$. SEM results revealed that the higher friction coefficient and wear loss of the oil-absorbed carbon/epoxy woven composites can be attributed to the existence of broken and randomly dispersed fibers due to the weak adhesion forces between the carbon fibers and the epoxy matrix.