• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2839-2844
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• 2008

A PEMFC(proton exchange membrane fuel cell) is a good candidate for residential power generation to be cope with the shortage of fossil fuel and green house gas emission. The attractive benefit of the PEMFC is to produce electric power as well as hot water for home usage. Typically, thermal management of vehicular PEMFC is to reject the heat from the PEMFC to the ambient air. Different from that, the thermal management of PEMFC for RPG is to utilize the heat of PEMFC so that the PEMFC can be operated at its optimal efficiency. In this study, dynamic thermal management system is modeled to understand the response of the thermal management system during dynamic operation. The thermal management system of PEMFC for RPGFC is composed of two cooling circuits, one for controling the fuel cell temperature and the other for heating up the water for home usage. Dynamic responses and operating strategies of the PEMFC system are investigated during load changes.

• Journal of Hydrogen and New Energy
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• v.26 no.2
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• pp.184-191
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• 2015

As the power electronics system increases the frequency, the power loss and thermal management are paid more attention. This research presents a real time model of dissipation power with junction temperature response for 120kw IGBT inverter which is applied to the thermal management of high power IGBT inverter. Since the computational time is critical for real time simulation, look-up tables of IGBT module characteristic curve are implemented. The power loss from IGBT provides a clue to calculate the temperature of each module of IGBT. In this study, temperature of each layer in IGBT is predicted by lumped capacitance analysis of layers with convective heat transfer. The power loss and temperature of layers in IGBT is then communicated due to mutual dependence. In the dynamic model, PWM pulses are employed to calculation real time IGBT and diode power loss. Under Matlab/Simulink$^{(R)}$ environment, the dynamic model is validated with experiment. Results showed that the dynamic response of power loss is closely coupled with effective thermal management. The convective heat transfer is enough to achieve proper thermal management under guideline temperature.

• Journal of Hydrogen and New Energy
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• v.18 no.3
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• pp.292-300
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• 2007

A dynamic system model of a proton exchange membrane fuel cell(PEMFC) has been developed. The PEMFC of this study has large active area with water cooling in order to simulate the performance of the commercially viable PEMFC system for the transportation. A PEMFC stack model is a transient thermal model which is respond to the dynamic change of the coolant temperature and the flow rate. The dynamic cooling system model has been developed to determine the coolant flow rate and the coolant temperature. Prior to the system level study, thermal management criteria have been set up and brought to the control command of the cooling system. Since the system model is designed to evaluate the effect of thermal management on the system performance, it is attempted to determine the proper control algorithm of the cooling system so that the PEMFC system is working on the thermal management criteria. As a result of simulation, feedback controlled cooling system consumes less power and produce more power comparing with that of conventionally controlled cooling system.

• IEMEK Journal of Embedded Systems and Applications
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• v.4 no.2
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• pp.55-62
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• 2009

The power consumption of a high-end microprocessor increases very rapidly. High power consumption will lead to a rapid increase in the chip temperature as well. If the temperature reaches beyond a certain level, chip operation becomes either slow or unreliable. Therefore various approaches for Dynamic Thermal Management (DTM) have been proposed. In this paper, we propose a learning based temperature prediction scheme for a multi-core system. In this approach, from repeatedly executing an application, we learn the thermal patterns of the chip, and we control the temperature in advance through DTM. When the predicted temperature may go beyond a threshold value, we reduce the temperature by decreasing the operation frequencies of the corresponding core. We implement our temperature prediction on an Intel's Quad-Core system which has integrated digital thermal sensors. A Dynamic Frequency System (DFS) technique is implemented to have four frequency steps on a Linux kernel. We carried out experiments using Phoronix Test Suite benchmarks for Linux. The peak temperature has been reduced by on average $5^{\circ}C{\sim}7^{\circ}C$. The overall average temperature reduced from $72^{\circ}C$ to $65^{\circ}C$.

• The KIPS Transactions:PartA
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• v.19A no.2
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• pp.77-84
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• 2012

Speculative execution for improving instruction-level parallelism is widely used in high-performance processors. In the speculative execution technique, the most important factor is the accuracy of branch predictor. Unfortunately, complex branch predictors for improving the accuracy can cause serious thermal problems in 3D multicore processors. Thermal problems have negative impact on the processor performance. This paper analyzes two methods to solve the thermal problems in the branch predictor of 3D multi-core processors. First method is dynamic thermal management which turns off the execution of the branch predictor when the temperature of the branch predictor exceeds the threshold. Second method is thermal-aware branch predictor placement policy by considering each layer's temperature in 3D multi-core processors. According to our evaluation, the branch predictor placement policy shows that average temperature is $87.69^{\circ}C$, and average maximum temperature gradient is $11.17^{\circ}C$. And, dynamic thermal management shows that average temperature is $89.64^{\circ}C$ and average maximum temperature gradient is $17.62^{\circ}C$. Proposed branch predictor placement policy has superior thermal efficiency than the dynamic thermal management. In the perspective of performance, the proposed branch predictor placement policy degrades the performance by 3.61%, while the dynamic thermal management degrades the performance by 27.66%.

• ETRI Journal
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• v.30 no.4
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• pp.624-626
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• 2008

Excessively high temperature deteriorates the reliability and increases the leakage power consumption of microprocessors. The register file, known as one of the hottest functional units in microprocessors, incurs frequent dynamic thermal management operations for thermal control. In this letter, we adopt the banked register file scheme, which was originally proposed to reduce dynamic power consumption. By simply modifying the register file structure, the temperature in the register file was reduced dramatically, resulting in 13.37% performance improvement and 10.49% total processor leakage reduction.

• Journal of Hydrogen and New Energy
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• v.34 no.5
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• pp.465-477
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• 2023

In proton exchange membrane fuel cell (PEMFC), proper thermal management of the stack and moisture generation by electrochemical reactions significantly affect fuel cell performance. In this study, the PEMFC dynamic characteristic model was developed through Simcenter AMESim, a development program. In addition, the developed model aims to understand the thermal resin balance of the stack and performance characteristics for input loads. The developed model applies the thermal management model of the stack and the moisture content and permeability model to simulate voltage loss and stack thermal behavior precisely. This study extended the C based AMESet (adaptive modeling environment submodeling tool) to simulate electrochemical reactions inside the stack. Fuel cell model of AMESet was liberalized with AMESim and then integrated with the balance of plant (BOP) model and analyzed. And It is intended to be used in component design through BOP analysis. The resistance loss of the stack and thermal behavior characteristics were predicted, and the impact of stack performance and efficiency was evaluated.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.7
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• pp.103-110
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• 2014

Recent TSV based 3D Integrated Circuit (IC) technology needs more powerful thermal management techniques. However, because cooling cost and form factor are restricted, thermal management are emphasis on software based techniques. But in case of throttling thermal management which one of the most candidate technique, increasing bus occupation induce total performance decrease. To solve communication bottleneck issue in TSV based 3D SoC, we proposed adaptive throttling technique Experimental results show that the proposed method can improve throughput by about 72% compare with minimal path routing.

• Journal of KIISE:Computing Practices and Letters
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• v.16 no.2
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• pp.212-216
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• 2010

Dynamic Thermal Management (DTM) degrades the processor performance for lowering temperature. For this reason, reducing the peak temperature on microprocessors can improve the performance by reducing the performance loss due to DTM. In this study, we analyze various unit selection techniques for computation migration. According to our simulation results, dynamic computation migration based on the thermal difference between the units shows best performance among compared models.

• Journal of KIISE:Computer Systems and Theory
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• v.35 no.12
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• pp.540-551
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• 2008

Today's microprocessor designs are not free from temperature as well as power consumption. As processor technology scales down, an on-chip circuitry increases power density, which incurs excessive temperature (hotspot) problem. To tackle thermal problems cost-effectively, Dynamic Thermal Management (DTM) has been suggested: DTM techniques have benefits of thermal reliability and cooling cost. However, they require trade-off between thermal control and performance loss. This paper proposes a dual integer register file structure to minimize the performance degradation due to DTM invocations. In on-chip thermal control, the most important functional unit is an integer register file. It is the hotspot unit because of frequent read and write data accesses. The proposed dual integer register file migrates read data accesses by adding an extra register file, thus reduces per-unit dynamic power dissipation. As a result, the proposed structure completely eliminates localized hotspots in the integer register file, resulting in much less performance degradation by average 13.35% (maximum 18%) improvement compared to the conventional DTM architecture.