Journal of the Institute of Electronics and Information Engineers (전자공학회논문지)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Performance-aware Dynamic Thermal Management by Adaptive Vertical Throttling in 3D Network-on-Chip

3D NoC 구조에서 성능을 고려한 어댑티브 수직 스로틀링 기반 동적 열관리 기법

  • Hwang, Junsun (College of Information & Communication Engineering, Sungkyunkwan University) ;
  • Han, Tae Hee (College of Information & Communication Engineering, Sungkyunkwan University)
  • 황준선 (성균관대학교 정보통신대학) ;
  • 한태희 (성균관대학교 정보통신대학)
  • Received : 2014.03.12
  • Accepted : 2014.06.23
  • Published : 2014.07.25
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Abstract

Recent TSV based 3D Integrated Circuit (IC) technology needs more powerful thermal management techniques. However, because cooling cost and form factor are restricted, thermal management are emphasis on software based techniques. But in case of throttling thermal management which one of the most candidate technique, increasing bus occupation induce total performance decrease. To solve communication bottleneck issue in TSV based 3D SoC, we proposed adaptive throttling technique Experimental results show that the proposed method can improve throughput by about 72% compare with minimal path routing.

최근 등장한 TSV(Through Silicon Via)기반의 3D 적층 기술은 보다 강력한 발열관리 기법을 필요로 하며 냉각 비용과 폼팩터(form factor)의 제한을 고려했을 때 소프트웨어적인 열관리 기법의 중요성이 더욱 강조되고 있다. 이러한 접근 방식의 유력한 후보 중 하나로 제시되었던 스로틀링을 통한 열관리 기법의 경우, 증가하는 버스 점유율로 인해 전체적인 성능저하를 야기하는 문제점이 있다. 본 논문에서는 향후 TSV 기반 3D SoC의 커뮤니케이션 병목 현상을 해결하기 위한 3D 네트워크-온-칩 (Network-on-Chip, NoC) 구조에서 어댑티브 스로틀링 기법을 제안하여, 열관리와 더불어 온-칩 네트워크상의 트래픽 감소를 통해 전체적인 성능향상을 목표로 한다. 본 논문에서는 실험을 통하여 기존의 방식에 비하여 스로틀링으로 인해 저하된 처리량이 최소경로 라우팅 시 최대 72% 향상됨을 알 수 있었다.

Keywords

References

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