• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.7
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• pp.761-766
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• 2014

This study performs the analytical investigation of the oscillation voltages at the tanks of the series tuned varactor incorporating balanced common-drain, and common-gate Colpitts VCO which are able to work even at the sub-1V power supply voltages. The results the investigation predicts is verified by the simulation on the circuit behaviors of the two VCOs. The analytical investigation finds that the series tuned varactor incorporating balanced common-gate VCO generates greater oscillation voltage at the tank than the series tuned varactor incorporating balanced common-drain VCO does, which in turn is more suitable for generating the low phase noise oscillation signal from the sub-1V supply voltage than the series tuned varactor incorporating balanced common-drain VCO.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.4
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• pp.21-27
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• 2009

In this work, Er-silicided SB-SOI nMOSFET and Pt-silicided SB-SOI pMOSFET have been fabricated to investigate the current-voltage characteristics of Schottky barrier SOI nMOS and pMOS at elevated temperature. The dominant current transport mechanism of SB nMOS and pMOS is discussed using the measurement results of the temperature dependence of drain current with gate voltages. It is observed that the drain current increases with the increase of operating temperature at low gate voltage due to the increase of thermal emission and tunneling current. But the drain current is decreased at high gate voltage due to the decrease of the drift current. It is observed that the ON/Off current ratio is decreased due to the increased tunneling current from the drain to channel region although the ON current is increased at elevated temperature. The threshold voltage variation with temperature is smaller and the subthreshold swing is larger in SB-SOI nMOS and pMOS than in SOI devices or in bulk MOSFETs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.355-355
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• 2010

We studied the dependence of the performance of schottky barrier metal-oxide-field effect transistors(SB MOSFETs) on the work function of source/drain metals. A strong impact of the various work functions and the light wavelengths on the transistor characteristics is found and explained using experimental data. We used an insulator of a high thickness (100nm) and back gate issues in SOI substrate, subthreshold swing was measured to 300~400[mV/dec] comparing with a ideal subthreshold swing of 60[mV/dec]. Excellent characteristics of Al/Si was demonstrated higher on/off current ratios of ${\sim}10^7$ than others. In addition, extensive photoresponse analysis has been performed using halogen and deuterium light sources(200<$\lambda$<2000nm).

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.1
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• pp.1-11
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• 2004

A FinFET, a novel double-gate device structure is capable of scaling well into the nanoelectronics regime. High-performance CMOS FinFETs , fully depleted silicon-on-insulator (FDSOI) devices have been demonstrated down to 15 nm gate length and are relatively simple to fabricate, which can be scaled to gate length below 10 nm. In this paper, some of the key elements of these technologies are described including sub-lithographic pattering technology, raised source/drain for low series resistance, gate work-function engineering for threshold voltage adjustment as well as metal gate technology, channel roughness on carrier mobility, crystal orientation effect, reliability issues, process variation effects, and device scaling limit.

• Proceedings of the Korean Geotechical Society Conference
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• 1992.10a
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• pp.75-86
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• 1992

The elevation of reclamation work in the coastal area for the industrial complex is determined through the investigation and review of marine conditions, drainage plan and fill materials. The embankment to be constructed with crushed stone on the soft soil should be safe against the wave force, immediate and long term consolidation settlement, overturning and sliding due to self-weight and other forces. Because of lack of fill material from the borrow pit, the soft marine clay to be dredged shall be used as the reclamation material. And Paper Drain Board is used as the improvement method for the deep soft clay strata.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1197-1199
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• 2009

Self-alignment for the fabrication of printed thin film transistors has become of great interest because of the resolution and registration limits of printing technologies. In this work, self-patterning and selfregistration processes are introduced, which do not need surface energy patterning and the resulting minimum gate channel length could be down to $11.2{\mu}m$ with the sheet resistance of 2.6 ${\Omega}/{\square]$ for the source and drain electrodes.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.841-844
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• 2007

In this paper, a vertical block mura, which massively occurred in the LCD products, was investigated extensively by various methods, source drain (SD) line shift is found out to be one of the key reasons. This work to some extent, establishes theoretic hypothesis for further research and solutions similar issues.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.21 no.1
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• pp.82-89
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• 2017

In this work, InGaZnO thin film transistors with Ni, Al and ITO source and drain electrode materials were fabricated to analyze a hot carrier induced device degradation according to the electrode materials. From the electrical measurement results with electrode materials, Ni device shows the best electrical performances in terms of mobility, subthreshold swing, and $I_{ON}/I_{OFF}$. From the measurement results on the device degradation with source and drain electrode materials, Al device shows the worst device degradation. The threshold voltage shifts with different channel widths and stress drain voltages were measured to analyze a hot carrier induced device degradation mechanism. Hot carrier induced device degradation became more significant with increase of channel widths and stress drain voltages. From the results, we found that a hot carrier induced device degradation in InGaZnO thin film transistors was occurred with a combination of large channel electric field and Joule heating effects.

• Geotechnical Engineering
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• v.1 no.2
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• pp.27-40
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• 1985

This study aims at the development of computer Program for the deformation analysis of soft clay layers, and using this computer program, study the constraint effect of deformation- heaving, lateral displacement-of the soft clay layers reinforced with sheet pile at the tip of banking or improvement of soft clay layer up to hard strata, under intact state (natural) and the state of vertical drain respectively. For this study, Biot's consolidation theories and modified Cam-clay theory for constitutive equation for FEMI were selected and coupled governing equation, and christian-Boehmer's technique was applied to solve the coupled relationship. The following results are obtained. 1. Sheet pile or improvement of soft clay layer to the hard strata work well against the settlement of neighboring ground. B. In view of restriction of heaving or lateral displacement, sheet pile is not supposed to be of use. 3. Sheet pile is of effect only when vertical drain is constructed for acceleration of consolidation and load increases gradually. B. The larger the rigidity of improvement of layer to hard strata is, the less settlement occurs.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.615-618
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• 2005

In this work, the effects of corner transistors in SOI MOSFETs were investigated. We fabricated SOI MOSFETs with various widths and a fixed length and characterized them. The SOI thickness was $4000{\AA}$ and the buried oxide(BOX) thickness was $4000{\AA}$. The isolation of active region was simply done by silicon etching and TEOS sidewall formation. Several undesirable characteristics have been reported for LOCOS isolation in fabrication on SOI wafers so far. Although we used an STI-like process instead of LOCOS, there were still a couple of abnormal phenomena such as kinks and double humps in drain current. Above all, we investigated the location of the parasitic transistors and found that they were at the corners of the SOI in width direction by high-resolution SEM inspection. It turned out that their characteristics are strongly dependent on the channel width. We made a contact pad through which we can control the body potential and figured out the dependency of operation on the body potential. The double humps became more prominent as the body bias went more negative until the full depletion of the channel where the threshold voltage shift did not occur any more. Through these works, we could get insights on the process that can reduce the effects of corner transistors in SOI MOSFETs, and several possible solutions are suggested at the end.