• Bulletin of the Korean Chemical Society
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• v.33 no.3
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• pp.763-769
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• 2012

We investigated the width (N) dependence on the magnetization of N-ZSiC NR with electron and hole doping on the basis of systematic DFT calculations. The critical values of the upper and down critical concentration to give the maximum and zero magnetic moment at edge Si/C atoms by electron/hole doping ($x_{up,e}$, $x_{down,e}$, $x_{up,h}$, and $x_{down,h}$) depend on the width of N-ZSiC NR. Moreover, due to $x_{up,e}\;{\neq}\;x_{up,h}$ and $x_{down,e}\;{\neq}\;x_{down,h}$, the electron and hole doping effect are asymmetry, i.e, the critical electron doping value ($x_{down,e}$) is smaller than the critical hole doping value ($x_{down,h}$) and is almost independent of the width of NZSiC NR though the other critical values of the electron and hole doping that influence the magnetization of N-ZSiC NR depend on the width. It was also found that at $x_{down,e}$ or $x_{down,h}$ doping, the N-ZSiC NR turns into unusual non-magnetic metallic state. The magnetic behavior was discussed based on the band structures and projected density of states (PDOS) under the effect of electron/hole doping.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.344-345
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• 2012

The Gate-Induced-Drain-Leakage (GIDL) current with channel doping and width dependence are characterized. The GIDL currents are found to increase in MOSFETs with higher channel doping levels and the observed GIDL current is generated by the band-to-band-tunneling (BTBT) of electron through the reverse-biased channel-to-drain p-n junction. A BTBT model is used to fit the measured GIDL currents under different channel-doping levels. Good agreement is obtained between the modeled results and experimental data. The increase of the GIDL current at narrower widths in mainly caused by the stronger gate field at the edge of the shallow trench isolation (STI). As channel width decreases, a larger portion of the GIDL current is generated at the channel-isolation edge. Therefore, the stronger gate field at the channel-isolation edge causes the total unit-width GIDL current to increases for narrow-width devices.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.319-319
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• 2012

현재 폭넓게 이용되고 있는 STI (Shallow Trench Isolation) 공정에서 active edge 부분에 발생하는 기생 transistor의 subthreshold hump 특성을 제어하는 연구가 활발히 이루어지고 있다. 일반적으로 STI 공정을 이용하는 MOSFET에서 active edge 부분의 얇게 형성된 gate oxide, sharp한 active edge 형성, STI gap-fill 공정 중에 생기는 channel dopant out-diffusion은 subthreshold hump 특성의 주된 요인이다. 이와 같은 문제점을 해결하기 위해 active edge rounding process와 channel dopant compensation의 implantation을 이용하여 subthresold hump 특성 개선을 연구하였다. 본 연구는 STI 공정에 필요한 wafer와 phosphorus를 함유한 wafer를 한 chamber 안에서 auto-doping하는 방법을 이용하여 subthresold hump 특성을 구현하였다. phosphorus를 함유한 wafer에서 빠져나온 phosphorus가 STI 공정중인 wafer로 침투하여, active edge 부분의 channel dopant인 boron 농도를 상대적으로 낮춰 active edge 부분의 가 감소하고 leakage current를 증가시킨다. transistor의 channel length, gate width이고, wafer#No가 클수록 phosphorous를 함유한 wafer까지의 거리는 가까워진다. wafer #01은 hump 특성이 없고, wafer#20은 에서 심한 subthreshold hump 특성을 보였다. channel length 고정, gate width를 ~으로 가변하여 width에 따른 영향을 실험하였다. active 부분에 대한 SCM image로 확인된 phosphorus에 의한 active edge 부분의 boron 농도 감소와 gate width vs curve에서 확인된 phosphorus에 의한 감소가 narrow width로 갈수록 커짐을 확인하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.4
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• pp.199-204
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• 2016

This paper was proposed floating island power MOSFET for lowering on state resistance and the proposed device was maintained 600 V breakdown voltage. The electrical field distribution of floating island power MOSFET was dispersed to floating island between P-base and N-drift. Therefore, we designed higher doping concentration of drift region than doping concentration of planar type power MOSFET. And so we obtain the lower on resistance than on resistance of planar type power MOSFET. We needed the higher doping concentration of floating island than doping concentration of drift region and needed width and depth of floating island for formation of floating island region. We obtained the optimal parameters. The depth of floating island was $32{\mu}m$. The doping concentration of floating island was $5{\times}1,012cm^2$. And the width of floating island was $3{\mu}m$. As a result of designing the floating island power MOSFET, we obtained 723 V breakdown voltage and $0.108{\Omega}cm^2$ on resistance. When we compared to planar power MOSFET, the on resistance was lowered 24.5% than its of planar power MOSFET. The proposed device will be used to electrical vehicle and renewable industry.

• Journal of the Korean Institute of Telematics and Electronics
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• v.22 no.6
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• pp.58-62
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• 1985

Analytical threshold voltage model of small size ion-implanted MOSFET's is proposed. Yau's model which is only applicable to MOSFET's with constant doping concentration was modified to handle the MOSFET's with nonuniform channel doping concentration and bird's beak, whereby the short and narrow-channel effect was quantitively described. Threshold voltage model for short-channel MOSFET's was derived by approximating the SUPREM result of channel impurity profile to a 2-step profile, and the narrow width be-haviour was successfully described using thr'weighting factor'to accommodate the doping profile in the bird's beak region.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.4
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• pp.121-128
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• 1996

The impact ionization rate of thethighly-doped AlGaAs/GaAs quantum well structure is calculated, which is an important parameter ot design theinfrared detector APD and the novel neural device. In conjunction with ensemble monte carlo method and quantum mechanical treatment, we analyze the effects of the parameters of quantum well structure on the impact ionization rate. Since the number of the occupied subbands increases while the energy of the subbands decreases as the width of quantum well increases, the impact ionization rate increases in the range of th esmall well width but gradually the increament slows down and is finally saturated. Due to the effect of the energy of the injected electrons into the quantum well and the tunneling through the barrier, the impact ionization rate increases for the range of the small barrier width and decreases for the range of the large barrier width. Thus, there exists a barrier width to maximize the impact ionzation rate for a mole fraction x, and the barrier width moves to the larger vaue as the mole fraction x increases. The impact ionization rate is much more sensitive to the variation of the doping density than that of the other quantum well parameters. We found that there is a limit of the doping density to confine the electronics in the quantum well effectively.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.10a
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• pp.879-882
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• 2015

In this work, we have analyzed the characteristics of vertical nanowire GAA MOSFET according to channel width and the type of channel doping through the simulation. First, we compared and analyzed the characteristics of designed structures which have tilted shapes that ends of drains are fixed as 20nm and ends of sources are 30nm, 50nm, 80nm and 110nm. Second, we designed the rectangular structure which has uniform width of drain, channel and source as 50nm. We used it as a standard and designed trapezoidal structure which is tilted so that the end of drain became 20nm and reverse trapezoidal structure which is tilted so that the end of source became 20nm. We compared and analyzed the characteristic of above three structures. For the last, we used the rectangular structure, divided its channel as five parts and changed the type of the five parts of doping concentration variously. In the first simulation, when the channel width is the shortest, in the second, when the structure is trapezoid, in the third, when the center of channel is high doped show the best characteristics.

• Current Photovoltaic Research
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• v.2 no.3
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• pp.120-123
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• 2014

Thermal doping method using furnace is generally used for solar-cell wafer doping. It takes a lot of time and high cost and use toxic gas. Generally selective emitter doping using laser, but laser is very high equipment and induce the wafer's structure damage. In this study, we apply atmospheric pressure plasma for solar-cell wafer doping. We fabricated that the atmospheric pressure plasma jet injected Ar gas is inputted a low frequency (1 kHz ~ 100 kHz). We used shallow doping wafers existing PSG (Phosphorus Silicate Glass) on the shallow doping CZ P-type wafer (120 ohm/square). SIMS (Secondary Ion Mass Spectroscopy) are used for measuring wafer doping depth and concentration of phosphorus. We check that wafer's surface is not changed after plasma doping and atmospheric pressure doping width is broaden by increase of plasma treatment time and current.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.3
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• pp.332-336
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• 2024

High-energy bandgap material silicon carbide (SiC) is gaining attention as a next-generation power semiconductor material, and in particular, SiC-based MOSFETs are developed as representative power semiconductors to increase the breakdown voltage (BV) of conventional planar structures. However, as the size of SJ (Super Junction) MOSFET devices decreases and the depth of pillars increases, it becomes challenging to uniformly form the doping concentration of pillars. Therefore, a structure with different doping concentrations segmented within the pillar is being researched. Using Silvaco TCAD simulation, a SJ VVD (vertical variation doping profile) MOSFET with three different doping concentrations in the pillar was studied. Simulations were conducted for the width of the pillar and the doping concentration of N-epi, revealing that as the width of the pillar increases, the depletion region widens, leading to an increase in on-specific resistance (R_on,sp) and breakdown voltage (BV). Additionally, as the doping concentration of N-epi increases, the number of carriers increases, and the depletion region narrows, resulting in a decrease in R_on,sp and BV. The optimized SJ VVD MOSFET exhibits a very high figure of merit (BFOM) of 13,400 KW/cm², indicating excellent performance characteristics and suggesting its potential as a next-generation highperformance power device suitable for practical applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.177-180
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• 2004

발광층에 Alq3와 rubrene을 mixed host로 사용하고 DCJTB를 형광 dopant로 사용한 다층 박막 구조의 red OLEDs를 제작하였다. 소자의 구조는 $ITO:Anode(120nm)/{\alpha}-NPD:HTL(40nm)/Alq_3+Rubrene(mixed\;host\;1:1)+DCJTB(red\;dopant\;3%)+:EML(20nm)/Alq_3:ETL(40nm)/MgAg(Mg\;5%\;wt):Cathode(150nm)$ 로서 EML내부에 DCJTB를 Totally Doping Method와 Dotted-Line Doping Method의 두 가지 방법으로 도핑 하였다. Mixed host구조에 DCJTB를 6구간으로 나누어 Dotted Line Doping한 소자는 luminance yield가 $9.2cd/A@10mA/cm^2$ 이었다. 이 소자는 DCJTB만을 Totally Doping한 소자의 luminance yield $3.2cd/A@10mA/cm^2$에 비해 약 190%정도의 높은 효율 향상을 보였다. 또한 $10mA/cm^2$에 도달하는 전압은 5.5V Vs. 8.5V로서 mixed host를 사용한 소자에서 약 3V정도 구동전압이 낮아지는 효과가 있었다. 발광 스펙트럼의 Full Width Half Maximum(FWHM)은 각각 56.6nm와 61nm로서 rubrene을 mixed host로 사용한 소자에서 높은 색 순도를 얻을 수 있었다. 이러한 성능의 향상은 $Alq_3$와 혼합된 rubrene에 의한 낮은 전하주 입장벽, 높은 전류밀도에서 나타나는 발광감쇄현상의 감소, 그리고 발광층의 DLD구조에 의한 전하의 trap & confinement 에 따른 발광 exciton의 형성확률이 증가한데서 나타났다고 생각된다.