• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1442-1444
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• 1994

The short channel poly-Si TFT is important in aspect of transistor characteristics, packing density and aperture ratio. In this paper, we have reported the degradation phenomena of short channel poly-Si TFT's which had significantly degraded device parameters, such as threshold voltage shift and a great asymmetric degradation, due to gate and drain electrical stress. The reduced effective channel length and expanded depletion region may be the main reason of these significant device parameters.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.12
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• pp.91-99
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• 1994

We used CMOS current mirror and differenial amplifier to find out how the degradation of each devices in circuit affect total circuit performance. The devices in circuit wer degraded by hot-carrier generated during circuit operation and total circuit performance were changed according to the change of each device parameters. To examine the circuit performance phenomena of current mirror, we analyzed three diffent kinds of current mirrors and made correlation model between circuit performance and stressed device parameters, and compare hot-carrier immunity of these circuits. Also we analyzed how the performance of differential amplifier degraded from the initial value after hot-carrier stress incircuit operations.

• Journal of the Korean Vacuum Society
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• v.21 no.3
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• pp.164-170
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• 2012

The dependance of degradation on the blue-peak wavelength is investigated with the blue light-emitting diode (LED) of InGaN/GaN with respect to the optical and the electrical characteristics of the devices. The LED devices emitting the blue-peak wavelength ranging from 437 nm to 452 nm is prepared to be stressed for a long aging time with three different currents of 60 mA, 75 mA and 90 mA, respectively. The degradation of optical intensity is observed with and without phosphor in the devices. The device without phosphor has been degraded significantly as the wavelength of blue-peak is decreased while the optical intensity of LED device with phosphor become less sensitive than that of device without phosphor. The electrical property does not depend on the emission peak wavelength. However, the series-resistance of LED device is slowly increased as the aging time is increased. The deformation of device is observed severely the short wavelength of blue-peak even with the same current since the short wavelength is absorbed substantially at the materials of device during the aging time. Consequently, in order to enhance the lifetime of LED devices, it is important to understand the optical degradation property of the materials against the specific wavelengths emitted from the blue chip.

• Journal of the Korea Society of Computer and Information
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• v.9 no.1
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• pp.9-15
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• 2004

New WSW(Wrap Side Wall) is proposed to decrease junction electric field in this paper. WSW process is fabricated after first gate etch, followed NM1 ion implantation and deposition & etch nitride layer. New WSW structure has buffer layer to decrease electric field. Also we compared the hot carrier characteristics of WSW and conventional. Also, we design a test pattern including pulse generator, level shifter and frequency divider, so that we can evaluate AC hot carrier degradation on-chip. It came to light that the universality of the hot carrier degradation between DC and AC stress condition exists, which indicates that the device degradation comes from the same physical mechanism for both AC and DC stress. From this universality, AC lifetime under circuit operation condition can be estimated from DC hot carrier degradation characteristics.

• ETRI Journal
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• v.35 no.6
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• pp.1068-1074
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• 2013

This paper proposes an additional forward error correction (FEC) layer to compensate for the defectiveness inherent in the conventional FEC layer in the Long Term Evolution specifications. The proposed additional layer is called a graceful degradation (GD)-FEC layer and maintains desirable service quality even under burst data loss conditions of a few seconds. This paper also proposes a non-delayed decoding (NDD)-GD-FEC layer that is inherent in the decoding process. Computer simulations and device-based tests show a better loss recovery performance with a negligible increase in CPU utilization and occupied memory size.

• ETRI Journal
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• v.30 no.6
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• pp.833-843
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• 2008

The effect of forward and reverse electrostatic discharge (ESD) on the electro-optical characteristics of oxide vertical-cavity surface-emitting lasers is investigated using a human body model for the purpose of understanding degradation behavior. Forward ESD-induced degradation is complicated, showing three degradation phases depending on ESD voltage, while reverse ESD-induced degradation is relatively simple, exhibiting two phases of degradation divided by a sudden distinctive change in electro-optical characteristics. We demonstrate that the increase in the threshold current is mainly due to the increase in leakage current, nonradiative recombination current, and optical loss. The decrease in the slope efficiency is mainly due to the increase in optical loss.

• Proceedings of the Korean Reliability Society Conference
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• 2011.06a
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• pp.79-85
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• 2011

LED(Light Emitting Diode) is a powerful device used in applications as diverse as replacements for aviation lighting, automotive lighting as well as in traffic signals. This study is to propose a prediction system based on the degradation model of LED which is determined by combining scale and shape parameter. The degradation model is analysed goodness of fit test using calculated R-square, and is compared with previous models. A LED prediction system using degradation model is developed to automate estimations of degradation parameters and lifetimes.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.11
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• pp.62-69
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• 1998

The general degradation model has been applied to analyze the hot carrier induced degradation of the DC and RF characteristics of RF-nMOSFET. The degradation of cut-off frequency has been severer than the degradation of bulk MOSFET drain current. The value of the degradation rate n and the degradation parameter m for RF-nMOSFET has been equal to those for bulk MOSFET. The decrease of device degradation with the increase of fingers could be explained by the large source/drain parasitic resistance and drain saturation voltage. It has been also found that the RF performance degradation could be explained by the decrease of $g_{m}$ and $C_{gd}$ and the increase of $g_{ds}$ after stress. The degradation of the DC and RF characteristics of RF-nMOSFET could be predicted by the measurement of the substrate current.t.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.10a
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• pp.749-752
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• 2014

The device performance of n-channel MuGFET with different fin width, existence of spacer and channel length has been characterized. Tri-Gate structure(fin number=10) has been used. There are four kinds of Tri-Gate with fin width=55nm with spacer, fin width=70nm with spacer, fin width=55nm without spacer, fin width=70nm without spacer. DIBL, subthreshold swing, Vt roll-off, (above Short Channel Effect)and hot carrier stress degradation have been measured. From the experiment results, short Channel Effect with spacer was decreased, hot carrier degradation with spacer and narrow fin width was decreased. Therefore, layout of LDD structure with spacer and narrow fin width is desirable in short channel effect and hot carrier degradation.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.9
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• pp.1614-1618
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• 2007

We have demonstrated the experimental results to obtain the immunity of FN (Fowler Nordheim) stress for S-RCAT (Spherical-Recess Cell Array Transistor) which has been employed to meet the requirements of data retention time and propagation delay time for sub-100-nm mobile DRAM (Dynamic Random Access Memory). Despite of the same S-RCAT structure, the immunity of FN stress of S-RCAT depends on the process condition of gate oxidation. The S-RCAT using DPN (decoupled plasma nitridation) process showed the different degradation of device properties after FN stress. This paper gives the mechanism of FN-stress degradation of S-RCAT and introduces the improved process to suppress the FN-stress degradation of mobile DRAM.