• 제목/요약/키워드: Deposition reduction

검색결과 490건 처리시간 0.03초

$Si_2H_6$를 이용한LPCVD 실리콘 박막의 결정 성장 및 구조적 성질에 관한 연구 (A Study on the Grain Growth and Structure Properties of LPCVD Films Using $Si_2H_6$ GAS)

  • 홍찬희;박창엽
    • 대한전기학회논문지
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    • 제40권7호
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    • pp.670-674
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    • 1991
  • This paper presents the material properties of LPCVD silicon films formed using Si2H6 gas at various deposition temperatures. To study the structural properties depending on the deposition temperature, XRD, EBD and TEM analyses were used. The maximum grain size in this experiment was obtained at the deposition temperature of 485ø C. It is discussed that LPCVD films formed below the deposition temperature of 485ø C are promising for low temperature TFT applications. The enhancement of the film characteristics results from the reduction of grain boundary density. We also observed that the film properties of Si2H6 at 600ø C was quite different from those of Si H4 at 600ø C. It has shown that the grain structure from a TEM analysis was elliptical and not dependent on the deposition temperature.

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Optimization of the Material and Structure of Component Parts for Reducing the Number of Impurity Particles in CVD Process

  • Kim, Won Kyung;Woo, Ram;Roh, Jong Wook
    • 한국세라믹학회지
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    • 제56권3호
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    • pp.277-283
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    • 2019
  • We have examined minimization of the number of impurity particles by replacing the load-lock chamber materials of the chemical vapor deposition equipment through optimization of the pumping method in the deposition chamber. In order to reduce the number of impurity particles in the chamber, the load-lock spacer material was changed from monomer casting nylon to Torlon. Furthermore, we controlled the pumping speed and number of pumping ports, which resulted in a reduction in the impurity particle generation from 2.67% to 0.52%. This study revealed that the selection of the material for the parts of a chemical vapor deposition chamber can minimize particle generation, thereby presenting a method of optimization method of the chemical vapor deposition chamber.

식생모형에 의한 항로매몰 저감 특성 (Reduction Effect for Deposition in Navigation Channel with Vegetation Model)

  • 이성대;김성득;김익현
    • 한국항해항만학회지
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    • 제36권8호
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    • pp.659-664
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    • 2012
  • 연안 해역에 분포하는 식생은 연안 생태계의 다양성을 유지하면서 해저에 고정되어 이들 연안식생은 파랑을 감쇠할 뿐 만 아니라 표사이동 및 해저변동을 저감하는 역할을 하고 있다. 이같은 관점에서 식생모형은 경관이나 연안해역에 영향을 최소화 하면서 파랑을 저감하거나 해저바닥을 안정시키는 효과적적인 방법 중의 하나이다. 본 연구에서는 파랑에 의한 항로 매몰특성을 해석하기 위해 수치 및 수리모형실험을 통해 검토하였으며 이를 위해 사용된 수치모형은 항로 전 후면부에 식생 유무에 따른 파랑감쇠 및 해저지형 변동 특성을 해석하기 위해 개발되었다. 수치모형실험의 결과와 비교를 위해 항로매몰 저감을 위한 식생모형의 효과를 파악하기 위하여 수리모형실험을 수행하였으며, 이들 실험 결과 식생이 항로 매몰 저감에 효과적임을 확인하였다. 그리고 수치 및 수리모형 실험 결과가 대체적으로 잘 일치하고 있음을 알 수 있었다.

$SiH_4$ 환원에 의한 Selective CVD-W막 특성에 대한 증착시간과 압력의 효과 (Effect of Deposition Time and Pressure on Properties of Selective CVD-W by $SiH_4$ Reduction)

  • 이종무;이강욱;박선후
    • 한국재료학회지
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    • 제1권4호
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    • pp.177-183
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    • 1991
  • $SiH_4$환원에 의한 선택성 CVD-W 공정에서 증착시간과 증착압력에 따른 W막 특성의 변화를 조사하였다. $300^{\circ}C$, 100mtorr이하에서 W막이 Si기판 전면에 증착되는 데에 약 30초의 시간이 걸렸고, 증착시간에 따라 막 두께는 초기에는 직선적으로, 나중에는 포물선적으로 증가하였으며, 면저항은 초기에는 급히, 나중에는 서서히 감소하는 경향을 나타내었다. 50-300mtorr의 압력범위에서 압력의 증가에 따라 결정립도(grain size)는 별로 변하지 않았으나 결정립계(grain boundary)의 윤곽이 불확실해지는 경향을 나타내었다. 또한 이 압력범위에서는 ${\alpha}-W$만 나타날 뿐 ${\beta}-W$의존재는 발견되지 않았다. 증차압력의 증가에 따라 W막의 증착속도가 증가하고, 비저항도 증가하는 경향을 보였다. AES 분석결과에 의하면, 증착압력온 Si/W의 조성비나 W/Si계면에서의 실리사이드화에는 큰 영향을 미치지 않는 것으로 나타났다.

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Fabrication of Metal-Semiconductor Interface in Porous Silicon and Its Photoelectrochemical Hydrogen Production

  • Oh, Il-Whan;Kye, Joo-Hong;Hwang, Seong-Pil
    • Bulletin of the Korean Chemical Society
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    • 제32권12호
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    • pp.4392-4396
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    • 2011
  • Porous silicon with a complex network of nanopores is utilized for photoelectrochemical energy conversion. A novel electroless Pt deposition onto porous silicon is investigated in the context of photoelectrochemical hydrogen generation. The electroless Pt deposition is shown to improve the characteristics of the PS photoelectrode toward photoelectrochemical $H^+$ reduction, though excessive Pt deposition leads to decrease of photocurrent. Furthermore, it is found that a thin layer (< 10 ${\mu}m$) of porous silicon can serve as anti-reflection layer for the underlying Si substrate, improving photocurrent by reducing photon reflection at the Si/liquid interface. However, as the thickness of the porous silicon increases, the surface recombination on the dramatically increased interface area of the porous silicon begins to dominate, diminishing the photocurrent.

Electrical and Optical Properties of Zinc Oxide Thin Films Deposited Using Atomic Layer Deposition

  • Kim, Jeong-Eun;Bae, Seung-Muk;Yang, Hee-Sun;Hwang, Jin-Ha
    • 한국세라믹학회지
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    • 제47권4호
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    • pp.353-356
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    • 2010
  • Zinc oxide (ZnO) thin films were deposited using atomic layer deposition. The electrical and optical properties were characterized using Hall measurements, spectroscopic ellipsometry and UV-visible spectrophotometry. The electronic concentration and the mobility were found to be critically dependent on the deposition temperature, exhibiting increased resistivity and reduced electronic mobility at low temperature. The corresponding optical properties were measured as a function of photon energy ranging from 1.5 to 5.0 eV. The simulated extinction coefficients allowed the determination of optical band gaps, i.e., ranging from 3.36 to 3.41 eV. The electronic carrier concentration appears to be related to the reduction in the corresponding band gap in ZnO thin films.

Aerosol Deposition에 의한 Embedded Capacitor의 제조 및 특성 평가 (Product and Properties of Embedded Capacitor by Aerosol Deposition)

  • 유효선;조현민;박세훈;이규복;김형준
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.313-313
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    • 2008
  • Aerosol Deposition(AD) method is based on the impact consolidation phenomenon of ceramic fine particles at room temperature. AD is promising technology for the room temperature deposition of the dielectrics thin films with high quality. Embedding of passive components such as capacitors into printed circuit board is becoming an important strategy for electronics miniaturization and device reliability, manufacturing cost reduction. So, passive integration using aerosol deposition. In this study, we examine the effects of the characteristics of raw powder on the thickness, roughness, electrical properties of $BaTiO_3$ thin films. Thin films were deposited on the copper foil and copper plate. Electrical and material properties was investigated as a change of annealing temperature. We final aim the effects of before and after of laminated on the electrical properties and suit of embedded capacitor.

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Diethylzinc를 Source로 사용하는 화학증착법(MOCVD)에 의한 ZnO 박막의 제조 및 물성에 관한 연구 (Preparation and Properties of ZnO Thin Films by Metal-Organic Chemical Vapor Deposition Using Diethylzinc Source)

  • 김경준;김광호
    • 한국세라믹학회지
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    • 제28권8호
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    • pp.585-592
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    • 1991
  • ZnO films were deposited onto Corning glass 7059 substrate in the temperature range from $200^{\circ}C$ to $450^{\circ}C$ by chemical vapor deposition technique using the hydrolysis of Diet ylzinc (DEZ). As the deposition temperature increased from $200^{\circ}C$ to $350^{\circ}C$, the deposition rate increased with the apparent activation energy of ∼23kJ/mole. Further increase of the deposition temperature above $400^{\circ}C$, however, resulted in a reduction of the rate. It was found that ZnO film grew with a strong C-axis preferred orientation at the temperature of $400^{\circ}C$. As the deposition temperature increased, the film resistivity decreased down to ∼0.2 $\Omega$cm at $450^{\circ}C$. The electrical resistivity was governed more likely by electron concentration rather than by electron mobility. Average optical transmission of the films in the optical wavelength range of 400 nm to 900 nm was over 90% and the optical energy band gap of 3.28∼3.32 eV was obtained from the direct transition.

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SiH$_4$를 이용한 텅스텐의 화학증착시 압력증가가 증착에 미치는 영향 (The Effect of Pressure Increase on the Deposition of Tungsten by CVD using SiH4)

  • 박재현;이정중;금동화
    • 한국표면공학회지
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    • 제26권1호
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    • pp.3-9
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    • 1993
  • Chemical vapor deposited tungsten films were formed in a cold wall reactor at pressures higher (10~120torr) than those conventionally employed (<1torr). SiH4, in addition to H2, was used as the reduction gas. The effects of pressure and reaction temperature on the deposition rate and morphology of the films were ex-amined under the above conditions. No encroachment or silicon consumption was observed in the tungsten de-posited specimens. A high deposition rate of tungsten and a good step coverage of the deposited films were ob-tained at 40~80 torr and at a temperature range of $360~380^{\circ}C$. The surface roughness and the resistivity of the deposited film increased with pressure. The deposition rate of tungsten increased with the total pressure in the reaction chamber when the pressure was below 40 torr, whereas it decreased when the total pressure ex-ceedeed 40 torr. The deposition rate also showed a maximum value at $360^{\circ}C$ regardless of the gas pressure in the chamber. The results suggest that the deposition mechanism varies with pressure and temperature, the surface reac-tion determines the overall reaction rate and (2) at higher pressures(>40 torr) or temperatures(>36$0^{\circ}C$), the rate is controlled by the dtransportation rate of reactive gas molecules. It was shown from XRD analysis that WSi2 and metastable $\beta$-W were also formed in addition to W by reactions between WF6 and SiH4.

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Organic fouling in forward osmosis (FO): Membrane flux behavior and foulant quantification

  • Xia, Shengji;Yao, Lijuan;Yang, Ruilin;Zhou, Yumin
    • Membrane and Water Treatment
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    • 제6권2호
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    • pp.161-172
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    • 2015
  • Forward osmosis (FO) is an emerging membrane technology with potential applications in desalination and wastewater reclamation. The osmotic pressure gradient across the FO membrane is used to generate water flux. In this study, flux performance and foulant deposition on the FO membrane were systematically investigated with a co-current cross-flow membrane system. Sodium alginate (SA), bovine serum albumin (BSA) and tannic acid (TA) were used as model foulants. Organics adsorbed on the membrane were peeled off via oscillation and characterized by Fourier transform infrared (FTIR) spectroscopy and scanning electron microscopy (SEM). When an initial flux of $8.42L/m^2h$ was applied, both flux reduction and foulant deposition were slight for the feed solution containing BSA and TA. In comparison, flux reduction and foulant deposition were much more severe for the feed solution containing SA, as a distinct SA cake-layer was formed on the membrane surface and played a crucial role in membrane fouling. In addition, as the initial SA concentration increased in FS, the thickness of the cake-layer increased remarkably, and the membrane fouling became more severe.