• Title/Summary/Keyword: Deposit thickness

Search Result 160, Processing Time 0.031 seconds

Effects of thickness of GIZO active layer on device performance in oxide thin-film-transistors

  • Woo, C.H.;Jang, G.J.;Kim, Y.H.;Kong, B.H.;Cho, H.K.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2009.06a
    • /
    • pp.137-137
    • /
    • 2009
  • Thin-film transistors (TFTs) that can be prepared at low temperatures have attracted much attention due to the great potential for flexible electronics. One of the mainstreams in this field is the use of organic semiconductors such as pentacene. But device performance of the organic TFTs is still limited by low field effect mobility or rapidly degraded after exposing to air in many cases. Another approach is amorphous oxide semiconductors. Amorphous oxide semiconductors (AOSs) have exactly attracted considerable attention because AOSs were fabricated at room temperature and used lots of application such as flexible display, electronic paper, large solar cells. Among the various AOSs, a-IGZO was considerable material because it has high mobility and uniform surface and good transparent. The high mobility is attributed to the result of the overlap of spherical s-orbital of the heavy pest-transition metal cations. This study is demonstrated the effect of thickness channel layer from 30nm to 200nm. when the thickness was increased, turn on voltage and subthreshold swing were decreased. a-IGZO TFTs have used a shadow mask to deposit channel and source/drain(S/D). a-IGZO were deposited on SiO2 wafer by rf magnetron sputtering. using power is 150W, working pressure is 3m Torr, and an O2/Ar(2/28 SCCM) atmosphere at room temperature. The electrodes were formed with Electron-beam evaporated Ti(30nm) and Au(70nm) structure. Finally, Al(150nm) as a gate metal was evaporated. TFT devices were heat treated in a furnace at $250^{\circ}C$ in nitrogen atmosphere for an hour. The electrical properties of the TFTs were measured using a probe-station to measure I-V characteristic. TFT whose thickness was 150nm exhibits a good subthreshold swing(S) of 0.72 V/decade and high on-off ratio of 1E+08. Field effect mobility, saturation effect mobility, and threshold voltage were evaluated 7.2, 5.8, 8V respectively.

  • PDF

Analysis of Heat Generation Induced by Electron Impact in X-Ray Tube Using FEM and Monte Carlo Method (유한요소법과 몬테카를로법을 이용한 X선 튜브에서 전자빔 충격에 의한 열 발생 해석)

  • Kim, Heungbae;Yoo, Tae Jae
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.32 no.4
    • /
    • pp.387-394
    • /
    • 2015
  • We analyze heat generation as well as temperature distribution induced by accelerated electron impact on a target in a closed x-ray tube. For the sake of accuracy, we use Monte carlo analysis. This method gives accurate energy deposit in a medium with additional information such as secondary and backscattered electron as well as their paths. A Tungsten coated layer is divided by small rectangular cell which accumulate energy loss of primary electron beam. The cells and their accumulated energy datum are used for the input of finite element analysis. The Maximum temperature rising and temperature distribution were analyzed by transient heat analysis. Some temperature parameters such as target size and coating thickness were varied to investigate temperature sensitivity. Temperatures were compared each other to find primary variable that affect temperature rising on the x-ray target. The results will be helpful in development highresolution x-ray tube and related industries.

Porous Nickel-Tin Nano-Dendritic Electrode for Rechargeable Lithium Battery (리튬 이차 전지를 위한 다공성 니켈-주석 나노 수지상 전극)

  • Jung, Hye-Ran;Shin, Heon-Cheol
    • Korean Journal of Materials Research
    • /
    • v.20 no.11
    • /
    • pp.592-599
    • /
    • 2010
  • A porous nickel-tin nano-dendritic electrode, for use as the anode in a rechargeable lithium battery, has been prepared by using an electrochemical deposition process. The adjustment of the complexing agent content in the deposition bath enabled the nickel-tin alloys to have specific stoichiometries while the amount of acid, as a dynamic template for micro-porous structure, was limited to a certain amount to prevent its undesirable side reaction with the complexing agent. The ratios of nickel to tin in the electro-deposits were nearly identical to the ratios of nickel ion to tin ion in the deposition bath; the particle changed from spherical to dendritic shape according to the tin content in the deposits. The nickel to tin ratio and the dendritic structure were quite uniform throughout the thickness of the deposits. The resulting nickel-tin alloy was reversibly lithiated and delithiated as an anode in rechargeable lithium battery. Furthermore, the resulting anode showed much more stable cycling performance up to 50 cycles, as compared to that resulting from dense electro-deposit with the same atomic composition and from tin electrodeposit with a similar porous structure. From the results, it is expected that highly-porous nickel-tin alloys presented in this work could provide a promising option for the high performance anode materials for rechargeable lithium batteries.

The Fabrication of Al-Cu Alloy Nano Powders by a New Method Combining Electrodeposition and Electrical Wire Explosion (전기도금법과 전기선폭발법을 이용한 Al-Cu 합금 나노분말제조)

  • Park Je-Shin;Suh Chang-Youl;Chang Han-Kwon;Lee Jae-Chun;Kim Won-Baek
    • Journal of Powder Materials
    • /
    • v.13 no.3 s.56
    • /
    • pp.187-191
    • /
    • 2006
  • Al-Cu alloy nano powders were produced by the electrical explosion of Cu-plated Al wires. The composition and phase of the alloy could be controlled by varying the thickness of Cu deposit on Al wire. When the Cu layer was thin, Al solid solution and $CuAl_2$ were the major phases. As the Cu layer becomes thicker, Al diminished while $Al_4Cu_9$ phase prevailed instead. The average particle size of Al-Cu nano powders became slightly smaller from 63 nm to 44 nm as Cu layer becomes thicker. The oxygen content of Al-Cu powder decreased linearly with Cu content. It is well demonstrated that the electrodeposition combined with wire explosion could be simple and economical means to prepare variety of alloy and intermetallic nano powders.

Characteristic Nature of the Unconformity between Holocene and Late Pleistocene in the Tidal Deposits along the Western Coast of Korea

  • Park, Yong-Ahn
    • The Korean Journal of Quaternary Research
    • /
    • v.17 no.2
    • /
    • pp.13-14
    • /
    • 2003
  • It is generally well known that Quaternary is characteristic geologically in terms of glacial and interglacial repeats and their associated unconformity formation. This paper deals with the first finding of the characteristic and significant meaningful unconformity between Holocene and late Pleistocene, which implies submergence and emergence of the tidal sedimentary basin along the western coastal zone of Korea during interglacial stage(IOS-5e) and glacial time(IOS-2). The stratigraphy of intertidal deposits in the Haenam Bay, western coast of Korea shows two depositional sequence units (Unit I of Holocene and Unit II of late Pleistocene) bounded by an erosional surface of disconformity. The disconformity is related to the latest Pleistocene sea-level lowstands (probably during the LGM). The Unit II is interpreted as intertidal deposit showing tidal sedimentary structures and crab burrow ichnology and has two parts (the upper part and the lower part) showing different lithology and character. The upper part of Unit II shows characteristic subaerial exposure features (emergence) and its related lithology. Such subaerially exposed upper part (more or less 4m to 5m in thickness) is characterized by yellow-brownish sediment color, cryoturbat-ed structure, crab burrow ichnofacies and high value of shear strength. Geochemical and clay mineral analyses of the upper part sediments also indicate subaerial exposure and weathering. In particular, very high value of magnetic susceptibility of the upper part in comparison to that of the lower part is interpreted as pedogenetic weathering during the subaerial exposure period.

  • PDF

Characteristics of Sn-Pb Electroplating and Bump Formation for Flip Chip Fabrication (전해도금에 의해 제조된 플립칩 솔더 범프의 특성)

  • Hwang, Hyeon;Hong, Soon-Min;Kang, Choon-Sik;Jung, Jae-Pil
    • Journal of Welding and Joining
    • /
    • v.19 no.5
    • /
    • pp.520-525
    • /
    • 2001
  • The Sn-Pb eutectic solder bump formation ($150\mu\textrm{m}$ diameter, $250\mu\textrm{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Pb deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased wish increasing time. The plating rate became constant at limiting current density. After the characteristics of Sn-Pb plating were investigated, Sn-Pb solder bumps were fabricated in optimal condition of $7A/dm^$. 4hr. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallurgy). The shear strength of Sn-Pb bump after reflow was higher than that of before reflow.

  • PDF

Characteristics of Copper Plating Solutions for Electroforming of Microcircuit (미세 배선 성형을 위한 전주용 동도금액의 특성)

  • Park, Hae-Deok;Jang, Do-Yeon;Gang, Seong-Gun
    • Korean Journal of Materials Research
    • /
    • v.11 no.10
    • /
    • pp.820-832
    • /
    • 2001
  • In order to obtain the basic data on the optimum conditions of electroforming process for fabricating the micro wiring pattern for plate type micro- motor core, characteristics of plating bath and properties of deposits were studied with various copper plating baths which contain sulfate, fluoborate, pyrophosphate and cyanide salt, respectively. Cathodic polarization, throwing power, internal stress, texture and surface morphology of deposits were observed. Throwing power of plating solution is deeply related to the polarization curves and the values are in the range of +20∼20%. The order of values ate as follows- pyrophosphate, cyanide, sulfate and fluoborate bath. Internal stresses of deposits are tensile in all of the copper plating bath. Thickness of the deposits plated at the center of holes has the highest value in the pyrophosphate bath and K factor, ratio of height and width of deposit, is 1.44. It was confirmed that the pyrophosphate bath was the best one for the electroforming of wire pattern.

  • PDF

Process Control of Titanium Silicide Formation Using RTP (RTP를 사용한 타이타늄 실리사이드 형성의 공정 조절)

  • 이용재
    • The Journal of Korean Institute of Communications and Information Sciences
    • /
    • v.15 no.5
    • /
    • pp.399-405
    • /
    • 1990
  • Rapid Thermal Process(RTP) has been used to precisely control and study the reaction rate for the formation of refractory titanuium silicide. Samples were prepared by sputtering deposition layer of titanium on n-type, poly-deposit silicon wafers. The process were then sujected to a matrix of rapid time-temperature profile under nitrgen, argon gas ambient to precisely control the silicide formation. Reacted films were analyzed by the sheet resistance measursrement, SEM, ASR and X-ray diffraction. Results were shown that the resistivity of the silicide films are below 20u-cm and the thickness of silicide films are about two times than that of as-deposited titanium films. Silicidation ambient was likely to happen at the same tamperature-time condition for argon and nitrogen gas.

  • PDF

Fabrication of Highly Conductive Yarn using Electroless Nickel Plating (무전해 니켈 도금법을 이용한 고성능 도전사의 제조)

  • Hong, So-Ya;Lee, Chang-Hwan;Kim, Joo-Yong
    • Textile Coloration and Finishing
    • /
    • v.22 no.1
    • /
    • pp.77-82
    • /
    • 2010
  • Highly conductive yarn was successfully obtained using electroless nickel plating method with palladium activation. In the presence of palladium seed on surface of fibers as a catalyst, continuos nickel layer produced on surface of fibers by reducing $Ni${2+}$ ion in the electroless plating bath to $Ni^0$. It was found that the Pd-activation using $SnCl_2$ and $PdCl_2$ to deposit palladium seeds on the surface of fibers plays a key role in the subsequent electroless plating of nickel. It also found that electroless nickel plating on the fibers can induce the nickel-plated $ELEX^{(R)}$ fibers to improve the electrical conductivity of the fibers. The thickness of nickel coating layer on the Pd-activated $ELEX^{(R)}$ fibers and specific conductivity of the fiber were increased through electroless plating time. The temperature of nickel plating bath was very effective to enhance the nickel deposition rate.

HIGH TEMPERATURE SUPERCONDUCTING THIN FILMS PREP ARED BY PULSED LASER DEPOSITION

  • Park, Yong-Ki;Kim, In-Seon;Ha, Dong-Han;Hwang, Doo-Sup;Huh, Yun-Sung;Park, Jong-Chul
    • Journal of the Korean institute of surface engineering
    • /
    • v.29 no.5
    • /
    • pp.430-436
    • /
    • 1996
  • We have grown superconducting thin films on various substrates using a pulsed laser deposition (PLD) method. $YBa_2Cu_3O_7-\delta$ (YBCO) superconducting thin films with the superconducting transition temperature ($T_{c. offset}$) of 87K were grown on Si substrates using yittria-stabilized zirconia (YSZ) and $CeO_2$ double buffer layers. We have developed a large area pulsed laser deposition system. The system was designed to deposit up to 6 different materials on a large area substrate up to 7.5cm in diameter without breaking a vacuum. The preliminary runs of the deposition of YBCO superconducting thin films on $SrTiO_3$ substrate using this system showed a very uniform thickness profile over the entire substrate holder area. $T_{c}$ of the deposited YBCO thin film, however, was scattered depending on the position and the highest value was 85K.

  • PDF