• Korean Journal of Materials Research
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• v.15 no.1
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• pp.6-13
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• 2005

Copper based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or blackoxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. After fracture toughness testing, the fracture surface were analyzed by various equipment to investigate failure path. An adhesion model was suggested to explain the failure path formation. The adhesion model is based on the strengthening mechanism of fiber-reinforced composite. The present paper deals with the introduction of the adhesion model. The explanation of the failure path with the proposed adhesion model was introduced in the companion paper.

• Macromolecular Research
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• v.12 no.3
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• pp.282-289
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• 2004

We have extensively characterized the fluorescence behavior of unsaturated polyester (UP) resin in the absence and presence of a 1,3-bis-(l-pyrenyl)propane (BPP) fluorescent probe at various dynamic and isothermal cure histories by means of a steady-state fluorescence technique using a front-face illumination equipment. In addition, we explored the effect of the fluorescence intensity on the relaxation of the fluorescent probe in the UP resin by resting the dynamically and isothermally cured resin at ambient temperature and pressure for 24 h. The monomer fluorescence intensity, which has two characteristic peaks at 376 and 396nm, changed noticeably depending on the cure temperature and time and provided important information with respect to the molecular and photophysical responses upon curing. The result of the fluorescence study indicates that the increased local viscosity and restricted molecular mobility of the UP resin surrounding the BPP probe after curing are both responsible for the enhancement of the monomer fluorescence intensity. Our results also demonstrate that once the BPP probe has enough time to rearrange and become isolated prior to fluorescence, a sufficient amount of fluorescence is emitted. Therefore, we note that the fluorescence behavior of this UP resin system is influenced strongly by the relaxation process of the fluorescent probe in the resin as well as process used to cure the resin.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.37 no.2
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• pp.389-395
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• 2017

A study was carried out to improve the field implementation of asphalt surface reinforcement method which is a preventive maintenance. Mean Texture Depth (MTD) was measured to quantify the surface condition and used to determine the optimum application rate. Determining the application rate using MTD can reduce the material loss from 30% to 15%. In order to reduce the curing time to 30 minutes, the heat capacity of $317kcal/m^2$ is required. Therefore, the design capacity of the heating curing device requires more than 380,000 kcal/hr. The asphalt surface reinforcement method is preferably applied at a time when slight cracking occurs before the permanent deformation becomes serious. Through the analysis of the pavement survey data, it was decided to apply the surface reinforcement method at the crack rate of 3~4%. Heating the surface reinforcement agent to $50^{\circ}C$ improves workability and ensures sufficient penetration depth even at a crack width of 1 mm. The results will be utilized as basic data for the development of automated construction equipment for efficiency improvement.

• Journal of the Korean Wood Science and Technology
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• v.34 no.5
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• pp.42-51
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• 2006

The this study, the effect of rice husk flour (RHF) as scavenger on formaldehyde emission rate and formaldehyde content from urea-formaldehyde (UF) resin bonded RHF content wood particleboards (PB). Two type of particle size ($30{\mu}m$ and $300{\mu}m$) of RHF was premixed with the UF resin at 5% and 15% by weight. The performance of UF resins is greatly influenced by the curing characteristics in their curing processing. The curing behavior was monitored activation energy ($E_a$) by DSC and pH variation according to RHF contents. PB with dimensions of $27cm{\times}27cm{\times}0.7cm$ was prepared at a specific gravity of 0.75 using $E_1$ and $E_2$ class UF resins. Formaldehyde emission and formaldehyde content from RHF filled PB bonded with UF resin was measured by 24 h desiccator and perforator method, respectively. RHF causes an increased pH of UF resin. $E_a$ of the modified UF resin decreased independently of RHF particle size. As the pH and the $E_a$ variation of the UF resin containing RHF increased, the amount of formaldehyde content decreased. The formaldehyde emission and formaldehyde content levels of the PB bonded with 15 wt% of $30{\mu}m$ RHF and $E_2$ type UF resin were low and satisfied grade $E_1$, as measured by 24 h desiccator and perforator method. The result of a comparison between 24 h desiccator and perforator test using PB showed that the linear regression analyses show a good correlation between the results for the 24 h desiccator and the perforator tests. The linear regression of a correlation between the desiccator and the perforator was Y=4.842X-0.064 ($R^2=0.989$). RHF was effective at reducing formaldehyde emission and formaldehyde content in urea-formaldehyde adhesives when used as scavenger.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.68-68
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• 2011

As feature size is smaller, new technology are needed in semiconductor factory such as gap-fill technology for sub 100nm, development of ALD equipment for Cu barrier/seed, oxide trench etcher technology for 25 nm and beyond, development of high throughput Cu CMP equipment for 30nm and development of poly etcher for 25 nm and so on. We are focus on gap-fill technology for sub-30nm. There are many problems, which are leaning, over-hang, void, micro-pore, delaminate, thickness limitation, squeeze-in, squeeze-out and thinning phenomenon in sub-30 nm gap fill. New gap-fill processes, which are viscous oxide-SOD (spin on dielectric), O3-TEOS, NF3 Based HDP and Flowable oxide have been attempting to overcome these problems. Some groups investigated SOD process. Because gap-fill performance of SOD is best and process parameter is simple. Nevertheless these advantages, SOD processes have some problems. First, material cost is high. Second, density of SOD is too low. Therefore annealing and curing process certainly necessary to get hard density film. On the other hand, film density by Flowable oxide process is higher than film density by SOD process. Therefore, we are focus on Flowable oxide. In this work, dielectric film were deposited by PECVD with TSA(Trisilylamine - N(SiH3)3) and NH3. To get flow-ability, the effect of plasma treatment was investigated as function of O2 plasma power. QMS (quadruple mass spectrometry) and FTIR was used to analysis mechanism. Gap-filling performance and flow ability was confirmed by various patterns.

• Design & Manufacturing
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• v.14 no.4
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• pp.65-70
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• 2020

Partial reinforcement of sheet metal parts with CFRP patch is a technology that can realize ultra-lightweight body parts while overcoming the high material cost of carbon fiber. Performing these patchworks with highly productive press equipment solves another issue of CFRP: high process costs. The A-pillar is the main body part and has an undercut shape for fastening with other parts such as roof panels and doors. Therefore, it is difficult to bond CFRP patches to the A-pillar with a general press forming tool. In this paper, a flexible system that applies uniform pressure to complex shapes using ceramic particles and silicone rubber is proposed. By benchmarking various A-pillars, a reference model with an undercut shape was designed, and the system was configured to realize a uniform pressure distribution in the model. The ceramic spherical particles failed to realize the uniform distribution of high pressure due to their high hardness and point contact characteristics, which caused damage to the CFRP patch. Compression equipment made of silicone rubber was able to achieve the required pressure level for curing the epoxy. Non-adhesion defects between the metal and the CFRP patch were confirmed in the area where the bending deformation occurred. This defect could be eliminated by optimizing the process conditions suitable for the newly developed flexible system.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.08a
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• pp.249-257
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• 2004

Drying and curing characteristics of PCM resins using the induction heater and short-wave infrared emitter module was studied to develop a compact oven system for the high speed CCL and post-treatment equipment. Drying of the polyester resins using the induction heater and infrared heater showed that the blistering tendency of polyester resin coating increased regardless of additives and colors of resins as the heating rate and/or dry film thickness increased. The blistering of polyester resin coating layer occurred when the heating speed was over than $25^{\circ}C/sec$ for the dry film thickness of $19\~20um$, which is the typical thickness of finish coating in CCL. So did it when the heating speed was over than $40^{\circ}C/sec$ for the dry film thickness over than 10 um. The heating efficiency of paint coated steels by the infrared heating was strongly dependent on the colors of paint coating and generally increased for the dark surface and/or coating. But the faster drying of the PCM resin coatings increased the blistering tendency of coating layer. The blistering limit for the typical finish coating by the infrared heating was estimated as the heating rate slower than $20^{\circ}C/sec$ regardless of colors of PCM resins.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2012.05a
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• pp.41-42
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• 2012

High temperature / high pressure spray equipment using a conventional method, unlike spray polyurea adjustable pot life and yellowing caused by UV light and chemicals do not occur, or discoloration of Self-Leveling Type of rugged hand-polyurea resin for technology development is underway. This new concept of polyurea resin roller, brush, airless spray, and they installed easily using the unfamiliar labor, and curing time of approximately four hours to gain control of the glass because it is Pot. Construction, but does not like the spray polyurea resin, compared to the existing degradation of the adhesion strength is concerned. In this study, Self-Leveling Type Manual of polyurea resin adhesion strength of target deterioration Let's minimize problems by reviewing existing domestic and infrastructure long-term durability for long life of the facility is to obtain.

• Proceedings of the Korean Geotechical Society Conference
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• 1993.06a
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• pp.55-72
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• 1993

Dynamic compaction may cause some demages to structures becasue it uses the impact energy of heavy weight with high drop height. This study measured and analyzed the vibrations at the (bnamic compaction site which was composed of man-made land fill. From the vibration analysis, it was found that the particle velocity and attenuation was greatest in longitudinal direction and smallest in transversal direction, the dominant frequency ranged from 7 Hz to 9 Hz and the structural damage could be prevented by reducing the drop height at the vicinity of the vibration sentialive structures. Also, the damage to the office equipment could be prevented by doing the dynamic compaction work curing closed-office hours.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.6
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• pp.81-86
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• 2017

The high-pressure resin transfer molding (HP-RTM) process has a very effective for the mass production of carbon fiber reinforced plastic (CFRP) for light weight in the automotive industry. In developing robust equipment, new process and fast cure matrix systems reduces significantly the cycle time less than 5 minutes in recent years. This paper describes the cavity pressure, temperature and molding characteristics of the HP-RTM process. The HP-RTM mold was equipped with two cavity pressure sensors and three temperature sensors. The cavity pressure characteristics of the HP-RTM injection, pressurization, and curing processes were studied. This experiment was conducted with selected process parameters such as mold cap size, maximum press force, and injection volume. Consequently, this monitoring method provides correlations between the selected process parameters and final forming characteristics in this work.