• Journal of Applied Reliability
• /
• v.5 no.3
• /
• pp.327-342
• /
• 2005

전자 패키지가 열을 받을 때 회로기판과 칩의 열팽창계수 차이에 의해 발생되는 응력은 솔더 조인트의 파손에 영향을 미친다. 본 연구에서는 이 영향을 정량적으로 규명하기 위하여 열충격시험기를 이용해 얻어진 솔더 조인트의 전기저항 변화와 수명과의 상관관계를 규명하였고, BGA솔더 조인트의 수명을 정량적으로 도출하였다. 또한 Sn-3.5Ag-0.5Cu 무연 솔더와 63Sn-37Pb 유연 솔더를 위의 실험에 동시에 적용시켜 건전성을 FORM(first-order reliability method)과 Weibull Function Model을 이용해 비교하였다.

• YAKHAK HOEJI
• /
• v.7 no.1
• /
• pp.26-29
• /
• 1963

Three systems such as CaS, BaS and ZnS are used as ground materials and transition elements such as Bi, Cu, Ag and Ni are used as activators to preared phosphorescent materials of strong after-grow intensity. These three systems in which we have 31 kinds of different composition samples are heated at given temperatures in the electrical furnace and are cooled in the air in order to crystallize them. In the case of BaS system, the mixture of CaO and purified S is better than the other kinds of calcium compound as the ground materials to crystallize phosphors. In BaS system, the mixture of BaCO$_{3}$ and purified S, in ZnS system ZnS respectively is the most proper ground material to prepare such a strong after-grow intensified phosphors. In a given range, the higher in temperature and the longer time of heating, the better phosphors we obtain.

• Proceedings of the KIEE Conference
• /
• 2001.07c
• /
• pp.1881-1883
• /
• 2001

We manufactured a micro CPL by LlGA process, a new conceptual ultra-fine and precise forming method, using X-ray lithography process. We fabricated a BN X-ray mask having properties of good X-ray transmittance and large mechanical strength. Micro CPL was manufactured by dividing into an upper plate and a low plate. Each of plates was bonded by Ag paste screen printing. The upper plate was fabricated on glass wafer to observe flow and phase transformation of cooling solution. The lower plate was manufactured by Cu electroplating for good heat transmission. Precision of inner Parts, micro pin and micro channel, of manufactured micro CPL is under ${\pm}2{\mu}m$.

• Proceedings of the KIEE Conference
• /
• 1998.07d
• /
• pp.1546-1548
• /
• 1998

Dual mode ring resonators(DMRR) have been fabricated using laser ablated $YBa_2Cu_3O_{7-x}$ superconducting thin films. The transition temperature of YBCO thin films were 85 - 88 K and the film thicknesses were about 5,000 $\AA$. Dual mode ring resonators were patterned by standard photolithography process and wet-etching. Then two-layer metal thin films (Ti/Ag) have been deposited for the ground plane on the back side of substrate by e-beam and thermal evaporation. The input/output feedline angles of each resonator were $60^{\circ}$, $100^{\circ}$, $180^{\circ}$. A network analyzer was used for testing the performance of the resonators in the frequency range of 6-13 GHz at 77 K.

• Journal of Environmental Science International
• /
• v.5 no.2
• /
• pp.195-201
• /
• 1996

This study was conducted for the efficient utilization of a scoria, which is abundantly found in Cheju island, as adsorbent and the scoria was examined for its performance in clarification of adsorption of heavy metal ions. The order in heavy metal ions adsorbed on scoria was; Pb+>Cd^{2+}$>Cu^{2+}$>Ag^+$>Co^{2+}$>Zn^{2+}$>Cr^{3+}$>Cr^{6+}$. This tendency was relatively consistent with the decreasing order of radius of hydrated metal ion. Also, the smaller scoria size and the larger amounts of scoria showed higher removal efficiency for heavy metal ions. The same scoria size showed more effective removal efficiency for heavy metal ions at lower initial concentration than at higher initial concentration. The adsorption abilities of original scoria and chemically treated scoria were compared. Adsorption isotherm of scoria was generally obeyed to Freundlich formula than langmuir formula and Freundlich constant, than was obtained in the range of 0.2~0.4.

• Proceedings of the KSME Conference
• /
• 2001.11a
• /
• pp.73-79
• /
• 2001

In this paper, shielding effectiveness(SE) of the shielding material of electromagnetic(EM) waves was investigated with actual experiments. The materials used in this study were made up of sputtering, film and powder of conductive materials - Cr, Al, Ag and Cu etc. Also, the polyester film was used as a base material. The experiment was carried out by using a shielding evaluator(Shielding box) TR17302 with an ADVANTEST spectrum analyzer, model R3361C. It was found from the experimental results that silver, copper, aluminum and chromium were good candidates as a shielding material against the EM waves with increasing the SE as the composite was laminated. The characteristics of the SE against the EM waves depended on a mode of preparation of specimen. The effects of density of particles on the SE were studied when the sputtering. The SE strongly depended on the electric resistance by density of sputtering and painting particles. SE increased as the density of particles was increasing.

• Clean Technology
• /
• v.11 no.3
• /
• pp.153-164
• /
• 2005

This study found a reliable evaluation for four kinds of pb-Free plating solutions and it's layers, through pure Sn, SnAg, SnBi and SnCu. These four kind of solutions are widely used to pb-Free plating. Hull-cell, Harring-blum, coverage, throwing power, current efficiency, stability, life-time, composition, hardness, roughness, abrasion, scratch, solderability, corrosion, contact angle, morphology, SIR(Surface insulation resistance) and Whisker test were experimented. Also, Using ICP, XRF, FE-SEM, EDS, temperature/humidity chamber, solderability tester, hardness tester, roughness tester, abrasion tester, salt spray tester, contact angle tester, SIR tester, and microscope. In this paper could be shown the systematic and various analysis for reliability about four kinds of pb-Free plating solutions, processes and it's deposit surface.

• Journal of Sensor Science and Technology
• /
• v.14 no.6
• /
• pp.369-373
• /
• 2005

High quality CdTe single crystal for the solar cell fabrication was grown by vertical Bridgman method. The etch pits patterns of (111) surfaces of CdTe etched by Nakagawa solution was observed the (111)A compesed of Cd atoms with typical triangle etch pits of pyramid mode. From the photoluminescence measurement on (111)A, we observed free exciton ($E_{x}$) existing only high quality crystal and neutal acceptor bound exciton ($A^{0}$,X) having very strong peak intensity. Then, the full width at half maximum and binding energy of neutral acceptor bound exciton were 7 meV and 5.9 meV, respectively. By Haynes rule, an activation enery of impurity was 59 meV. Therefore, the origins on impurity level acting as a neutral acceptor were associated Ag or Cu elements.

• Proceedings of the KWS Conference
• /
• 2006.05a
• /
• pp.227-229
• /
• 2006

3차원 실장을 하기 위해서 딥핑 방법으로 전기적 신호를 전달할 수 있는 비아를 가진 실리콘 웨이퍼를 제작하였다. 레이저를 이용하여 실리콘 웨이퍼에 개구부가 원형에 가까운 관통 홀을 형성하였다. 관통 홀의 벽에 도금 방법으로 시드 층을 형성하였다. 관통 홀의 충전 금속은 Sn-3.5Ag-0.7Cu 솔더를 사용하였다. 딥핑 방법으로 시드 층과 솔더 사이의 확산 현상 이용하여 전기적 신호를 전달 할 수 있는 비아를 형성하였다. 비아 내부에 일부 기공과 크랙이 발견되기도 했으나 딥핑 방법을 통해서 빠른 시간 내에 비아를 가진 실리콘 웨이퍼를 제작 할 수 있었다.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
• /
• 2000.02a
• /
• pp.6-8
• /
• 2000

The critical current density, Jc, of superconductor tape significantly depends on microstructural evolution during mechanical deformation. In this study, we fabricated Bi-2223 superconductor tape by PIT technique, and investigated mechanical properties of mono- and 61-filamentary tapes and their joined tapes. The strength of mono-filament tape was higher than those of 61-filament tape was higher than those of 61-filament tape, respectively. On the other hand, elongation of mono-filament tape, respectively. On the other hand, elongation of mono-filament tape was lower than 61 filament tape. The joined tapes shows lower strength and irreversible strain than those of unjoined tapes. The reduced strength and irreversible strain for joined tape is probably related to the induced damages such as irregular interface and Ag-instrusion in the transition region which acts as a stress concentration.