• Korean Journal of Materials Research
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• v.22 no.7
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• pp.329-334
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• 2012

Two types of nanoclusters, termed Cluster (1) and Cluster (2) here, both play an important role in the age-hardening behavior in Al-Mg-Si alloys. Small amounts of additions of Cu and Ag affect the formation of nanoclusters. Two exothermic peaks were clearly detected in differential scanning calorimetry(DSC) curves by means of peak separation by the Gaussian method in the base, Cu-added, Ag-added and Cu-Ag-added Al-Mg-Si alloys. The formation of nanoclusters in the initial stage of natural aging was suppressed in the Ag-added and Cu-Ag-added alloys, while the formation of nanoclusters was enhanced at an aging time longer than 259.2 ks(3 days) of natural aging with the addition Cu and Ag. The formation of nanoclusters while aging at $100^{\circ}C$ was accelerated in the Cu-added, Ag-added and Cu-Ag-added alloys due to the attractive interaction between the Cu and Ag atoms and the Mg atoms. The influence of additions of Cu and Ag on the clustering behavior during low-temperature aging was well characterized based on the interaction energies among solute atoms and on vacancies derived from the first-principle calculation of the full-potential Korrinaga-Kohn-Rostoker(FPKKR)-Green function method. The effects of low Cu and Ag additions on the formation of nanoclusters were also discussed based on the age-hardening phenomena.

• Korean Journal of Metals and Materials
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• v.50 no.12
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• pp.931-937
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• 2012

The microstructure of Cu-15 wt%Ag composites fabricated by equal channel angular pressing (ECAP) with intermediate heat treatment at $320^{\circ}C$ was investigated by transmission electron microscopy (TEM) observations. Ag precipitates with a thickness of 20-40 nm were observed in the eutectic region of the Cu-15 wt%Ag composite solution treated at $700^{\circ}C$ before ECAP. The Cu matrix and Ag precipitates had a cube on cube orientation relationship. ECAPed composites exhibited ultrafine-grained microstructures with the shape and distribution dependent on the processing routes. For route A in which the sample was pressed without rotation between each pass, the Cu and Ag grains were elongated along the shear direction and many micro-twins were observed in elongated Cu grains as well as in Ag filaments. The steps were observed on coherent twin boundaries in Cu grains. For route Bc in which the sample was rotated by 90 degrees after each pass, a subgrain structure with misorientation of 2-4 degree by fragmentation of the large Cu grains were observed. For route C in which the sample was rotated by 180 degrees after each pass, the microstructure was similar to that of the route A sample. However, the thickness of the elongated grains along the shear direction was wider than that of the route A sample and the twin density was lower than the route A sample. It was found that more microtwins were formed in ECAPed Cu-15 wt%Ag than in the drawn sample. Grain boundaries were observed in relatively thick and long Ag filaments in Cu-15 wt%Ag ECAPed by route C, indicating the multi-crystalline nature of Ag filaments.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.593-596
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• 2003

A proposed way to prepare $YBa_2Cu_3O_y$ wires or tapes is that Ag is used as substrate and melting point of $YBa_2Cu_3O_y$ is decreased to lower than the melting point of silver ($961\;^{\circ}C$). Therefore after the deposition of $YBa_2Cu_3O_y$ film on Ag substrate, the heat treatment can be carried out below the Ag melting point. Silver (Ag) and Lead oxide(PbO) were selected to be additives for $YBa_2Cu_3O_y$. Different Ag and PbO contents were added in $YBa_2Cu_3O_y$, the melting points of which were measured by DTA. In order to guarantee that the superconductivity of $YBa_2Cu_3O_y$ was not reduced after Ag and PbO added into $YBa_2Cu_3O_y$, their superconductivities were measured. It is proved that as additives, both Ag and PbO can reduce the melting point of $YBa_2Cu_3O_y$. For Ag doped $YBa_2Cu_3O_y$, $T_c$ is about 93K and ${\Delta}Tc$ is $2{\sim}3K$. For PbO doped $YBa_2Cu_3O_y$, $T_c$ is $88K{\sim}92K$ and ${\Delta}T_c$ is $11{\sim}12K$. When 10 wt% of Ag and 10 wt% PbO were added in $YBa_2Cu_3O_y$, the melting point of the mixture of $YBa_2Cu_3O_y$ (80 wt%), Ag (10 wt%) and PbO (l0 wt%) is $943^{\circ}C$. The transition temperatures ($T_c$) of the sample is 91.8 K.

• Applied Chemistry for Engineering
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• v.29 no.6
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• pp.782-788
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• 2018

Submicron copper-silver core-shell (Cu@Ag) particles were synthesized using the sonochemical combined transmetallation reaction and the application to printed electronics as a low cost conductive paste was evaluated. $Cu_2O$ of the $Cu_2O/Cu$ composite used as a core in the reaction for the synthesis of core-shell was sonochemically reduced to Cu, and Cu atoms functioned as a reducer for silver ions in transmetallation to achieve the copper-silver core-shell structure. The characterization of submicron particles by TEM-EDS and TG-DSC confirmed the core-shell structure. Conductive pastes in which 70 wt% Cu@Ag was dispersed in solvents were prepared using a binder and wetting agents, and coated on the polyamide film using a screen-printing method. Printed paste films containing synthesized Cu@Ag particles with 8 at% and 16 at% Ag exhibited low resistivity of 96.2 and $38.4{\mu}{\Omega}cm$ after sintering at $180^{\circ}C$ in air, respectively.

• Journal of the Korean Applied Science and Technology
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• v.31 no.2
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• pp.313-319
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• 2014

This study was performed to obtain high conversion efficiency of $NH_3$ and minimize generation of nitrogen oxides using metal-supported catalyst with Ag : Cu ratio. Through structural analysis of the prepared catalyst with Ag : Cu ratio ((10-x)Ag-xCu ($0{\leq}x{\leq}6$)), it was confirmed that the specific surface area was decrease with increasing metal content. A prepared catalysts showed Type II adsorption isotherms regardless of the ratio Ag : Cu of metal content, and crystalline phase of $Ag_2O$, CuO and $CuAl_2O$ was observed by XRD analysis. In the low temperature($150{\sim}200^{\circ}C$), a conversion efficiency of AC_10 recorded the highest(98%), whereas AC_5 (Ag : Cu = 5 : 5) also showed good conversion efficiency(93.8%). However, in the high temperature range, the amounts of by-products(NO, $NO_2$) formed with AC_5 was lower than that of AC_10. From these results, It is concluded that AC_5 is more environmentally and economically suitable.

• Korean Journal of Materials Research
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• v.9 no.7
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• pp.747-752
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• 1999

The interfacial reaction and joint properties of Sn-3.5Ag/Cu and Sn-3.5Ag-1Zn/Cu joint were studied. Modified double lap shear solder joints of Sn-3.5Ag and Sn-3.5Ag- lZn solder were aged for 60days at $100^{\circ}C$ and $150^{\circ}C$ and then loaded to failure in shear. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-lZn at the aging temperature of $150^{\circ}C$ Through the SEM/EDS analysis of solder joint, it was proved that intermatallic layer was $Cu_{6}Sn_5$ phase and aged specimens showed that intermatallic layer grew in proportion to $t_{1/2}$, and the precipitate of $Ag_3Sn$ occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, $Cu_{6}Sn_{5}$ phase formed at the side of substrate and $Cu_{5}Zn_{8}$ phase formed at the other side in double layer. The shear strength of the Sn-3.5Ag/Cu joint improved by addition of IZn. The strength of the joint increases with strain rate and decreases with aging temperature

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.1-9
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• 2002

The intermetallic formation between Sn-Ag-(Cu) solders and metal pads in a real BGA package was characterized using SEM, EDS, and XRD. The intermetallic phase formed in the interface between Sn-Ag-Cu and Au/Ni/Cu pad is likely to be ternary compound of $(Cu,Ni)_6Sn_5$ from EDS analysis High concentration of Cu was observed in the solder/Ni interface. XRD analysis confirmed that $\eta -Cu_6 Sn_5$ type was intermetallic phase formed in the interface between Cu containing solders and Ni substrates and $Ni_3$Sn_4$ intermetallic was formed in the Sn-Ag solder/Ni interface. The thickness of intermetallic phase increased with the reflow times and Cu concentration in solder.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.45-51
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• 2013

Thermal annealing tests were performed in an in-situ scanning electron microscope chamber at $130^{\circ}C$, $150^{\circ}C$, and $170^{\circ}C$ in order to investigate the effects of solder structure on the growth kinetics of intermetallic compound (IMC) in Cu/Sn-3.5Ag microbump. Cu/Sn-3.5Ag($6{\mu}m$) microbump with spreading solder structure showed $Cu_6Sn_5$ and $Cu_3Sn$ phase growths and then IMC phase transition stages with increasing annealing time. By the way, Cu/Sn-3.5Ag($4{\mu}m$) microbump without solder spreading, remaining solder was transformed to $Cu_6Sn_5$ right after bonding and had only a phase transition of $Cu_6Sn_5$ to $Cu_3Sn$ during annealing. Measured activation energies for the growth of the $Cu_3Sn$ phase during the annealing were 0.80 and 0.71eV for Cu/Sn-3.5Ag($6{\mu}m$) and Cu/Sn-3.5Ag($4{\mu}m$), respectively.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.2
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• pp.94-98
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• 2017

In the past few years, Sn-3.0Ag-0.5Cu (weight%) solder composition has been a representative material to electronic industries as a replacement of Pb-base solder alloy. Therefore, extensive studies on process and/or reliability related with the composition have been reported. However, recent rapid rise in Ag price has demanded solder compositions of low Ag content. In this study, Sn-3.0Ag-0.5Cu solder bar sample was fabricated by melting of Sn, Ag and Cu metal powders. Crystal structure and element concentration were analyzed by XRD, optical microscope, FE-SEM and EDS. The Sn-3.0Ag-0.5Cu solder sample was composed of ${\beta}$-Sn, ${\varepsilon}-Ag_3Sn$ and ${\eta}-Cu_6Sn_5$ phases.

• Design & Manufacturing
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• v.6 no.1
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• pp.95-100
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• 2012

In this study, a novel Cu composite sheet with embedded high electric conduction path was developed as another alternative for the interconnect materials possessing high electrical conductivity as well as high strength. The Cu composite sheet was fabricated by forming Ag conduction paths not within the interior but on the surface of a high strength Cu substrate by damascene electroplating process. As a result, the electrical conductivity increased by 40% thanks to mesh type Ag conduction paths, while the ultimate tensile strength decreased by 20%. The interfacial fracture resistance of Cu composite sheet prepared by damascene electroplating increased by above 50 times compared to Cu composite sheet by conventional electroplating. For feasibility test for practical application, a leadframe for LED module was manufactured by a progressive blanking and piercing processes, and the blanked surface profile was evaluated as a function of the volume fraction of Ag conduction paths. As Ag conduction path became finer, pressing formability improved.