Applied Chemistry for Engineering (공업화학)

The Korean Society of Industrial and Engineering Chemistry (한국공업화학회)
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Sonochemical Synthesis of Copper-silver Core-shell Particles for Conductive Paste Application

초음파를 이용한 구리-은 코어-쉘의 합성 및 전도성 페이스트 적용

  • Sim, Sang-Bo (Changsung Nanotech Co., Ltd.) ;
  • Han, Jong-Dae (School of Civil, Environmental and Chemical Engineering, Changwon National University)
  • 심상보 (창성나노텍(주)) ;
  • 한종대 (창원대학교 공과대학 토목환경화공융합공학부)
  • Received : 2018.10.03
  • Accepted : 2018.10.30
  • Published : 2018.12.10
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Abstract

Submicron copper-silver core-shell (Cu@Ag) particles were synthesized using the sonochemical combined transmetallation reaction and the application to printed electronics as a low cost conductive paste was evaluated. $Cu_2O$ of the $Cu_2O/Cu$ composite used as a core in the reaction for the synthesis of core-shell was sonochemically reduced to Cu, and Cu atoms functioned as a reducer for silver ions in transmetallation to achieve the copper-silver core-shell structure. The characterization of submicron particles by TEM-EDS and TG-DSC confirmed the core-shell structure. Conductive pastes in which 70 wt% Cu@Ag was dispersed in solvents were prepared using a binder and wetting agents, and coated on the polyamide film using a screen-printing method. Printed paste films containing synthesized Cu@Ag particles with 8 at% and 16 at% Ag exhibited low resistivity of 96.2 and $38.4{\mu}{\Omega}cm$ after sintering at $180^{\circ}C$ in air, respectively.

서브 미크론 구리-은 코어-쉘 Cu@Ag 입자를 초음파화학과 결합된 금속교환 반응으로 합성하고 인쇄용 전자부품을 위한 저렴한 전도성 페이스트 적용을 평가하였다. 코어-쉘의 합성을 위한 반응에서 코어로 사용된 $Cu_2O/Cu$ 복합체의 $Cu_2O$는 초음파화학 반응으로 Cu로 환원되고 Cu 원자는 Ag의 금속교환 반응의 환원제로 작용하여 코어 표면에 Ag가 코팅된 코어-쉘 구조를 얻었다. TEM-EDS와 TG-DSC를 이용하여 서브 미크론 입자의 코어-쉘 구조를 확인하였다. 70 wt% Cu@Ag를 용매에 분산시킨 전도성 페이스트를 결합제와 습윤제를 사용하여 제조하고, 스크린 인쇄법을 사용하여 폴리아미드 필름상에 코팅하였다. Ag 함량이 8 at%와 16 at%인 Cu@Ag 입자를 함유하는 인쇄된 페이스트 필름은 공기 중의 $180^{\circ}C$에서 소결한 후 각각 96.2와 $38.4{\mu}{\Omega}cm$의 낮은 비저항 값을 나타내었다.

Keywords

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Figure 1. XRD patterns of (a) Cu2O and (b) Cu@Ag particles with 8 at% Ag.

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Figure 3. (a) SEM image and (b) EDS spectrum of Cu@Ag particles.

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Figure 5. Line scanning analysis of a representative single Cu@Ag particle of 1.0 μm in size: (a) TEM image, (b) elemental EDS line profiling on the cross-section.

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Figure 6. Elemental mapping analysis of a representative single Cu@Ag particle of 1.6 μm in size: (a) TEM image, and (b), (c) EDS mappings of Cu and Ag.

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Figure 7. TG-DSC result of Cu@Ag particles with 8 at% Ag under dynamic heating of 5 ℃/ min to 550 ℃ in air.

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Figure 8. Resistivity of the film containing Cu@Ag particles with various Ag contents after sintering at 180 ℃ in air.

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Figure 9. Resistivity of the film containing Cu@Ag particles with 8 at% Ag after sintering at various temperatures in air.

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Figure 2. (a) SEM micrographs and (b) EDS spectrum results of Cu@Ag particles with 8 at% Ag, the insert table is the composition of the particles.

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Figure 4. Representative TEM micrographs of (a) Cu2O particles and (b) Cu@Ag particles with 8 at% Ag.

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