• 한국전기전자재료학회논문지
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• 제16권10호
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• pp.923-930
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• 2003

We jointed Bi(Pb)-Sr-Ca-Cu-O multifilament tapes and evaluated their electrical and mechanical properties. In order to improve connectivity of multifilaments, one or two single-filament tape was inserted between two multifilament tapes. The critical current ratio(CCR) and n-value of the jointed tapes were evaluated as a function of uniaxial pressure. It was observed that critical current ratio and n-value were 24.8-29.0% and 2.5-2.8 for MM lap-jointed tape. On the other hand, the corresponding values were improved to 24.7-53.9% and 3.1-4.2 for MSM jointed tape, and 63.4-76.0% and 3.4-5.1 for double MS:vr lap-jointed tape, respectively. The highest electrical properties of double MSM lap-jointed tape are considered to be owing to the presence of single core, causing better interconnections of multifilaments between the two tapes. The mechanical property of jointed tape was evaluated and correlated to the microstructural evolution. The strength of jointed tapes was 44-64% less than that of the unjoined tape. The strain tolerance of jointed tape was also reduced compared to that of the unjoined tape. These lower mechanical properties of jointed tape are probably due to the induced nonuniform microstructure such as the existence of cracks and Ag-intrusion in the joined region.

• Journal of Pharmaceutical Investigation
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• 제19권1호
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• pp.9-14
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• 1989

In order to study the protease from Agaricus bisporus (Lange), the crude protease preparation was separated by fractionation of mushroom extracts with ammonium sulfate. It was found that extracts from Agaricus bisporus (Lange) Sing. contained protease. The optimum pH of the enzyme was 6.0, and the pH range at which the enzyme was stable was 4.0 to 7.0. The optimum temperature at which the enzyme showed the highest proteolytic activity was $50^{\circ}C$, while the enzyme was instantly inactivated at about $60^{\circ}C$. The enzyme activity was inhibited by $Ag^+$, $Hg^{2+}$, $Cu^{2+}$, $Ba^{2+}$, $Fe^{3+}$, $Co^{2+}$, $Ca^{2+}$, $Pb^{2+}$, $Mg^{2+}$ and $Mn^{2+}$. The $K_m$ value was 0.32 mM with Hammarsten casein.

• Ocean Science Journal
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• 제40권2호
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• pp.61-66
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• 2005

Benthic amphipod, Grandidierella japonica widely inhabits the Korean coastal waters and is developed as a standard test species for sediment toxicity tests. We exposed G. japonica to various pollutants including 4 kinds of inorganic metals (Ag, Cd, Cu and Hg), tributyltin [TBT], ammonia and 7 polycyclic aromatic hydrocarbon (PAH) compounds (acenaphthene, chrysene, fluoranthene, fluorene, naphthalene, phenanthrene and pyrene) to estimate the no observed effect concentration (NOEC) and the median lethal concentration (LC50) of each pollutant during the 96-hour acute exposure. Among all tested pollutants, TBT was most toxic to G. japonica, and Rg was most toxic among inorganic metals. The toxicity of pyrene to G. japonica was greatest among PAH compounds, followed by fluoranthene, phenanathrene, acenaphthene, fluorene and naphthalene. The toxicity of PAH compounds was closely related to their physico-chemical characteristics such as $K_ow$ and water solubility. G. japonica responded adequately to pollutant concentrations and exposure durations, and the sensitivity of G. japonica to various inorganic and organic pollutants was generally comparable to other amphipods used as standard test species in ecotoxicological studies, indicating this species can be applied in the assessment of environments polluted by various harmful substances.

• 한국생산제조학회지
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• 제20권2호
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• 한국광물학회지
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• 제24권3호
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• pp.245-252
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• 2011

콜롬비아는 안데스 산맥의 북단에 위치하며 NS 방향의 단층대를 기준으로 지질 환경의 차이가 크다. 단층대를 기준으로 동부지역은 원생대 변성암류와 이를 피복하는 고생대 변성퇴적암류가 주로 분포하며, 서부 지역은 고생대 퇴적암류, 중생대 화성암류, 제 3 기 화산양류 및 퇴적암류가 주로 분포한다. 지화학이상대는 6개 그룹으로 분류되며, 철 (Fe), 귀금속(Au, Ag, Pt), 기초금속(Cu, Pb, Zn), 희유금속(Sn, Cr, Co, Mn, Mo, Ni, Nb, W, V, Mg, Ti, Be, REE, Ga, Zr, Hf, Se, Te, Ta, Cd, In, Li 등) 빛 핵원료자원인 U 이상대로 구성된다. 콜롬비아의 주요 부존자원은 석탄, 니켈, 금 및 에메랄드이다. 에메랄드, 석탄 및 니켈은 세계적인 매장규모와 생산량을 보인다. 콜롬비아는 탐사가 거의 수행되지 않은 지역이 전 국토의 49%에 달해 광물부존 잠재성은 현재보다 크게 높을 것으로 보인다. 따라서 최근 콜롬비아와의 광물자원 협력이 강화되고 있는 시점에서 미탐사 지역을 대상한 공동탐사를 지화학 이상대가 확인된 지역을 중심으로 수행하여 신규광체를 확보하고, 광물자원 협력을 강화함으로써 공동개발 여건을 마련할 필요가 있다고 판단된다.

• Journal of Microbiology
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• 제34권2호
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• pp.198-205
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• 1996

Two proteases were partially characterized from culture filtrate of Mycobacterium, tuberculosis KIT110. Their molecular weights were approximately 200 and 180 kDa, respectively and they exhibited similar enzymatic characteristics. These enzymes were inhibited significantly by EDTA and to some extent by EGTA. Their activity was enhanced by $Ca^{2+}$ and $Mg^{2+}$ to some degree. However, $Cu^{2+}$ and $Ag^{2+}$ completely inhibited the enzyme activity at the concentration of 2.5 and 5 mM, respectively. The optimal pH was 7.0 and optimal temperature was around $40^{\circ}C$. These enzymes were rapidly inactivated at $80^{\circ}C$. Therefore, they were heat-labile, neutral metalloproteases. These enzymes exhibited antigenicity shown by their reacting with sera from the partients with pulmonary tuberculosis. These enzymes were able to degrade serum proteins including hemoglobin, bovine serum albumin, lysozyme and immunoglobulin G and structural matrix protein such as type I collagen. Therefore, these enzymes may be thought to contribute to tissue necrosis and pathogenesis during infection.

• 한국자동차공학회논문집
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• 제19권6호
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• pp.90-96
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• 2011

In this study, the characteristic of fractured portion and shape on solder joints were investigated according to the thermal shock test for Automotive Application Component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as Lead-free solder. The value of pull and shear strength was decreased in principle after 432 cycles thermal shock test. In addition, fracture mode was verified by using EDS and SEM to observe fractured shape on the solder joints before and after thermal shock. In before thermal shock test, the fracture mode revealed typically solder layer's fracture mode. In after thermal shock test, we identified multiple fracture mode of the ductile and brittle fracture. Even though same composition of solder was used to experimental for estimating. the fracture mode varied on the fracture portion's height and the directional angles of shear strength. In conclusion, we identified that mechanical strength was affected on the solder layer's fracture mode.

• Bulletin of the Korean Chemical Society
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• 제28권8호
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• pp.1405-1409
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• 2007

The potential-induced charge transfer of the dye (Bu4N)2[Ru(dcbpyH)2-(NCS)2] (N719) on Au, Ag, and Cu electrode surfaces has been examined by surface-enhanced Raman scattering (SERS) in the applied voltage range between 0.0 and ?0.8 V. N719 is assumed to have a relatively perpendicular geometry with its bipyridine ring on the metal surfaces. A strong appearance of the carboxylate band at ~1370 cm-1 indicates that the carboxyl group will likely be deprotonated on the metal surfaces. As the electric potential is shifted from ?0.8 to 0.0 V, the ν (NCS) band at ~2100 cm-1 on the electrode surfaces appears to undergo a shift in frequency and intensity change. This indicated that the charge transfer between the dye and metal electrode surfaces had occurred. Electric-field-dependent charge transfer differs somewhat depending on the type of metal surfaces as suggested from the dissimilar frequency positions of the ν (NCS) band.

• Journal of Applied Biological Chemistry
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• 제42권3호
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• pp.107-112
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• 1999

A carboxymethyl-cellulase (CMCase) was purified from the culture supernatant of Bacillus sp. KD1014 by ultrafiltration, ammonium sulfate precipitation, and a series of chromatography on QAE-Sephadex A-50, hydroxylapatite and Sephadex G-75. The purified CMCase was a single protein of 32 kDa, showed an optimum activity at $60^{\circ}C$ and pH 6.0, and had a half-life of 23 min at $70^{\circ}C$. The enzyme activity was not influenced by metal ions such as $Mg^{2+},\;Fe^{3+},\;K^+,\;Zn^{2+}$, and $Cu^{2+}$ at a concentration of 1.0 mM, partially inhibited by $Mn^{2+}$ and $Ag^+$, and significantly inhibited by pentachlorophenol (PCP). The purified enzyme showed a 3.9-times higher activity on lichenan than on CMC, but hardly cleaved xylan, starch, avicel, laminarin, filter paper and levan. The results of activity staining of the purified enzyme separated by native and denaturing gel electrophoresis suggested that the CMCase might exist in dimeric, oligomeric or aggregated form as well as in monomeric form. The enzymatic cleavage products from cellotetraose indicated that the CMCase possessed transglycosylation activity.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.346-346
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• 2008

최근 디지털 컨버젼스에 의해서 정보 단말기 network가 디지털 기술을 기반으로 유기적으로 융 복합화 되고 있으며 BT, NT, ET, IT의 융합 기술의 필요성이 점차적으로 증대되고 있다. 이러한 환경 하에서 다양한 정보 및 서비스의 송신 및 수신이 가능한 휴대 단말기의 필요성에 부응하여 기존의 전화 기능, 카메라, DMB 이외에도 홈 네트워크, mobile internet 등 더욱 다양한 기능들이 요구되고 있다. 종래에는 수동 부품과 능동 부품의 실장을 별개로 추진했으나 최근에는 수동 및 능동 부품을 하나의 패키지 내에 실장 가능하도록 하는 3-D Integration을 추진하고 있다. 지금까지 여러 부품들을 실장 시키기 위한 공정들의 대부분은 높은 온도에서 공정이 이루어졌으나 여러 부품들을 손상 없이 집적화하고 실장하기 위해서는 저온화 공정이 필요하다. 최근 많은 저온 공정 중에서 Aerosol Deposition Method는 상온에서 세라믹 후막을 성막할 수 있어 가장 주목받고 있는 공정중의 하나이다. 본 연구에서는 3-D Integration을 실현하기 위해 이종 접합에 유리하고 상온에서 성막 공정이 이루어지는 Aerosol Deposition Method를 이용하여 금속 기판 위에 금속, 폴리머, 세라믹 후막을 성막시켰다. 기판 재료로는 Cu 기판을 사용하였으며 출발 파우더로는 Polyimide 파우더와 $Al_2O_3$ 파우더, Ag 파우더를 사용하였으며 이종 접합간의 메커니즘의 양상을 보기 위해 같은 조건에서 이종 접합간의 성막률을 비교하였으며 FE-SEM으로 미세 구조를 관찰하였다. 또한 기판의 표면 거칠기에 따른 메커니즘의 양상을 연구하였다.