Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
권호 표지
DOI QR코드

DOI QR Code

Superconducting Joint of Multi-filament BSCCO(2223) Tapes by using Single-filament Tape

BSCCO(2223) 단심 초전도 선재를 이용한 다심 초전도 선재의 접합공정 연구

  • 김규태 (성균관대학교 신소재공학과) ;
  • 김정호 (성균관대학교 신소재공학과) ;
  • 장석헌 (성균관대학교 신소재공학과) ;
  • 주진호 (성균관대학교 신소재공학과) ;
  • 강형구 (연세대학교 전기전자공학과) ;
  • 고태국 (연세대학교 전기전자공학과) ;
  • 하홍수 (한국전기연구원 초전도응용연구사업팀) ;
  • 오상수 (한국전기연구원 초전도응용연구사업팀)
  • Published : 2003.10.01
Download PDF
⟨ Previous Next ⟩

Abstract

We jointed Bi(Pb)-Sr-Ca-Cu-O multifilament tapes and evaluated their electrical and mechanical properties. In order to improve connectivity of multifilaments, one or two single-filament tape was inserted between two multifilament tapes. The critical current ratio(CCR) and n-value of the jointed tapes were evaluated as a function of uniaxial pressure. It was observed that critical current ratio and n-value were 24.8-29.0% and 2.5-2.8 for MM lap-jointed tape. On the other hand, the corresponding values were improved to 24.7-53.9% and 3.1-4.2 for MSM jointed tape, and 63.4-76.0% and 3.4-5.1 for double MS:vr lap-jointed tape, respectively. The highest electrical properties of double MSM lap-jointed tape are considered to be owing to the presence of single core, causing better interconnections of multifilaments between the two tapes. The mechanical property of jointed tape was evaluated and correlated to the microstructural evolution. The strength of jointed tapes was 44-64% less than that of the unjoined tape. The strain tolerance of jointed tape was also reduced compared to that of the unjoined tape. These lower mechanical properties of jointed tape are probably due to the induced nonuniform microstructure such as the existence of cracks and Ag-intrusion in the joined region.

Keywords

References

  1. ASC 2002 Improving the critical current density in Bi-2223 wires via a reduction of the scondary phase content Y.B.Huang;X.Y.Cai;T.Holesinger;V.A.Maroni;D.Yu;R.Parrella;M.Rupich;E.Hellstrom;M.Teplitsky;K.Venkataraman;D.Larbalestier
  2. Jpn. J. Appl. Phys. v.36 Persistent mode operation of $Bi_{2}Sr_{2}CA_{1}Cu_{2}O_{x}$/Ag stacked double pancake coils with superconducting joints K.Fukushima;M.Okada;J.Sato;T.Kiyoshi;H.Kumakura;K.Togano;H.Wada https://doi.org/10.1143/JJAP.36.L1433
  3. 전기전자재료학회논문지 v.13 no.3 Bi-2223 초전도선재의 상전도-및 초전도-접합부 특성평가 김정호;지봉기;박형상;임준형;오승진;주진호;황보훈;나완수
  4. IEEE Trans. Appl. Supercon. v.3 Superconducting joints formed between power-in-tube $Bi_{2}Sr_{2}Ca_{2}Cu_{3}O_{z}$/Ag tapes J.E.Tkaczyk;R.H.Arendt;P.J.Bednarcxyk;M.F.Garbauskas;B.A.Jones;R.J.Kilmer;K.W.Lay https://doi.org/10.1109/77.233852
  5. Cryogenics v.36 no.21 Fabrication of superconductively jointed silver-sheathed Bi-2212 tape T.Hase;K.Shibutani;S.Hayashi;M.Himada;R.Ogawa https://doi.org/10.1016/0011-2275(96)80765-X
  6. Cryogenics v.42 Development of Bi-2223 HTS tape and its application to coil and current leads S.S.Oh;H.S.Ha;D.W.Ha;H.M.Jang;C.Park;K.J.Song;:Y.K.Kwon;K.S.Ryu https://doi.org/10.1016/S0011-2275(02)00055-3
  7. Physica C v.372-376 Measurement of joint properties of Bi(Pb)-Sr-Ca-Cu-O (2223) tapes by field decay technique J.H.Kim;K.T.Kim;J.Joo;W.Nah https://doi.org/10.1016/S0921-4534(02)00931-0
  8. Supercond. Sci. Technol. v.15 Fabrication and characterization of the joining of Bi-Pb-Sr-Ca-Cu-O superconductor tape J.H.Kim;J.Joo https://doi.org/10.1088/0953-2048/15/11/320
  9. Supercond. Sci. Technol. v.10 Relation between critical current and exponent n in Bi(2223)/Ag tapes P.Kovac;L.Cesnak;T.Melisek;I.Husek;K.Frohlich https://doi.org/10.1088/0953-2048/10/8/014
  10. 전기전자재료학회논문지 v.14 no.6 Bi(2223) 다심 초전도 선재의 접합공정 연구 김정호;김규태;주진호;나완수
  11. 한국전기전자재료학회 2001년도 춘계학술대회논문집 고온 초전도 선재의 접합공정 연구 김정호;김규태;주진호;나완수;하홍수;오상수
  12. IEEE Trans. Appl. Supercond. v.30 no.4 Effect of controlled carbon impurities on J_{c} in Ag/Bi(2223) tapes A.Jeremie;R.Flukiger
  13. Physica C v.372-376 Bubbling in the fabrication of Bi-2223/Ag wires using PIT process H.S.Ha;S.S.Oh;D.W.Ha;K.J.Song;Y.K.Kwon;K.S.Ryu https://doi.org/10.1016/S0921-4534(02)00943-7