• 한국재료학회지
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• 제9권10호
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• pp.970-977
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• 1999

활성금속브레이징법으로 계면접합된 AlN/Cu 접합체의 잔류응력 완화에 미치는 Mo 중간재의 영향을 조사하였다. 유한요소법에 의한 응력 해석과 접합체 강도 측정, 파단면의 관찰을 행하였으며, 이들 결과를 비교, 분석하였다. 응력 해석 결과로부터, Mo 중간재를 사용할 경우 최대 잔류 주응력이 형성되는 위치가 AlN/삽입금속 계면으로부터 삽임금속/Mo 계면을 통하여 Mo 내부로 이동됨을 확인하였다.접합체의 자유표면에 형성되는 인장성분의 응력집중 위치는 Mo 중간재 두께가 증가됨에 따라 Cu/Mo 계면과 Mo/AlN 계면의 두 곳으로 분리되었으며, AlN측 잔류응력의 크기는 크게 감소하였다. 중간재를 사용하지 않은 경우 최대 접합강도가 52 MPa로 낮은 강도를 보였으나, 두께 400$\mu\textrm{m}$ 이상의 Mo 중간재를 사용한 접합체의 경우, 200 MPa 이상, 최대 275 MPa의 접합강도를 얻을 수 있었다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.475-480
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• 2002

The reliability of the solder joint is affected by type and extent of the interfacial reaction between solder and substrates. Therefore, understanding of intermetallic compounds produced by soldering in electronic packaging is essential. In-based alloys have been favored bonding devices that demand low soldering temperatures. For photonic and fiber optics packaging, m-based solders have become increasingly attractive as a soldering material candidate due to its ductility. In the present work, the interfacial reactions between indium solder and bare Cu Substrate are investigated. For the identification of intermetallic compounds, both Scanning Electron Microscopy(SEM) and X-Ray Diffraction(XRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu$_{11}$In$_{9}$ was observed for bare Cu substrate. Additionally, the growth rate of these intermetallic compounds was increased with the reaction temperature and time. We found that the growth of the intermetallic compound follows the parabolic law, which indicates that the growth is diffusion-controlled.d.

• ETRI Journal
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• 제35권6호
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• pp.1152-1155
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• 2013

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

• 마이크로전자및패키징학회지
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• 제14권3호
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• pp.57-64
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• 2007

Si 칩에 박막히터를 형성하고 이에 전류를 인가하여 LCD (liquid crystal display) 패널의 유리기판은 가열하지 않으면서 Si 칩만을 선택적으로 가열함으로써 Si 칩을 LCD 패널의 유리기판에 실장 하는 새로운 COG 공정기술을 연구하였다. $5\;mm{\times}5\;mm$ 크기의 Si 칩에 마그네트론 스퍼터링법으로 폭 $150\;{\mu}m$,두께 $0.8\;{\mu}m$, 전체 길이 12.15 mm의 정방형 Cu 박막히터를 형성하였으며, 이에 0.9A의 전류를 60초 동안 인가하여 Si칩의 Sn-3.5Ag 솔더범프를 리플로우 시킴으로써 Si 칩을 유리기판에 COG 본딩하는 것이 가능하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.204-207
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• 2003

The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet to tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of sample was conducted. A TiW/Cu UBM structure was adopted and sample was aging treated to analyze the effect of intermetallic compound with time variation. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the fine joint area was observed by using SEM, TEM and EDS. In result, the shear strength was decreased of about 20% in the $100{\mu}m$ sample at $170^{\circ}C$ aging compared with the maximum shear strength of same pad size sample. In the case of the $120^{\circ}C$ aging treatment, 17% of decrease in shear strength was measured at the $100{\mu}m$ pad size sample. Also, intremetallic compound of $Cu_6Sn_5$ and $Cu_3Sn$ were observed through the TEM measurement by using an FIB technique that is very useful to prepare TEM thin foil specimens from the solder joint interface.

• Environmental Engineering Research
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• 제19권3호
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• pp.205-214
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• 2014

Petroleum a vital commodity affecting every aspect of 21st century. Toxicity and adverse effects of sulphur as catalyst in petroleum products is of great concern required development of techniques for desulphurization in compliance with the International standards. Installation of desulphurizing units costs over $200 million per unit placing economic burden on developing countries like Pakistan. Present study analysis of commercial fuels (station petrol and jet fuel JP8) on gas chromatography-mass spectrometry (GC-MS) identified sulphur concentration of 19.94 mg/L and 21.75 mg/L, respectively. This scenario urged the researcher to attempt synthesis of material that is likely to offer good adsorption capacity for sulphur. Following protocol of sol-gel method, transition metals (Ni, Cu, Zn) solution is gelated with tetraethoxysilane (TEOS; silica precursor) using glycerol. Fourier transform infrared spectroscopy (FTIR) spectra revealed bonding of Zn-O, Cu-O, and Ni-O by stretching vibrations at $468cm^{-1}$, $617cm^{-1}$, and $468cm^{-1}$, respectively. Thiophene and Benzothiophene mixed in n-heptane and benzene (4:1) for preparation of Model Fuels I and II, respectively. Each of silica based metal was applied as adsorbent in batch mode to assess the removal efficiency. Results demonstrated optimal desulphurization of more than 90% following efficacy order as Si-Ni > Si-Zn > Si-Cu based adsorbents. Proposed multilayered (Freundlich) adsorption mechanism follows ${\pi}$-complexation with pseudo secnd order kinetics.

• 한국산학기술학회논문지
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• 제5권5호
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• pp.458-461
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• 2004

본 논문에서는 Si wafer와 Cu사이의 밀착력을 증가시키기 위해 Si wafer전처리 후 plasma와 SAMs처리 방법에 의한 Cu도금의 형성에 관한 방법을 설명하였다. Si wafer를 Piranha solution과 $0.5{\%}$ HF처리 후 유기박막인 SAMs과 plasma를 이용하는 방법으로 wafer와 Cu층 사이의 밀착력을 증가시켰다. 도금층의 밀착력은 scratch test 로 측정하였으며 , AFM을 이용해 시편에 형성된 패턴의 형태를 관찰하고 SEM과 EDS를 이용해 시편의 조직을 관찰하였다. 그 결과 Si wafer를 $O_{2}, He, SAMs$를 혼합처리 했을 때 밀착성이 가장 우수하였다.

• Restorative Dentistry and Endodontics
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• 제44권3호
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• pp.23.1-23.9
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• 2019

Objectives: The aim of this study was to investigate the microshear bond strength (${\mu}SBS$) of different universal adhesive systems applied to hybrid computer-aided design/computer-aided manufacturing (CAD-CAM) restorative materials repaired with a composite resin. Materials and Methods: Four types of CAD-CAM hybrid block materials-Lava Ultimate (LA), Vita Enamic (VE), CeraSmart (CS), and Shofu Block HC (SH)-were used in this study, in combination with the following four adhesive protocols: 1) control: porcelain primer + total etch adhesive (CO), 2) Single Bond Universal (SB), 3) All Bond Universal (AB), and 4) Clearfil Universal Bond (CU). The ${\mu}SBS$ of the composite resin (Clearfil Majesty Esthetic) was measured and the data were analyzed using two-way analysis of variance and the Tukey test, with the level of significance set at p < 0.05. Results: The CAD-CAM block type and block-adhesive combination had significant effects on the bond strength values (p < 0.05). Significant differences were found between the following pairs of groups: VE/CO and VE/AB, CS/CO and CS/AB, VE/CU and CS/CU, and VE/AB and CS/AB (p < 0.05). Conclusions: The ${\mu}SBS$ values were affected by hybrid block type. All tested universal adhesive treatments can be used as an alternative to the control treatment for repair, except the AB system on VE blocks (the VE/AB group). The ${\mu}SBS$ values showed variation across different adhesive treatments on different hybrid CAD-CAM block types.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.511-512
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• 2006

Tungsten coatings with different interlayers onto the oxygen-free copper substrates were fabricated by atmosphere plasma spraying. The effects of different interlayers of NiCrAl, NiAl and W/Cu on bonding strength were studied. SEM, EDS and XRD were used to investigate the photographs and compositions of these coatings. The tungsten coatings with different initial particle sizes resulted in different microstructures. Oxidation was not detected in the tungsten coating, but in the interlayer, it was found by both XRD and EDS. The tungsten coating deposited directly onto the copper substrate presented higher bonding strength than those with different interlayers.

• Journal of the Korean Wood Science and Technology
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• 제39권4호
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• pp.344-350
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• 2011

라디에타소나무 단판적층재(LVL)를 제조함에 있어서, CuAz 및 ACQ 방부처리와 비처리, 수성비닐우레탄 접착제와 페놀변성 리조시놀수지 접착제의 상온경화형 접착제를 적용함에 따른 밀도경사, 접착 강도성능 및 내부후성(방부효력)을 살펴보았다. 결과, LVL의 밀도경사에서 접착층 주변이 원추형으로 밀도가 커지는 경사패턴을 보였다. 접착성은 수성비닐우레탄 접착의 경우, 자비반복시험 후 전층이 박리되거나, 일부 층이 박리하고 할렬 틈새 현상이 일어났다. 페놀변성 리조시놀수지 접착제 접착의 경우, 자비반복시험 후 접착층의 응력이 큰데 연유한 굽음과 상하 접착층 사이의 단판의 수직할렬 현상이 있었으나, 접착층의 박리나 할렬이 거의 발견되지 않아 침지박리접착력은 높은 것으로 판단되었다. 한편, 방부효력시험에 있어서, 수성비닐우레탄 접착제로 적층한 LVL의 경우 갈색부후균에 의한 부후도가 백색부후균보다 크게 나타났다. 페놀변성 리조시놀수지 접착제로 LVL을 제조한 경우에는 갈색부후균에 의한 질량감소가 적었고, 약제를 처리하지 않더라도 그 피해가 낮았으며, 약제처리한 것은 질량감소율 0 수준을 보일 정도로 방부효력이 큰 것을 알 수 있었다.