• Journal of Conservation Science
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• v.28 no.2
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• pp.175-184
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• 2012

A purpose of this research is to find out characteristic of bronze artifacts and gold ornaments excavated from Xiongnu tombs No. 2~4 at Duurlig Nars in Mongolia through scientific analysis of them. The Tombs are comparatively small. There were still lots of relics remaining although the tombs had been already robbed. Also the tombs are evaluated important since the origin of them show coexisting of chinese and northern style. First of all, an analysis result about bronze vessels found in this site, they have high lead(Pb) content and relatively low tin(Sn) content, as compared with the Bronze Han Mirror and End-fittings of Bronze Parasol Rib. Especially in case of bronze tray and bronze lamp from the no. 2 tomb and also bronze cauldron from the no. 4 tomb contain only 1wt% of tin which means binary alloy composition(Cu-Pb). Also, in the case of gold ornaments found in the no. 2 tomb, they have comparatively high purity. And the research suppose that the high possibility of that they were used soldering using alloy of Au-Cu or diffused bonding(using malachite and copper oxide) for joining gold grains of gold granulation ornament. Further scientific research and analysis in Mongolia and other countries will provide more clues to solve mystery of Xiongnu culture.

• Resources Recycling
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• v.15 no.6 s.74
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• pp.41-47
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• 2006

A study for recovering of copper and lead from electronic scraps has been carried out using a combination of bioleaching and solvent extraction. It was found that the citric acid generated by Aspergillus niger could be an imporant leaching agent acting in the solubilization of copper, iron, lead and tin from the electronic scrap. Copper could be selectively extracted by 10% LIX84 from the leaching solution and it recoved 99.9% of metallic copper by electrowinning process. Tin and iron were extracted from the remaining solution by 10% Alamine336 and stripped by NaCl solution. Finally, tin could be recovered as a metallic precipitates from the mixed solution of tin and iron by cementation with iron powder.

• Economic and Environmental Geology
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• v.39 no.1 s.176
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• pp.9-25
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• 2006

Baekun gold-silver deposit is an epithermal quartz vein that is filling the fault zone within Triassic or Jurassic foliated granodiorite. Mineralization is associated with fault-breccia zones and can be divided into two stages. Stage I which can be subdivided early and late depositional stages is main ore mineralization and stage II is barren. Early stage I is associated with wallrock alteration and the formation of sulfides such as arsenopyrite, pyrite, pyrrhotite, sphalerite, marcasite, chalcopyrite, stannite, galena. Late stage I is characterized by Au-Ag mineralization such as electrum, Ag-bearing tetrahedrite, stephanite, boulangerite, pyrargrite, argentite, schirmerite, native silver, Ag-Te-Sn-S system, Ag-Cu-S system, pyrite, chalcopyrite and galena. Fluid inclusion data indicate that homogenization temperatures and salinity of stage I range from $171.6^{\circ}C\;to\;360.8^{\circ}C\;and\;from\;0.5\;to\;10.2\;wt.\%\;eq.$ NaCl, respectively. It suggest that ore forming fluids were cooled and diluted with the mixing of meteoric water. Also, Temperature (early stage I: $236\~>380^{\circ}C,\;$ late stage $I: <197\~272^{\circ}C$) and sulfur fugacity (early stage $I:\;10^{-7.8}$ a atm., late stage I: $10^{-14.2}\~10^{-l6}atm$.) deduced mineral assemblages from stage 1 decrease with paragenetic sequence. Sulfur ($2.4\~6.1\%_{\circ}$(early stage $I=3.4\~5.3\%_{\circ},\;late\;stage\;I=2.4\~6.1\%_{\circ}$)), oxygen ($4.5\~8.8\%_{\circ}$(quartz: early stage $I=6.3\~8.8\%_{\circ}$, late stage $I=4.5\~5.6\%_{\circ}$)), hydrogen ($-96\~-70\%_{\circ}$ (quartz: early stage $I=-96\~-70\%_{\circ},\;late\;stage\;f=-78\~-74\%_{\circ},\;calcite:\;late\;stage\;I=-87\~-76\%_{\circ}$)) and carbon ($-6.8\~-4.6\%_{\circ}$ (calcite: late stage I)) isotope compositions indicated that hydrothermal fluids may be magmaticorigin with some degree of mixing of another meteoric water for paragenetic time.

• Korean Journal of Materials Research
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• v.24 no.10
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• pp.543-549
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• 2014

A zinc oxide (ZnO) hybrid structure was successfully fabricated on a glass substrate by metal organic chemical vapor deposition (MOCVD). In-situ growth of a multi-dimensional ZnO hybrid structure was achieved by adjusting the growth temperature to determine the morphologies of either film or nanorods without any catalysts such as Au, Cu, Co, or Sn. The ZnO hybrid structure was composed of one-dimensional (1D) nanorods grown continuously on the two-dimensional (2D) ZnO film. The ZnO film of 2D mode was grown at a relatively low temperature, whereas the ZnO nanorods of 1D mode were grown at a higher temperature. The change of the morphologies of these materials led to improvements of the electrical and optical properties. The ZnO hybrid structure was characterized using various analytical tools. Scanning electron microscopy (SEM) was used to determine the surface morphology of the nanorods, which had grown well on the thin film. The structural characteristics of the polycrystalline ZnO hybrid grown on amorphous glass substrate were investigated by X-ray diffraction (XRD). Hall-effect measurement and a four-point probe were used to characterize the electrical properties. The hybrid structure was shown to be very effective at improving the electrical and the optical properties, decreasing the sheet resistance and the reflectance, and increasing the transmittance via refractive index (RI) engineering. The ZnO hybrid structure grown by MOCVD is very promising for opto-electronic devices as Photoconductive UV Detectors, anti-reflection coatings (ARC), and transparent conductive oxides (TCO).

• Journal of the Mineralogical Society of Korea
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• v.25 no.1
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• pp.41-50
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• 2012

페루 남동부 지역에 위치한 꾸스코 동-금을 포함한 다중금속 광상 지역의 지질은 고생대 페름기-중생대 삼첩기 변성퇴적암인 미투(Mitu)층군과 이를 관입한 동시기 관입암으로 구성되어 있다. 조사지역은 페름기-삼첩기 관입암과 관련된 U-W-Sn-Mo, Au-Cu-Pb-Zn, REE 광화작용과 관련된 금속광화 대로 알려져 있다. 특히 해당 관입암은 대자율 측정 결과 S-type, 티탄철석계열과 관련이 있는 것으로 보인다. 꾸스코 지역은 깔까 북쪽과 시꾸아니 부근에 주요 광화대가 발달하고 있다. 조사대상 광상은 아줄 동, 올미오 동, 빅토리아 금, 빠딴자 동, 나우챠피-초차까나 동, 체카 금광상이다. 아줄 광상의 모암은 안산암질암이며 광석광물로는 반동석 및 황동석이 산출하며, 동은 7.81~15.3%의 범위를 가지고 평균 10.7%이다. 올미오 광상의 모암은 흑색편암이며 엽리를 따라 산화동이 충진되어 있고, 동은 0.61~2.60%의 범위를 가지고 평균 1.74%이다. 빅토리아 광상의 모암은 변성퇴적암이며, 석영맥 충진형 광상으로 금함량은 < 0.1 g/t, 은함량은 < 0.1~< 0.3 g/t이다. 빠딴자 광상에서는 이암 또는 실트암의 층리를 따라 충진하고 있는 산화동이 산출하며, 동은 3.74~9.21%의 범위를 보이며 평균 6.21%이다. 나우챠피-초차까나 광상은 적색사암의 층리를 교대충진하고 있는 산화동 광체이며, 동은 1.62~10.5%의 범위를 가지며 평균 6.39%이다. 체카 광상은 모암인 규암이 각력화작용을 받은 부분에서 금이 산출되고 있는 것으로 보고되어있으나 분석결과 금이 탐지되지는 않았다.

• Applied Biological Chemistry
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• v.39 no.5
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• pp.349-354
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• 1996

The Polyvinyl alcohol(PVA) oxidase involved in PVA degradation by microorganism has been purified to homogeneity from culture broth of Xanthomonas campestris J2Y grown in a minimal medium containing PVA as a sole carbon source. The enzyme was purified by DEAE-cellulose chromatograpy and Sephadex G-150 gel filtration. The purified PVA oxidase was electrophoretically homogeneous both in the absence and presence of SDS. The molecular weight of the enzyme was estimated to be about 55,000 daltons by SDS-polyacrylamide gel electrophoresis and Sephadex G-150 gel filtration. The native enzyme existed as a monomer. The optimal pH and temperature was shown to be pH 7 and $37^{\circ}C$ respectively. The activity of enzyme was stable below $55^{\circ}C$ and between pH range of $5{\sim}11$. The enzyme activity was significantly inhibited by metal compounds such as $Ag^{2+},\;Hg^{2+}$. While, metal ions such as $Mn^{2+},\;and\;Cu^{2+}$ stimulated the reaction. Km value of the enzyme for PVA was $7.04{\times}10^{-2}mmol/{\ell}$.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.25-31
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• 2015

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from electronic devices and system. Specifically, reliability issue of lead-free solder joint have an increasing demand for the car electronics caused by ELV banning. The authors prepared engine control unit and cabin electronics soldered with Sn-3.0Ag-0.5Cu (SAC305). To compare with the degradation characteristics of solder joint strength, thermal cycling test (TC), power-thermal cycling test (PTC) and series tests were conducted. Series tests were conducted for TC and PTC combined stress test using the same sample in sequence and continuously. TC test was performed at $-40{\sim}125^{\circ}C$ and soak time 10 min for 1000 cycles. PTC test was applied by pulse power and full function conditions during 100 cycles. Combined stress test was tested in accordance with automotive company standard. Solder joint degradation was observed by optical microscopy and environment scanning electron microscopy (ESEM). In addition, to compare with deterioration of bond strength of quad flat package (QFP) and chip components, we have measured lead pull and shear strength. Based on the series test results, consequently, we have validated of series test method for lifetime and reliability of Pb-free solder joint in automotive electronics.

• Resources Recycling
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• v.24 no.5
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• pp.33-39
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• 2015

A basic study was conducted to effectively recover nitric acid from a waste solder stripper by diffusion dialysis using anion exchange membranes. The effects of flow rate, flux ratio, nitrate concentration, and metallic ion types and concentration on the recovery percentage of nitric acid were investigated. The recovery percentage of nitric acid was decreased with the increase of flow velocity. But the recovery percentage of nitric acid was increased as the increase of flux ratio(W/F) and showing a recovery percentage of nitric acid of about 99% at a flux ratio of 1.5 or more. As the increase of nitric acid concentration in feed solution, the recovery percentage of nitric acid was increased up to 3.0M, but in case of greater than 3.0M, the recovery percentage gradually was decreased. Leakage percentage of metallic ions through the membrane were in the order of Pb, Na and Cu but Fe and Sn did not leakaged. As a result of diffusion dialysis using real waste solder stripper at a flow rate of $0.9L/hr-m^2$, W/F = 1.3, a recovery percentage of nitric acid of approximately 94% was gained.

• Journal of the Korean Society of Food Science and Nutrition
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• v.31 no.3
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• pp.361-366
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• 2002

A. capillaris Thunberg is often used as a medicinal herb. This analysis on A. capillaris Thunberg, showing its natural ingredients and nutritive elements, is to provide a better understanding of its content and help find more various ways of use. The ingredients of A. capillaris Thunberg are as follows : 14.12% of crude protein, 4.80% of crude lipid, 2.30% of crude ash, 8.10% of crude fiber, and the rest of the ingredients are vitamins and minerals. Minerals are 3295.02 mg% of K, 2787.01 mg% of P, 1436.01 mg% of Ca, 172.32 mg% of Mg, 21.23 mg% of Fe, 18.02 mg% of Mn, 8.11 mg% of Na, 1.24 mg% of Cu, and 0.002 mg% of Sn, and vitamins are 18602.00 ug% of $\beta$-carotene and 5.82 mg% of ascorbic acid. Fatty acids in A. capillaris Thunberg are of 23.86% of oleic acids (C18:1), 46.67% of saturated fatty acids, 33.40% of monousaturated fatty acids, and 19.83% of polyunsaturated fatty acids. Oleic acid (C18:1) is the most abundant fatty acid in A. capillaris Thunberg. P/S is 0.24. A. capillaris Thunberg contains about 20 kinds of amino acid. The total amount of amino acids is 1345.29 mg%, which can be divided into 79.95% of amino acids and 13.11% of essential amino acids. This 79.95% of amino acids consist of proline, tyrosine, asparagines, glutamic acid, and valine with amount of 438.58mg%, 310.20mg%, 120.30mg%, 118.66mg%, and 88.02mg% respectively. The essential amino acid is 176.83mg%. It is shown that A. capillaris Thunberg contatins various nutrients such as minerals, vitamins, fatty acids, and amino acids, so A. capillaris Thunberg can be regarded as a highly nutritious food.

• Journal of Welding and Joining
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• v.26 no.3
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• pp.30-36
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• 2008

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.