• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2004년도 SMICS 2004 International Symposium on Maritime and Communication Sciences
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• pp.70-73
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• 2004

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 춘계학술대회 논문집
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• pp.43-44
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• 2015

Electrodeposited Ni and Ni-SiC composite coatings were prepared on Cu substrates by using the Ni-Sulfamate electrolytic bath. Thus prepared samples were subjected for the two different types of post surface modification techniques; i.e. Laser Surface Texturing (LST) and Ultrasonic Nano Surface Modification (UNSM), respectively in order to investigate their effects on surface and interface related properties of the coatings. Hemispherical dimples, with 80 to 200 um dimple spacing, were created and examined on the surfaces of the materials studied. The results revealed that micro-surface texturing with 150 um dimple spacing considerably improved the coefficient of friction. Dimple spacing accuracy and incorporated second phase ceramic particles both contributed significantly to reduction in coefficient of friction. On the other hand, application of UNSM considerably modified the surface topography, led to increase the Vickers microhardness, and reduced the wear and coefficient of friction as compared to non UNSM treated Ni and Ni-SiC samples.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.308-312
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• 2003

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics ($Al_2O_3-SiO_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a $Cu/Al_2O_3-SiO_2$ ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.559-562
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• 2004

The $high-T_c$ Superconducting(HTS) antenna which consists of "H" type resonator has the benefits for the miniaturization of antenna in comparison with the microstrip antenna of the similar dimension. To fabricate the "H" type antenna HTS $YBa_2Cu_3O_{7-x}$(YBCO) thin films were deposited on MgO substrates using rf-magnetron sputtering. Standard etching processes were performed for the patterning of the "H" type antenna. For comparison between normal conducting antennas and superconducting antennas, the gold antennas with the same dimension were also fabricated. An aperture coupling was used for impedance matching between $50\Omega$ feed line and HTS radiating patch. The diverse experimental results were reported in terms of the resonant frequency, the return loss and the characteristics impedance. The "H" type superconducting antenna showed the performance of 1.36 in SWR, 24 % in efficiency, and 14.6 dB in the return loss superior to the normal conducting counterpart.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.359-359
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• 2010

Self-organized nanostructures of dots, holes or ripples produced by energetic ion bombardment have been reported in a wide variety of substrates. Ion bombardment on an alloy or compound also draws much attention because it can induce a surface composition modulation with a topographical surface structure evolution. V. B. Shenoy et al. further suggested that, in the case of alloy surfaces, the differences in the sputtering yields and surface diffusivities of the alloy components will lead to a lateral surface composition modulation [1]. In the present work, the classical molecular dynamics simulation of Ar bombardment on metallic alloys at room temperature revealed that this bombardment induces a surface composition modulation in layer-by-layer mode. In both the $Co_{0.5}Cu_{0.5}$ alloy and the CoAl B2 phase, the element of higher-sputtering yield is accumulated on the top surface layer, whereas it is depleted in lower layers. A kinetic model considering both the rearrangement and the sputtering of the substrate atoms agrees with the puzzling simulation results, which revealed that the rearrangement of the substrate atoms plays a significant role in the observed composition modulation.

• 미생물학회지
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• 제15권1호
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• pp.9-19
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• 1977

Xylone isomerase (D-xylose ketol-isomerase, EC 5,3,1,5) have been demonstrated in the cell-free extracts of Stroptomuces canus and Streptomuces malachiticus grown in the presence of xylose. Xylose, glucose and ribose served as substrates for the enzymes of the two strains with respective $K_m$ values of 22, 130, 290 mM (S. canus) and 7,83,637 mM(S.malachiticus), and $V_max$ values of 1,000, 0.087, $\0.0222{\mu}moles/min/mg$ protein (S. canus) and 0.312, 0.083, 0.500.$\mu$moles/min/mg protein (S. malachiticus). L-Rhammose was also isomerized by the crude enzyme solutions of the two strains. The maximal activities of the two xylose-isomerases were observed at pH 7.5 and $75^{\circ}C$. The xylose isomerase activities of the two strains were activated two-three times by $Mg^{++}\;and\;Co^{++}$ as that of control, partially activated by $Ba^{++}$ and inhibited by $Ni^{++},\;Ca^{++}\;and\;Zn^{++}\$. Particulary, the addtion of $Mn^{++}$ stimulated xylose-isomerizing activities, but inhibited glucose-isomerizing activities in both strains. However, $Cu^{++}$ inhibited xylose-isomerizing activities, while stimulated glucose-isomerizing activities of the enzymes.

• 대한금속재료학회지
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• 제49권2호
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• pp.187-191
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• 2011

In order to obtain a suitable back contacting electrode for $Cu(InGa)Se_2$-based photovoltaic devices, a molybdenum thin film was deposited using a chemical vapor transport (CVT) during the hydrogen reduction of $MoO_3$ powder. A $MoO_2$ thin film was successfully deposited on substrates by using the CVT of volatile $MoO_3(OH)_2$ at $550^{\circ}C$ for 60 min in a $H_2$ atmosphere. The Mo thin film was obtained by reduction of $MoO_2$ at $650^{\circ}C$ in a $H_2$ atmosphere. The Mo thin film on the substrate presented a low sheet resistance of approximately $1{\Omega}/sq$.

• 한국표면공학회지
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• 제54권3호
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• pp.124-132
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• 2021

Graphene which grown on the cobalt or nickel sputtered copper foil depending on the annealing time was studied. Graphene on the copper foil grown by chemical vapor deposition was compared to those on cobalt or nickel sputtered copper foil by using a RF (Radio Frequency) magnetron sputtering at room temperature. FLG(few-layer graphene) was identified independent of substrates by Raman and X-Ray Photoelectron Spectroscopy analyses. On copper foil, size and area fraction of the graphene growth increased until 30 minutes annealing and then didn't changed. Comparing to that, graphene on the cobalt refined till 50 minutes annealing, after then the effect disappeared which means a similar shape to that on copper foil. On nickel the graphene refined irrespective of annealing time that is possibly because of the complete solid solution of nickel with copper.

• 한국초전도ㆍ저온공학회논문지
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• 제8권3호
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• pp.13-17
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• 2006

The effect of the addition of the nano size $Y_2O_3$ powder on the microstructurte and superconducting properties of YBCO thin film deposited on LAO single crystalline substrate by TFA-MOD method was studied. Nano size $Y_2O_3$ powder was added to the stoichiometric precursor solution with a cation ratio of Y : Ba . Cu = 1 : 2 : 3 prepared using TFA as chelating agent. Precursor solutions with and without $Y_2O_3$ addition were coated on $LaAlO_3(100)$ single crystalline substrates by dip coating method. Calcination and conversion heat treatments were performed in controlled atmosphere containing moisture Current carrying capacity(Jc) of YBCO film was enhanced about 50% by $Y_2O_3$ doping and it is thought to be due to the better connectivity of YBCO grains and/or the flux pinning by the $Y_2O_3$ particles embedded in YBCO grains.

• 한국초전도ㆍ저온공학회논문지
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• 제8권1호
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• pp.19-22
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• 2006

Desirable substrates for $YBa_2Cu_3O_{7-\delta}$ coated conductor are highly cube textured Ni or Ni-alloy tapes, which can be produced by cold rolling and recrystallization annealing. We have fabricated hi-axially textured pure Ni tapes for the application of coated conductors. The sintered Ni rod was cold-rolled into the thin tapes of $50{\mu}m$ thickness and the tapes were heat-treated for texture development with line-focused infrared heater. The temperature was maintained at $800\sim1050^{\circ}C$, using 1kW double ended linear halogen lamp in $96%Ar-4%H_2$ atmosphere The biaxially tortured Ni tapes were successfully formed by line-focused infrared heat treatment The texture of the annealed Ni tapes was analysed using the GADDS (general area detector diffraction system). The full width at half maximum values of phi and omega scan for the Ni tapes were less than $10^{\circ}$ and the grain size was $20-50{\mu}m$.