• 제목/요약/키워드: Cu electroless plating

검색결과 126건 처리시간 0.028초

감마선 자극에 의한 금속이온 이식 도전성 폴리머 (Surface Metallization of Polyethylene Films Modified by Radiation Grafting of N-vinyl Pyrollidone)

  • A. Aal;V. V. Khutoryanskiy;Z. S. Nurkeeva;G. A. Mun;Soh, Dea-Wha
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2003년도 추계종합학술대회
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    • pp.403-406
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    • 2003
  • Poyethylene(PE) films could be modified by radiation grafting of N-vinyl pyrollidone(NVP) using radiation. FTIR spectra was used to confirm the modification of PE films. The modified films were activated by one-step or two-step methods for electroless Cu plating. Morphology of metallized films has been investigated. Electroless Cu plating onto the modified films depends mainly on the grafting degree and activation type. The electrical conductivity and adhesion of the metallized films has been investigated and tested in regard of grafting degree of samples.

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하이드로퀴논 환원제를 사용한 은코팅 구리 플레이크의 제조에서 공정 변수의 영향 (Effects of Process Variables on Preparation of Silver-Coated Copper Flakes Using Hydroquinone Reducing Agent)

  • 오상주;이종현
    • 마이크로전자및패키징학회지
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    • 제24권3호
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    • pp.57-62
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    • 2017
  • 하이드로퀴논 환원제를 사용하는 무전해 은도금 방법으로 은(Ag)코팅 구리(Cu) 플레이크를 제조하는 공정에서 전처리 용액, 반응온도, pH, Ag 도금액 조성 및 주입속도, 펄프농도 등 여러 변수를 변화시켜가며 우수한 품질의 Ag 코팅이 형성되는 공정조건들을 확보하였다. Cu 플레이크 표면의 산화층을 제거하기 위한 효과적인 전처리 용액이 제시되었고, 낮은 반응온도, 4.34 수준의 pH값, 느린 Ag 도금액 주입속도, Ag 도금액에서 증류수 제거, 높은 펄프농도 조건에서 분리형 미세 Ag 입자들의 생성이 억제되고, Cu 표면 커버리지가 우수한 Ag 코팅층이 형성됨을 확인할 수 있었다.

무전해 도금을 이용해 제작한 Pd, Pd/Cu 분리막의 수소 투과 성능 (Hydrogen Permeation Performance of Pd, Pd/Cu Membranes Manufactured through Electroless Plating)

  • 이정인;신민창;장학룡;황재연;정창훈;박정훈
    • 멤브레인
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    • 제32권6호
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    • pp.456-464
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    • 2022
  • 본 실험에서는 무전해 도금을 통하여 Pd 및 Pd-Cu 분리막을 제조하여 수소 투과 성능을 분석하였다. 분리막의 지지체는 α-Al2O3 세라믹 중공사를 사용하였다. Pd-Cu 분리막은 무전해 도금을 실시하였고 Pd-Cu 합금을 만들기 위하여 수소 분위기에서 500°C, 18 h 동안의 열처리 과정을 거쳤다. 그 후, Pd-Cu 분리막은 EDS (Energy Dispersive X-ray Spectroscopy), XRD (X-ray Diffraction) 분석을 통해 합금이 형성된 것을 확인하였다. Pd 및 Pd-Cu 도금층의 두께는 SEM (Scanning Electron Microscope) 분석을 통해 각각 약 3.21, 3.72 µm으로 측정되었다. 수소 투과 성능은 수소 단일 가스, 혼합가스(H2, N2)에서 350~450°C, 1~4 bar의 범위에서 수소 투과 실험을 진행하였다. 수소 단일 가스에서 Pd 및 Pd-Cu 분리막은 450°C, 4 bar에서 최대 54.42, 67.17 ml/cm2⋅min의 flux를 가지며, 혼합가스에서는 450°C, 4 bar의 조건일 때, 각각 1308, 453의 separation factor가 나오는 것을 확인하였다.

PET 필름기재의 구리 무전해도금에 있어서 초임계 CO2 유체가 도금 특성에 미치는 영향 (Effect of Added Supercritical CO2 on the Characteristics of Copper Electroless Plating on PET Film Substrate)

  • 이희대;김문선;김철경
    • Korean Chemical Engineering Research
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    • 제45권4호
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    • pp.384-390
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    • 2007
  • 본 연구는 $CO_2$ 초임계 유체를 도금액과 혼합하여 PET 필름 위에 무전해 구리도금을 실시하였으며 초임계 유체의 혼용조건에 따른 그 도금 효과를 비교하였다. 이산화탄소 초임계 유체와 도금액의 부피비는 1:9가 최적이였으며 초임계 유체가 10 vol% 이상이 되면 혼합액의 분산성이 불량해져 층분리가 발생하였다. 구리 무전해도금은 $25^{\circ}C$, 15 MPa 에서 수행된 구리막의 표면물성이 가장 균일하였다. 무전해 구리도금에서 도금액과 혼합시킨 초임계 유체의 역할은 단순히 용해도를 높여 주는 것이 아니라 도금막을 구성하는 구리입자를 1차 입자상태로 분산, 유지시킴을 확인하였다.

도전섬유의 전자파 차폐특성에 미치는 섬유구조 및 도금방법의 영향 (Effect of Fabric Structure and Plating Method on EMI Shielding Property of Conductive Fabric)

  • 김동현;이성준
    • 한국표면공학회지
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    • 제48권4호
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    • pp.149-157
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    • 2015
  • We investigated the effects of the fabric structure or the kinds of plated metals on the electromagnetic interference shielding effectiveness (EMI SE) by means of electroless plating on polyester fabric. We found that the weight of deposited metal, EMI SE, and flexibility of the conductive fabric for EMI shield is affected by morphology of fabric and structure of fiber. The EMI SE of conductive fabric plated Ni/Cu/Ni by electroless plating method on draw textured yarn (DTY) polyester was in the practically useful range of above 70 dB over a wide frequency range of 10 MHz to 1.0 GHz at the surface resistivity of $0.05{\Omega}/{\square}$. Au or Ag plated conductive fabric by immersion plating method is not able to provide for a good EMI SE.

무전해(無電解) 구리 도금폐액(鍍金廢液)으로부터 구리의 회수(回收) 연구(硏究) (Recovery of Copper in Wastewater from Electroless Plating Process)

  • 이화영;고현백
    • 자원리싸이클링
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    • 제21권6호
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    • pp.39-44
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    • 2012
  • 무전해 구리 도금폐수로부터 증발농축 및 전해채취법을 이용하여 구리를 회수하기 위한 연구를 수행하였다. 무전해 구리 도금폐수의 분석결과, Cu 함량은 582 mg/l로 나타났으며, 미량의 Fe 성분이 함유되어 있었다. 또한, 로셀염의 첨가로 인하여 COD 9,560 mg/l, TOC 13,100 mg/l로써 매우 높았으며, 포름알데히드가 산화된 formic acid의 함량은 7.73%로 나타났다. 실험결과, 구리의 전해채취시 전류밀도가 증가할수록 전류효율은 감소하는 것으로 나타났다. 또한, 전류효율을 80% 이상으로 유지하기 위해서는 구리의 전해채취시 전류밀도를 $40mA/cm^2$ 이하로 낮추어야 함을 알 수 있었다. 전해채취를 통해 얻은 Cu중의 평균 Fe 함량은 황산농도 2 vol% 및 10 vol%에서 각각 0.021% 및 0.01%로 나타나 황산농도가 높을수록 Fe 혼입을 억제할 수 있는 것으로 나타났다.

Analysis of Ni/Cu Metallization to Investigate an Adhesive Front Contact for Crystalline-Silicon Solar Cells

  • Lee, Sang Hee;Rehman, Atteq ur;Shin, Eun Gu;Lee, Doo Won;Lee, Soo Hong
    • Journal of the Optical Society of Korea
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    • 제19권3호
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    • pp.217-221
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    • 2015
  • Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

알루미늄 기판의 무전해 니켈-구리-인 합금도금에 관한 연구(I) 전해액 및 열처리 조건이 무전해 니켈-구리-인 도금층의 제 물성에 미치는 영향 (A Study on the Electroless Ni-Cu-P Alloy Plating of Al Base Hard Disk(I)Effect on some Properties of Electroless Ni-Cu-P Deposits by Electrolyte and Heat Treatment Condition)

  • 오이식;황용길
    • 한국표면공학회지
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    • 제24권2호
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    • pp.103-113
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    • 1991
  • Electroless Ni-Cu-P alloy plating of Al base hard disk was performed to investigate some properties according to the change of composition. It was found that the composition of Ni and Cu in deposits changed linearly with increasing the mole ratio of NiSO4.6H2O/CuSO4.5H2O. The increase in hardness by heat - treatment was confirmed to be associated with small size grained crystallization of the amorphous deposits. Acid resistance of all deposits layer. which had been heated up to 30$0^{\circ}C$, was found to be exellent when immersed in 1N-H2SO4 solution, and it showed more superior acid resistance with decreasing Cu content and with increasing P. The resistivity of the deposits heat treated became smaller at temperature more than 50$0^{\circ}C$, and it became largerly with increasing P content. Cu 44.1wt% alloy(C bath) showed the most superior non-magnetically stable characteristics after heat treatment. It was superiorly with higher temperature and with decreasing P content.

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SnO2-Coated 3D Etched Cu Foam for Lithium-ion Battery Anode

  • Um, Ji Hyun;Kim, Hyunwoo;Cho, Yong-Hun;Yoon, Won-Sub
    • Journal of Electrochemical Science and Technology
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    • 제11권1호
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    • pp.92-98
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    • 2020
  • SnO2-based high-capacity anode materials are attractive candidate for the next-generation high-performance lithium-ion batteries since the theoretical capacity of SnO2 can be ideally extended from 781 to 1494 mAh g-1. Here 3D etched Cu foam is applied as a current collector for electron path and simultaneously a substrate for the SnO2 coating, for developing an integrated electrode structure. We fabricate the 3D etched Cu foam through an auto-catalytic electroless plating method, and then coat the SnO2 onto the self-supporting substrate through a simple sol-gel method. The catalytic dissolution of Cu metal makes secondary pores of both several micrometers and several tens of micrometers at the surface of Cu foam strut, besides main channel-like interconnected pores. Especially, the additional surface pores on etched Cu foam are intended for penetrating the individual strut of Cu foam, and thereby increasing the surface area for SnO2 coating by using even the internal of Cu foam. The increased areal capacity with high structural integrity upon cycling is demonstrated in the SnO2-coated 3D etched Cu foam. This study not only prepares the etched Cu foam using the spontaneous chemical reactions but also demonstrates the potential for electroless plating method about surface modification on various metal substrates.

무전해 도금법을 이용한 코어 셸 구조의 Cu-Ag분말 제조 (Preparation of Cu-Ag Powder having Core-Shell Structure by Electroless Plating Method)

  • 김종완;이혁희;원창환
    • 한국표면공학회지
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    • 제42권1호
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    • pp.47-52
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    • 2009
  • Cu-Ag powder having Core-Shell structure was prepared from by electroless plating method using agents such as $AgNO_3$, $NH_{4}OH$, Hydroquinone. Ag coated copper powders were analyzed using scanning electron microscopy(SEM) and energy dispersive X-ray spectrometer(EDX). The silver coating layer of copper powder was affected from various reaction conditions such as molar ratio of $NH_{4}OH$, $AgNO_3$, and pulp density. Free silver was generated below 0.1M or 0.3M and above of $NH_{4}OH$ mole ratio. Silver coating layer thickened as addition of $AgNO_3$. When the pulp density reached 12% with 0.2M $NH_{4}OH$, and 0.15M $AgNO_3$ at $4^{\circ}C$, silver was homogeneously distributed around the copper particles and free silver particles were not generated.