• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.158-161
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• 2004

We have studied a lifetime in organic light-emitting diodes depending on buffer layer. A transparent electrode of indium-tin-oxide(ITO) was used as an anode. And the cathode for electron injection was LiAl. Phthalocyanine Copper(CuPc), Poly(3,4-ethylenedioxythiophene):poly (PEDOT:PSS), or poly (9-vinylcarbazole)(PVK) material was used as a buffer layer. A thermal evaporation was performed to make a thickness of 40nm of TPD layer at a rate of $0.5{\sim}1\;{\AA}/s$ at a base pressure of $5{\times}10^{-6}\;torr$. A material of tris(8-hydroxyquinolinate) Aluminum($Alq_3$) was used as an electron transport and emissive layer. A thermal evaporation of $Alq_3$ was done at a deposition rate of $0.7{\sim}0.8[{\AA}/s]$ at a base pressure of $5{\times}10^{-6}\;torr$. By varying the buffer material, hole injection at the interface could be controlled because of the change in work function. Devices with CuPc and PEDOT:PSS buffer layer are superior to the other PVK buffer layer.

• 전기화학회지
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• 제17권3호
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• pp.164-171
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• 2014

무효소 혈당센서는 높은 선택성과 민감성을 가지고 저비용으로 체내 혈당(glucose)을 검출할 수차세대 기술이다. 현재 시판되고 있는 혈당센서는 당을 산화시켜주는 당산화효소와 전극과 효소사이에 전자 전달을 원활하게 해주는 산화/환원 매개체를 이용하여 효소센서로 제작된다. 그러나 이러한 효소센서는 pH, 온도, 습도, 화학적 독성물질 등에 영향을 많이 받아 안정성이 떨어지고, 제작에 비용이 많이 드는 단점을 가지고 있다. 본 논문은 위와 같은 단점을 해결하고자 환원제인 당에 의하여 환원되는 니켈 나노입자를 전기화학적 흡착방법을 이용하여 산화 인듐 주석 전극 (ITO)에 고정시켰다. 고정된 니켈 나노입자는 전극의 표면적을 넓혀 신호를 증폭시키는 효과를 가지고 있으며, 당에 의하여 계속적으로 니켈이 환원됨에 따라 전극 반응에서는 촉매산화전류 반응으로 나타낸다. 당의 농도에 따라서 선형적으로 감응 할 수 있는 최적 조건의 니켈 나노입자를 이용하여 혈당센서를 제작하였다. 또한 체내에 존재하는 방해 인자인 아스코브산의 간섭을 억제하기 위해 음이온 고분자의 표면처리를 통하여 상대적으로 당에 선택적으로 감응하도록 하였다. 제작된 전극을 통하여 당 농도 별 산화 촉매 전류를 순환 전압 전류 법으로 측정한 결과 650 mV (vs. Ag/AgCl)에서 최대 전기적 신호가 발생되었으며, 포도당 0~6.15 mM 의 농도범위에서 전기적 신호가 선형 증가함을 확인할 수 있었다.

• Tribology and Lubricants
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• 제28권4호
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• pp.173-177
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• 2012

We used contact resonance force microscopy (CRFM) technique to determine the quantitative elastic properties of multiple materials integrated on the sub micrometer scale. The CRFM approach measures the frequencies of an AFM cantilever's first two flexural resonances while in contact with a material. The plain strain modulus of an unknown or test material can be obtained by comparing the resonant spectrum of the test material to that of a reference material. In this study we examined the following bumping materials for flip chip by using copper electrode as a reference material: NiP, Solder (Sn-Au-Cu alloy) and under filled epoxy. Data were analyzed by conventional beam dynamics and contact dynamics. The results showed a good agreement (~15% difference) with corresponding values determined by nanoindentaion. These results provide insight into the use of CRFM methods to attain reliable and accurate measurements of elastic properties of materials on the nanoscale.

• Bulletin of the Korean Chemical Society
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• 제31권2호
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• pp.401-405
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• 2010

The Schiff base 1,2-bis(E-2-hydroxy benzylidene amino)anthracene-9,10-dione has been synthesized and explored as ionophore for preparing PVC-based membrane sensors selective to the copper ($Cu^{2+}$) ion. Potentiometric investigations indicate high affinity of these receptors for copper ion. The best performance was shown by the membrane of composition (w/w) of ionophore: 1 mg, PVC: 33 mg, DOP: 66 mg and KTpClPB as additive were added 50 mol % relative to the ionophore in 1 ml THF. The proposed sensor's detection limit is $2.8{\times}10^{-7}$ M over pH 5 at room temperature (Nernstian slope 31.76 mV/dec.) with a response time of 15 seconds and showed good selectivity to copper ion over a number of interfering cations.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.371.2-371.2
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• 2016

Graphene electronics is one of the promising technologies for the next generation electronic devices due to the outstanding properties such as conductivity, high carrier mobility, mechanical, and optical properties along with extended applications using 2 dimensional heterostructures. However, large contact resistance between metal and graphene is one of the major obstacles for commercial application of graphene electronics. In order to achieve low contact resistance, numerous researches have been conducted such as gentle plasma treatment, ultraviolet ozone (UVO) treatment, annealing treatment, and one-dimensional graphene edge contact. In this report, we suggest a fabrication method of one-dimensional graphene metal edge contact without using graphene exfoliation. Graphene is grown on Cu foil by low pressure chemical vapor deposition. Then, the graphene is transferred on $SiO_2/Si$ wafer. The patterning of graphene channel and metal electrode is done by photolithography. $O_2$ plasma is applied to etch out the exposed graphene and then Ti/Au is deposited. As a result, the one-dimensional edge contact geometry is built between metal and graphene. The contact resistance of the fabricated one-dimensional metal-graphene edge contact is compared with the contact resistance of vertically stacked conventional metal-graphene contact.

• 한국전기전자재료학회논문지
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• 제20권9호
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• pp.766-770
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• 2007

In this study, in order to develop low temperature sintering ceramics for multilayer piezoelectric actuator, $0.07Pb(Mn_{1/3}Nb_{2/3})O_3-xPb(Ni_{1/3}Nb_{2/3})O_3-(0.93-x)Pb(Zr,Ti)O_3$ ceramics system were fabricated using $Li_2CO_3-Bi_2O_3-CuO$ sintering aids and the specimens were sintered at $930^{\circ}C$. Thereafter, their piezoelectric and dielectric characteristics were investigated according to the amount of PNN substitution. At 9 mol% PNN substitution, density, electromechanical coupling factor ($k_p$), dielectric constant, mechanical quality factor ($Q_m$) and piezoelectric constant ($d_{33}$) showed the optimum value of $7.86g/cm^3$, 0.60, 1640, 1323 and 387 pC/N, respectively. It is considered that these values are suitable for piezoelectric divece application such ad multilayer piezoelectric actuator and ultrasonic vibrator with pure Ag internal electrode.

• Journal of Welding and Joining
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• 제23권1호
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• pp.41-47
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• 2005

Arc pressure is one of important factors in understanding physical arc phenomena. Especially it affects on the penetration, size and shape of TIG welding. Some researches were reported on the effect of arc pressure in low and middle current region. But there are not any research in high current region. The purpose of this study is to investigate the arc pressure distribution with mixing ratio of shield gas such as Ar and He gases. A Cu block with water cooling was specifically designed and used as an anode electrode in order to measure the arc pressure in high current region. Then, the arc pressure distribution was measured with change in welding current and mixing ratio of shield gases. The arc force was obtained by numerically integrating the measured results. As the results, it was shown that the arc pressure was concentrated at the central part of the arc in middle and high current regions when a pure Ar gas was used. In case of Ar + He mixing gas, the arc pressure was much lower than that of pure Ar gas. In addition, it was widely distributed to radial direction.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 1999년도 High Temperature Superconductivity Vol.IX
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• pp.63-66
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• 1999

We fabricated ramp-edge Josephson junctions with barriers formed by interface treatments instead of epitaxially grown barrier layers. Low-dielectric Sr$_2AITaO_6$(SAT) layer was used as an ion-milling mask as well as an insulating layer for the ramp-edge junctions. An ion-milled YBa$_2Cu_3O_{7-x}$ (YBCO)-edge surface was not exposed to solvent through all fabrication procedures. The barriers were produced by structural modification at the bottom YBCO edge using plasma treatment prior to deposition of the top YBCO electrode. We investigated the effects of pre-annealing and post-annealing on the characteristics of the interface-treated Josephson junctions. The junction parameters were improved by using in-situ RF plasma cleaning treatment.

• 한국재료학회지
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• 제16권5호
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• pp.285-291
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• 2006

Copper powders have been widely used in electrically conductive coatings, electrode materials et al. and are very prospective since they are cheaper than noble metal powders such as silver or palladium. In this study, copper powders for metal filler of EMI shielding have been prepared using a solvothermal process from $CuSO_4$, NaOH, Glucose, mixed solvent ($H_2O$: Ethanol) and hydrazine which was used as a reducing agent at various reaction conditions. The prepared copper powders showed finely dispersed spherical shape without agglomerate, uniform morphology, narrow size distribution, high purity and were about 400-700 nm in size. The prepared powders were characterized using XRD, SEM, TGA, XPS, particle size measurement and EMI shielding efficiency.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2004년도 춘계학술발표회
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• pp.211-218
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• 2004

The objective of this study is to enhance the ultimate bearing capacity of piles embedded in marine clay by electrokinetic(EK). The focus of improvement is at interlace between soil and pile. A series laboratory test was performed in EK cell. In each of test, the pile in the centre as anode is surrounded by cathode and it was installed in the vicinity of pile with triangular layout. The pile was made by stainless and embedded with 30cm of depth. Afterward, the DC voltage was applied to electrode over period of time. It caused flowing water from anode to cathode, thus the soil in the center of box has higher bearing capacity value than in the side of box has. It is shown by increasing of un-drained shear strength(Cu) near the pile and also ultimate bearing capacity of pile increase after EK treatment. In the future work, the continuous of this study is finding the effective DC voltage and makes EK treatment more applicable in the field.