• 한국재료학회지
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• 제19권3호
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• pp.174-178
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• 2009

The effects of post-CMP cleaning on the chemical and galvanic corrosion of copper (Cu) and titanium (Ti) were studied in patterned silicon (Si) wafers. First, variation of the corrosion rate was investigated as a function of the concentration of citric acid that was included in both the CMP slurry and the post-CMP solution. The open circuit potential (OCP) of Cu decreased as the citric acid concentration increased. In contrast with Cu, the OCP of titanium (Ti) increased as this concentration increased. The gap in the OCP between Cu and Ti increased as citric acid concentration increased, which increased the galvanic corrosion rate between Cu and Ti. The corrosion rates of Cu showed a linear relationship with the concentrations of citric acid. Second, the effect of Triton X-$100^{(R)}$, a nonionic surfactant, in a post-CMP solution on the electrochemical characteristics of the specimens was also investigated. The OCP of Cu decreased as the surfactant concentration increased. In contrast with Cu, the OCP of Ti increased greatly as this concentration increased. Given that Triton X-$100^{(R)}$ changes its micelle structure according to its concentration in the solution, the corrosion rate of each concentration was tested.

• 폴리머
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• 제33권3호
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• pp.191-197
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• 2009

박막형 유기 태양전지의 성능 향상을 위하여 정공 수송층인 CuPc 층에 강한 p형 유기 반도체인 $F_4$-TCNQ을 도핑하여 ITO/PEDOT:PSS/CuPc: $F_4$-TCNQ(5wt%)/CuPc:C60 (blending ratio 1 : 1)/C60/BCP/LiF/Al의 이종 접합 구조를 가지는 P-i-n형 유기 박막형 태양전지 소자를 진공증착 장비를 이용하여 제조한 후, 유기 태양전지의 전류 밀도-전압(J-V) 특성, 단락 전류($J_{sc}$), 개방 전압($V_{oc}$), 충진 인자(fill factor: FF), 에너지 전환 효율(${\eta}_e$) 등을 측정하고 계산하여 성능 굉가를 수행하였다. CuPc 층에 $F_4$-TCNQ을 도핑함으로써 에너지 흡수 스펙트럼에서 흡수강도가 증가하였으며, $F_4$-TCNQ가 도핑된 CuPc 박막에서 $F_4$-TCNQ 유기 분자의 분산성 향상, 박막의 표면 균일성, 주입 전류(injection currents) 향상 효과등에 의해서 제조된 p-i-n형 유기 박막 태양전지의 성능이 향상되는 것으로 확인되었다. 제조된 유기 태양전지의 에너지 전환 효율(${\eta}_e$)은 0.15%로 실리콘 태양전지와 비교해서 아직도 성능 향상을 위한 많은 노력이 필요함을 보여 준다.

• 한국재료학회지
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• 제19권11호
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• 한국표면공학회지
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• 제52권5호
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• pp.258-264
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• 2019

Assembling heterostructures by combining dissimilar oxide semiconductors is a promising approach to enhance charge separation and transfer in photoelectrochemical (PEC) water splitting. In this work, the CuO nanorods array/$Cu_2O$ thin film bilayered heterostructure was successfully fabricated by a facile method that involved a direct electrodeposition of the $Cu_2O$ thin film onto the vertically oriented CuO nanorods array to serve as the photoelectrode for the PEC water oxidation. The resulting copper-oxide-based heterostructure photoelectrode exhibited an enhanced PEC performance compared to common copper-oxide-based photoelectrodes, indicating good charge separation and transfer efficiency due to the band structure realignment at the interface. The photocurrent density and the optimal photocurrent conversion efficiency obtained on the CuO nanorods/$Cu_2O$ thin film heterostructure were $0.59mA/cm^2$ and 1.10% at 1.06 V vs. RHE, respectively. These results provide a promising route to fabricating earth-abundant copper-oxide-based photoelectrode for visible-light-driven hydrogen generation using a facile, low-cost, and scalable approach of combining electrodeposition and hydrothermal synthesis.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1651-1653
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• 1996

As electrode materials like as Cu-Pb, Cu-Bi, WC-Ag, W-Ag for vacuum circuit breaker have high chopping current or bad insulation-recovery characteristics, it can affect induction machinery like as transformer and motor. To produce low surge electrode material, it have been suggested Co-Ag-Se electrode which were infiltrated with Ag-Se intermetallic compound into sintered Co matrix. In this study, we would like to represent that production method and microstructure of Co-Ag-Se electrode material. The microstructure and characteristics of Ag-Se intermetallic compound and Co-(Ag-Se) electrode were investigated by using SEM, XRD, EPMA.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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• pp.123-128
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• 1996

As electrode materials like as Cu-Pb, Cu-Bi, WC-Ag, W-Ag for vacuum circuit breaker have high chopping current or bad insulation-recovery characteristics, it can affect induction machinery like as transformer and motor. To produce low surge electrode material, it have been suggested Co-Ag-Te electrode which were infiltrated with Ag-Te intermetallic compound into sintered Co matrix in vacuum. In this paper, we would like to represent that production method and microstructure of Co-Ag-Te electrode material in each condition. The microstructure and characteristics of Ag-Te intermetallic compound and Co-(Ag-Te) electrode were investigated by using optical microscope, SEM, XRD, EPMA.

• 대한안전경영과학회지
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• 제4권2호
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• pp.199-207
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• 2002

The polycrystalline CdS of large scale were grown by chemical pyrolysis deposition for $Cu_2$S/CdS heterojunction solar cells. For high quality CdS polycrystalline thin films, the chemical solution was deposited on indium tin oxide(ITO) glasses at the temperature of 50$0^{\circ}C$ for 15 second and annealed at 35$0^{\circ}C$ for 20 minute or 50$0^{\circ}C$ for 30 second. To fabricate high efficiency solar cells, optical and electrical properties, morphology by SEM and x-ray diffraction on polycrystalline CdS thin films were investigated. From the I-V characteristics of $Cu_2$S/CdS heterojunction, the open circuit voltage, $V_{oc}$ was 0.7 V and the short circuit current, $I_{sc}$ was 4.2 mA. We found that the fill factor(FF) was 0.5 and the efficiency was 2.5%.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권5호
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• pp.207-210
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• 2001

In this paper, the Flexible information display was implemented uing AC powder electroluminescent device. ZnS:Cu and $BaTiO_3$ were used as a phosphor and dielectric respectively. The growth of phosphor and dielectric layer was performed with screen printing. The flexible information display in this paper was categorized as following; EL display, driving circuit, software for driving. EL spectrum and brightness was measured as the device properties.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
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• pp.63-66
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• 2002

Bi-layer Mo films were deposited on sodalime glass substrates using DC magnetron sputtering. As the gas pressure and power density, the resistivity varied from $1.5{\times}10^{-5}$ to $4.97{\times}10^{-4}{\Omega}{\cdot}cm$. Furthermore, stress direction yielded compressive-to-tensile transition stress curves. The microstructure of the compressive stress films which had poor adhesion consists of tightly packed columns, but of the tensile-stressed films had less dense structure. Under all gas pressure conditions, Mo films exhibited distinctly increasing optical reflection with decreasing gas pressure. The expansion of (110) peak width with the gas pressure meant the worse crystalline growth. Also, The highest efficiency was 15.2% on 0.2 $cm^2$. The fill factor, open circuit voltage and short circuit current were 63 %, 570 m V and 42.6 $mA/cm^2$ respectively.

• 대한전기학회논문지
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• 제36권5호
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• pp.339-345
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• 1987

In the region of high temperature, a very appreciable short-circuit current Is was observed from M1(A1)-P(PET)-M2(Cu) system sandwitched with hetero metals without applying external field. The short-circuit current Is is greatly dependent on electrode material and it has been certified by measuring open-circuit voltage. From these experimental results, we can see that Is is due to electro-chemical action in M-P interface. In this electro-chemical reaction,the generation reaction and the solution reacftion of the oxidies from electrode are probably co-exist and the measured values of the open-circuit voltage was almost correspond to those calculated from Nernst equation.