• 전기화학회지
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• 제16권1호
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• pp.19-29
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• 2013

피로인산구리용액에서 전기도금공정을 이용하여 상온과 $55^{\circ}C$에서 각각 제조된 Cu박막의 특성에 미치는 전류밀도, 도금용액 온도, pH의 영향에 대한 연구를 수행하였다. 전류효율은 전류밀도가 증가함에 따라 감소하였으나, 도금용액의 온도가 증가함에 따라 증가하는 경향을 나타내었다. 그러나 pH 는 전류효율에 거의 영향을 미치지는 않았으며, 상온과 $55^{\circ}C$에서 모두 90% 이상으로 측정되었다. 상온에서 전기도금 된 Cu 박막의 잔류응력은 전류밀도의 증가에 따라 감소하며, 60 $mA/cm^2$ 이상에서는 거의 0에 근접하였다. $55^{\circ}C$에서 전기도금 된 Cu 박막은 0~40 MPa의 잔류응력을 나타내었다. 상온에서 도금하는 경우 수지상 표면 형상이 30 $mA/cm^2$ 이상의 전류밀도로부터 관찰되었고, $55^{\circ}C$에서는 100 $mA/cm^2$ 이상의 전류밀도부터 관찰되었다. 상온과 $55^{\circ}C$의 도금용액으로부터 전기도금 된 Cu 박막은 거의 (111) 피크들로 구성되어 있다. 특히 $55^{\circ}C$, 30 $mA/cm^2$에서 전기도금 된 Cu 박막의 경우 (111) 피크의 강한 우선방향을 나타내었다.

• 전기화학회지
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• 제20권1호
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• pp.1-6
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• 2017

본 연구에서는 구리 배선 공정에서 구리 씨앗층 표면에 형성되는 구리 자연산화물을 제거하는 표면 전처리가 후속 구리 전착에 미치는 영향을 살펴보았다. 구리 배선 공정의 화학적 기계적 연마 공정에서 사용하는 citric acid 기반의 용액을 구리 표면 전처리 과정에 적용하여 표면에 존재하는 구리 자연 산화물을 제거하였고, 용액 조성 변화를 통해 산화물 제거의 선택성을 높여 구리 씨앗층의 손실을 최소화하였다. 또한 표면 전처리 후 구리 전해 전착과 무전해 전착을 시도하여 전착한 박막의 비저항, 표면 거칠기 등의 성질을 비교하고, 이를 통해 선택적으로 구리 산화물을 제거한 이후에 전착된 박막의 비저항과 표면 거칠기가 가장 낮게 나타남을 확인하였다.

• 한국표면공학회지
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• 제43권6호
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• pp.289-296
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• 2010

The effect of organic additives, thiourea (TU), on the copper electroplated layer of large rectangular size was investigated through physical and various electrochemical techniques. It was found that TU had strong adsorption characteristics on the Ni substrate and affected the initial electroplating process by inducing surface reaction instead of mass transfer in the bulk solution. TU additives had its critical micelle concentration at 200 ppm in copper sulphate solution and showed abrupt change in morphological and electrochemical impedance spectroscopic results around this concentration, which could be related with the destruction of adsorption structure of TU-Cu(I) complex formed at the Ni substrate surface. By conducting a commercial electroplating simulation, when TU additives was included at cmc in the plating solution, it acted as a depolarizer for copper electrodeposition and was effective to reduce the unevenness of copper deposits between centre and edge region at high current densities of 10 ASD.

• 한국표면공학회지
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• 제49권5호
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• pp.416-422
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• 2016

We have investigated the effects of applied potential, deposition time and electrolyte types on shapes and physical properties of Cu dendrites by potentiostatic electrodeposition. Finer shape of dendrites was observed at less cathodic potential by 100mV than at the limiting current, due to 'effective overpotential'. The shape of copper dendrite is related to the deposition time, too. The dendrite depositing for 10 min showed the finest shape. The finer dendrite has the less apparent density and the larger specific surface area. Dendrite from chloride solution has the lowest density and the largest surface area among three plating solutions, sulfate, chloride and pyrophosphate.

• 한국표면공학회지
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• 제53권5호
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• pp.232-240
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• 2020

Cu₂O films as a photocathode for photoelectrochemical water splitting were potentiostatically deposited on FTO glasses. The morphology and composition of the electrodeposited Cu₂O films were adjusted by the applied potentials. The potential-dependent grain size of Cu₂O films was characterized by XRD and SEM analysis. Photoelectrochemical properties of the fabricated Cu₂O photocathodes were investigated with photocurrents as a function of potentials under 1 sun condition of 100mW/㎠. Photocurrents of the electrodeposited Cu₂O films were controlled with the tailored surface morphologies of Cu₂O photocathodes.

• 대한방사성의약품학회지
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• 제5권2호
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• pp.79-82
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• 2019

⁶¹Cu is a promising PET radiometal having favorable nuclear decay characteristics with appropriate half-life of 3.3 h. Owing its promising capabilities in radiopharmaceutical chemistry and its chemical similarities with its isotopes ⁶⁴Cu and ⁶⁷Cu, in this work we have tried to optimize the production and separation conditions of ⁶¹Cu. ⁶¹Cu was produced via (p, x) reaction with natural nickel which was electroplated on the high purity silver coated copper backing target holder. The optimization of target electrodeposition, beam energy and current modulation, target dissolution and separation were optimized in this study. Preliminary studies show that ⁶¹Cu was successfully produced and separated which can be further extended for the production of ⁶⁴Cu and ⁶⁷Cu.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2006년도 춘계학술대회
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• pp.166-169
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• 2006

We fabricated hexagonal copper sulfide $Cu_2S$ nanowires to obtain a larger contact area of $Cu_2S/CdS$ solar cell. Copper sulfide nanowires were grown on Cu foil at room temperature by gas-sol id reaction. The size, density and shape of nanowires seemed to be affected by the change or reaction time temperature, crystallographic orientation of Cu foil, and molar ratio of the mixed gas. We controled the length and the diameter of the nanowires and we obtained suitable nanowire arrays which has fitting size for uniform deposition with n-type CdS. CdS layer was deposited on the nanowire array by electrodeposition and it seemed to be uniform. The $Cu_2S/CdS$ nanowires/CdS junction showed diode characteristics, A large contact area is expected with the $Cu_2S/CdS$ nanowire structure as compared with the $Cu_2S/CdS$ thin film.

• Journal of Electrochemical Science and Technology
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• 제9권4호
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• pp.308-319
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• 2018

Single step electrodeposition of $Cu_2ZnSnS_4$ (CZTS) for solar cell applications was studied using an aqueous thiocyanate based electrolyte. The sodium thiocyanate complexing agent was found to decrease the difference in the deposition potential of the elements. X-ray diffraction analysis of the samples indicates the formation of kesterite phase CZTS. UV-vis studies reveal the band gap of the deposits to be in the range of 1.2 - 1.5 eV. The thickness of the deposit was found to decrease with increase in pH of the electrolyte. Nearly stoichiometric composition was obtained for CZTS films coated at pH 2 and 2.5. I-V characterization of the film with indium tin oxide (ITO) substrate in the presence and the absence of light source indicate that the resistance decrease significantly in the presence of light indicating suitability of the deposits for solar cell applications. Results of electrochemical impedance spectroscopic studies reveal that the cathodic process for sulfur reduction is the slowest among all the elements.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 춘계학술대회 논문집
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• pp.432-434
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• 2009

Metal nano-wire arrays on Cu-coated seed layers were fabricated by aqueous solution method using sulfate bath at room temperature. The seed layers were coated on Anodic aluminum oxide (AAO) bottom substrates by electrochemical deposition technique, length and diameter of metal nano-wires were dominated by controlling the deposition parameters, such as deposition potential and time, electrolyte temperature. Anodic aluminum oxide (AAO) was used as a template to prepare highly ordered Ni, Fe, Co and Cu multilayer magnetic nano-wire arrays. This template was fabricated with two-step anodizing method, using dissimilar solutions for Al anodizing. The pore of anodic aluminum oxide templates were perfectly hexagonal arranged pore domains. The ordered Ni, Fe, Co and Cu systems nano-wire arrays were characterized by Field Emission Scanning Electron Microscopy (FE-SEM) and Vibrating Sample Magnetometer (VSM). The ordered Ni, Fe, Co and Cu systems nano-wires had different preferred orientation. In addition, these nano-wires showed different magnetization properties under the electrodepositing conditions.

• 한국재료학회지
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• 제14권9호
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• pp.619-626
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• 2004

Pulsed metalorganic chemical vapor deposition (MOCVD) of conformal copper seed layers, for the electrodeposition Cu films, has been achieved by an alternating supply of a Cu(I) source and $H_2$ reactant at the deposition temperatures from 50 to $100^{\circ}C$. The Cu thickness increased proportionally to the number of cycles, and the growth rate was in the range from 3.5 to $8.2{\AA}/cycle$, showing the ability to control the nano-scale thickness. As-deposited films show highly smooth surfaces even for films thicker than 100 nm. In addition about a $90\%$ step coverage was obtained inside trenches, with an aspect ratio greater than 30:1. $H_2$, introduced as a reactant gas, can play an active role in achieving highly conformal coating, with increased grain sizes.