Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Effect of Thiourea on the Copper Electrodeposition

구리 전기 도금에 Thiourea가 미치는 효과

  • Lee, Joo-Yul (Materials Processing Division, Korea Institute of Materials Science) ;
  • Yim, Seong-Bong (Materials Processing Division, Korea Institute of Materials Science) ;
  • Hwang, Yang-Jin (Materials Processing Division, Korea Institute of Materials Science) ;
  • Lee, Kyu-Hwan (Materials Processing Division, Korea Institute of Materials Science)
  • 이주열 (한국기계연구원 부설 재료연구소 융합공정연구본부) ;
  • 임성봉 (한국기계연구원 부설 재료연구소 융합공정연구본부) ;
  • 황양진 (한국기계연구원 부설 재료연구소 융합공정연구본부) ;
  • 이규환 (한국기계연구원 부설 재료연구소 융합공정연구본부)
  • Received : 2010.10.20
  • Accepted : 2010.12.30
  • Published : 2010.12.31
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Abstract

The effect of organic additives, thiourea (TU), on the copper electroplated layer of large rectangular size was investigated through physical and various electrochemical techniques. It was found that TU had strong adsorption characteristics on the Ni substrate and affected the initial electroplating process by inducing surface reaction instead of mass transfer in the bulk solution. TU additives had its critical micelle concentration at 200 ppm in copper sulphate solution and showed abrupt change in morphological and electrochemical impedance spectroscopic results around this concentration, which could be related with the destruction of adsorption structure of TU-Cu(I) complex formed at the Ni substrate surface. By conducting a commercial electroplating simulation, when TU additives was included at cmc in the plating solution, it acted as a depolarizer for copper electrodeposition and was effective to reduce the unevenness of copper deposits between centre and edge region at high current densities of 10 ASD.

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