Effects of Current Density and Solution Temperature on Electrodeposited Cu Thin Film in Cu Pyrophosphate Bath (Cu pyrophosphate bath에서 전기도금된 Cu 박막에 미치는 전류밀도 및 도금온도의 영향)
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- Proceedings of the Korean Institute of Surface Engineering Conference
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- 2012.11a
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- pp.136-136
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- 2012