• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.64-64
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• 2009

As the advanced packaging technology developing, Copper electro-plating processing has be wildly utilized in the semiconductor interconnect technique. Chemical solution monitoring methods, including PH and gravity measurement exist in industry, but economical and practical real-time monitoring has not been achieved yet. Red-green-blue (RGB) color sensor can successfully monitor the condition of $CuSO_4$ solution during electric copper plating process. Comparing the intensity variations of the RGB data and optical spectroscopy data, strong correlation between two in-situ sensors have shown.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.3-3
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• 2001

Two companies plating baths were selected for plating on phenol and epoxy resin boards as well as on flexible p polyimide boards. After plating, deposited i&IIk&.ness al1d physical properties, as well as solder wettabilities by aging with $150^{\circ}C$ heating and 100% humidity were compared. After plating and aged with two different tin baths, deposited thickness and physical properties were not so great differences, but solder wettabilities were superior used polymer catalyst than the other. Furthermore depend upon the compactness and fineness of metallic sturctures of the base copper, the amounts of the plated copper were big differel1lces. These differences seems to be inherited from the kind and amount of additives. as well as current densities, which are influences upon structures of Copper layers. Generally the tin thickness are hetween 0.5 to $1.0\mu\textrm{m}$ and thicker the solder wettabilities are the better, and also me compact structures of deposits showed gooo soidierabiiities. In this study, with our own deveiotaedl plating equipment could get more than $0.5\mu\textrm{m}$ of till thickness and piating speed was $0.1\mu\textrm{m}$ per minutes.

• Journal of the Optical Society of Korea
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• v.19 no.3
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• pp.217-221
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• 2015

Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.7
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• pp.112-119
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• 2009

The purpose of this study is to evaluate the evaluation of process yield performed by using Sn & Cu treatment on the surface to optimize process condition for Lead-free solder application. The materials which are used for the New Surface Treatment study are Semi-Dulling plating for high speed Sn/Cu alloy of Soft Alloy GTC-33 Pb free known as "UEMURA Method" and plating substrate is alloy 42.Especially in lead-free plating process, it is important to control plating thickness and Copper composition than Sn/Pb plating. Evaluated and controlled plating thickness $12{\pm}3um$, Copper composition $2{\pm}1%$, plating particle and visual inspection. The optimization of these parameters and condition makes it makes possible to apply Sn/Cu Lead-free solder from Sn/Pb alloy.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.9
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• pp.4015-4021
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• 2011

The purpose of this study is to investigate the effect of compositional ratio of additives, such as potassium ferrocyanide, aminoacetic acid (=glycine) and 2,2'-dipyridyl, on the physical properties of copper layer deposited by environment-friendly electroless plating reaction. The highest plating rate of copper layer, $9.5mg{\cdot}cm^{-2}{\cdot}hr^{-1}$, was obtained at 20 mg/L of potassium ferrocyanide and 0.01 mol/L of aminoacetic acid, which coincided with the change in the hardness of the copper layer. In the additives used in this study, potassium ferrocyanide was considered to improve the plating rate, aminoacetic acid increased the hardness value of deposited films and 2,2'-dipyridyl enhanced the brightness of copper deposited films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.125-126
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• 2005

Recently semiconductor devices are required more smaller scale and more powerful performance. For smaller scale of device, multilayer structure is proposed. And, for the higher performance, interconnection material is change to copper, because copper has high EM(Electro-migration)and low resistivity. Then copper CMP process is a great role in a multilayer formation of semiconductor. Copper process is different from aluminum process. ECP process is one of the copper processes. In this paper, we focused on the defects tendency by copper thickness which filled using ECP process. we observed hump high and dishing. Conclusively, hump hight reduced at copper thickness increased Also dishing reduced.

• Journal of the Korean institute of surface engineering
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• v.25 no.4
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• pp.173-180
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• 1992

The effects of the stabilizing additives such as NaCN, 2-MBT and Thiourea on bath decom-position, plating rate and surface morphology have been studied. Bath stability was increased in the order of an additive-free bath, and NaCN-, 2-MBT-, and Thiourea-stabilized baths. The sta-bilizing effects may be attributed to the stability of Cu(II) -complexes. The plating rate is the re-verse order of the bath stability. Accelerative effect of 2-MBT in proper quantity(0.3mg/$\ell$) may be explained by visualizing it absorbed through benzene ring or sulfur atom on portions of the sub-strates. The strong bond of the complexing part of the molecule to nearby chelated copper ions would tend to accelerate plating by making it easier for the Cu2+ -ligand bond to be broken. Sur-face morphologies of copper deposits depend on the bath additives. Electroless copper deposits from the 2-MBT stabilized baths are finer than the deposits from the NaCN- and Thiourea- stabi-lized baths due to the strong adsorption on the substrates.

• Journal of the Korean institute of surface engineering
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• v.1 no.1
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• pp.5-13
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• 1967

Up to this date, numerous methods of analysis of electropling solutions are published. Some, however, need lots of works before reaching final results, or require high technique and special instruments, and also some are unaccurate due to unclearnes of end point. Like our undevelop countries, technicians of electroplating shops are most high school graduates or under, and have not much knowledge on chemistry. Furthermore, those technicians have to control their plating solutions by themselves without having enough analytical laboratory equipment . Therefore, in this paper the simplest, besides accurate method is investigated after comparing numerous methods published. Among the methods of copper determinations from acid and alkaline copper plating baths, EDTA titration method are chosen, due to these methods are the simpest and fastest for the evaluation of metal content, without requirng any special instrument. For acid copper solutions, chelate titrations were accurate enough. Since the end point of titration of chelate method is variable according to the kind of indicators and other metal's coexisitence as well as solution component, many difficulties were encountered from cyanide copper, on the contrary of acid copper bath. PAN , PV, and MX indicators were tried , but it is found that MX is the best. In chyanide solution ,due to cyanide is the masking reagent , elimination of this component is essential , and finally found that elimination CN-by precipitation with AgNO$_3$ solution was the simplest and the most accurate way among others. This method was very accurate for the new plating solutions even coexistence with organic brightners. However used solutions for long months running have to be predetermined the accurate copper value by thiosulfate method form time to time, before chelate titration by means of AgNO$_3$ precipitation. Always some constant deviations will be seen according to the solutions nature. Therefore those deviation values have to be compensated each time.

• Korean Chemical Engineering Research
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• v.40 no.6
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• pp.664-668
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• 2002

In this work, the catalytic reduction mechanisms of NO over ACFs/copper prepared by electrolytic copper plating has been studied. It was found that copper content on carbon surfaces increased with increasing the plating time. However, a slightly gradual decrease of adsorption properties, such as, BET specific surface area, was observed in increasing the plating times within the range of well-developed micropore structures. As experimental results, nitric oxide was converted into the nitrogen and oxygen on ACFs and ACFs/copper catalyst surfaces at $500^{\circ}C$. Especially, the surfaces of ACFs/copper catalyst were found to scavenge the oxygen released by catalytic reduction of NO, which could be explained by the presence of another nitric oxide reduction mechanism between ACFs and ACFs/copper catalysts.

• Korean Chemical Engineering Research
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• v.46 no.5
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• pp.863-867
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• 2008

Pitch based activated carbon fiber(ACF) was prepared from reformed naphtha cracking bottom oil(NCB oil) by melt spinning. The fibers obtained were stabilized, carbonized, and then steam activated. The ACF was sensitized with Pd-Sn catalytic nuclei via a single-step activation approach. This sensitized ACF was used as precursors for obtaining copper plated ACFs via electroless plating. ACFs uniformly decorated with metal particles were obtained with reduced copper plating in the reaction solution. Effects of the amount of copper on characteristics of ACF/Cu catalysts were investigated through BET surface area, X-ray diffraction, scanning emission microscopy, and ICP. The amount of copper increased with plating time, but the surface area as well as the pore volume decreased. NO conversion increased with reaction temperature. NO conversion decreased with increasing the amount of copper, which is seemed to be due to the reduction of surface area as well as the dispersion of copper.