• Korean Journal of Materials Research
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• v.23 no.7
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• pp.392-398
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• 2013

A two-pass differential speed rolling(DSR) was applied to a deoxidized low-phosphorous copper alloy sheet in order to form a homogeneous microstructure. Copper alloy with a thickness of 3 mm was rolled to 75 % reduction by two-pass rolling at $150^{\circ}C$ without lubrication at a differential speed ratio of 2.0:1. In order to introduce uniform shear strain into the copper alloy sheet, the second rolling was performed after turning the sample by $180^{\circ}$ on the transverse direction axis. Conventional rolling(CR), in which the rotating speeds of the upper roll and lower roll are identical to each other, was also performed by two-pass rolling under a total rolling reduction of 75 %, for comparison. The shear strain introduced by the conventional rolling showed positive values at positions of the upper roll side and negative values at positions of the lower roll side. However, samples processed by the DSR showed zero or positive values at all positions. {100}//ND texture was primarily developed near the surface and center of thickness for the CR, while {110}//ND texture was primarily developed for the DSR. The difference in misorientation distribution of grain boundary between the upper roll side surface and center regions was very small in the CR, while it was large in the DSR. The grain size was smallest in the upper roll side region for both the CR and the DSR. The hardness showed homogeneous distribution in the thickness direction in both CR and DSR. The average hardness was larger in CR than in DSR.

• Journal of the Korean Ceramic Society
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• v.13 no.2
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• pp.8-16
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• 1976

The conductive transparent film is prepared by spraying thin salt solution. In stannic chloride solution as a base solution, various dopants such as Al, Co, Cu and Ni were dissolved respectively as a chloride state and then the films were made by spraying solutions on hot glass plates. The properties of them were compared with those of the stannic salt single component film. The films doped with copper oxide and nickle oxide were improved by decreasing their sheet resistivity and temperature coefficient of resistivity. In comparison with the sheet resistivity and temperature coefficient of resistivity of stannic oxide single component film, being 2.5 K ohm/$\textrm{cm}^2$ and -1650ppm/$^{\circ}C$ respectively, its values of the film containing 15 mol % of copper oxide and formed at 40$0^{\circ}C$ were 2.5K ohm/$\textrm{cm}^2$ and -920ppm/$^{\circ}C$ respectively. The film containing 15 mol % of nickel oxide and formed at 50$0^{\circ}C$ has shown its sheet resistivity and temperature coefficient 0.7 K ohm/$\textrm{cm}^2$ and -940ppm/$^{\circ}C$ respectively.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.344-345
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• 2015

Various concentration of copper was dopped in Fe-35%Ni thin sheet by electroforming and their electromagnetic, surface properties were determined. Microstructure observation by scanning electron microscopy revealed that the thin sheet had columnar grains with about 150 nm long. Phase analysis by X-ray diffractometry revealed that the alloy thin sheets were fine crystalline. The average surface roughnesses measured by atomic force microscopy (AFM) were about 14.38 nm. Nano hardnesses determined by tribo-nano indenter were 4.13 GPa. The surface resistances were 2.28 ohm/sq. The maximum magnetization, residual magnetization and coercive force depended on the copper concentration.

• Journal of the Korean institute of surface engineering
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• v.51 no.4
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• pp.191-196
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• 2018

The self-annealing which leads evolution of microstructure in copper electroplating layers at room temperature occurs after forming deposition layer. During the process, crystal orientation, size and sheet resistance of plating layer change. Lastly, it causes the change of physical and mechanical characteristics such as a tensile strength of plating layer. In this study, the variation of incorporated impurities, microstructure and sheet resistance of copper plating layer formed by electroplating are measured with and without inorganic additives during the self-annealing. In case of absence of inorganic additives, the copper layer presents strong total intensity of incorporated impurities. During the self-annealing, such width of reduction was significant. Moreover, microstructure and crystal size are increased while the tensile strength is decreased noticeably. On the other hand, in the presence of inorganic additives, there is no observable distinction in the copper plating layer. According to the observation on movements of the incorporated impurities in electrodeposition copper layer, within 12 hours the impurities are continuously shifted from inside of the plating layer to its surface after as-deposited electroplating. Within 24 hours, except for the small portion of surface layer, it is considered that most of the microstructure is transformed.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.61-66
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• 2018

This research scrutinizes the self-annealing characteristics of copper used to metal interconnection for application of DRAM fabrication process. As the time goes after the copper deposited, the grain of copper is growing. It is called self-annealing. We use the electroplating method for copper deposition and estimate two kinds of electroplating chemicals having different organic additives. As the time of self-annealing is elapsed, sheet resistance decreases with logarithmic dependence of time and is finally saturated. The improvement of sheet resistance is approximately 20%. The saturation time of experimental sample is shorter than that of reference sample. We can find that self-annealing is highly efficient in grain growth of copper through the measurement of TEM analysis. The structure of copper grain is similar to the bamboo type useful for current flow. The results of thermal excursion characteristics show that the reliability of self-annealed sample is better than that of sample annealed at higher temperature. The self-annealed sample is not contained in hillock. The self-annealed samples grow until $2{\mu}m$ and develop in [100] direction more favorable for reliability.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.179-179
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• 2013

Surface resistance of electro-deposited copper with its thickness, current density and surface roughness was determined by using a 4-point probe analyzer. The copper was prepared electrochemically on 316 stainless steel substrate in copper sulfate solution at the condition of $1A/dm^2$, 298 K, and 6.5 cm-electrode distance. The surface resistance of the copper sheet in the range of $0.93-0.97{\Omega}$ increased with the copper thickness in the range of $21-70{\mu}m$. The surface resistance in the range of $0.963-1.009{\Omega}$ also increased with current density in the range of $0.5-2A/dm^2$. The increased surface resistances corresponded to 11% for thickness and 25% for current density, respectively.

• Journal of Power Electronics
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• v.4 no.1
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• pp.12-17
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• 2004

In this paper, a practical implementation to reduce leakage flux of a high-frequency inverter based non-contact type power transformer composed of EE-shape ferrite cores is presented for key technology of the next generation medical use X-ray CT scanner system. Design consideration for the unique structure of the non-contact power transformer with 900mm in diameter is also introduced. The complete non-contact transformer is actually arranged by several blocks of the magnetic circuit assembled by using 10 small EE shape cores with 120mm in length. It is experimentally and analytically discussed from a reduced leakage flux viewpoint related to its inductively coupling coefficient. A practical method to lower the leakage flux is described based on effective Copper-Sheet- Treatment placed on EE shape ferrite cores of magnetic circuit.

• Transactions of Materials Processing
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• v.26 no.3
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• pp.168-173
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• 2017

A new sheet metal forming process, called flexibly reconfigurable roll forming (FRRF), is expected to resolve the economical limitation of the existing 3D curved sheet metal forming processes. The height-controllable guides and a couple of flexible rollers are utilized as the forming tool. Recently, as the 3D curved sheet metal is increasingly demanded in various fields, the application of FRRF to diverse materials is necessary. In addition, the formability comparison of several materials is needed. Therefore, in this study, we investigated the applicability of FRRF for different materials such as aluminum, magnesium, and copper alloys, and also the formability of these materials was compared using FRRF. The numerical simulation was conducted using ABAQUS, the commercial software, and the experiments were carried out using an FRRF apparatus to validate the simulation results. Finally, the applicability of FRRF for the chosen materials and the formability of these materials on FRRF process were confirmed by comparing the simulation and experimental results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.08a
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• pp.47-51
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• 2002

ECT(eddy currentign testing) is very effective technique to detect a flaw within a conductor. Co-based amorphous wire was used as a sensor head. The wire has almost 0 magneto-striction and high permeability. An uniform magnetic field was applied to 1mm thick copper plate and $25{\mu}m$ thick aluminum sheet conductor using spiral typed coil The size of the coil has $40mm{\times}40mm$ outer width and $8mm{\times}8mm$ inner width. The copper plate and aluminum sheet has 0.5mm and 0.1mm wide gap, respectively. The frequency range of applied field was 100kHz-600kHz. The induced voltage difference of 2.5mV was obtained in the maximum voltage and minimum one measured across the gap of the 1mm thick conductor. In the case of aluminum sheet, 0.4mV was obtained. From this results, the effectiveness of Co-based amorphous wire was confirmed in the ECT technique.

• Korean Journal of Materials Research
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• v.21 no.1
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• pp.15-20
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• 2011

The effects of conventional rolling (CR) and differential speed rolling (DSR) on the microstructure and mechanical properties of a copper alloy sheet were investigated in detail. A copper alloy with thickness of 3 mm was rolled to a 50% reduction at ambient temperature without lubrication with a differential speed ratio of 2:1; sample was then annealed for 0.5h at various temperatures from 100 to $800^{\circ}C$. Conventional rolling, in which the rolling speed of the upper and lower rolls is identical, was performed under the same rolling conditions. The shear strain introduced by the CR showed positive values at positions on the upper roll side and negative values at positions on the lower roll side. However, the shear strain showed a zero or positive value at all positions for the samples rolled by the DSR. The microstrucure and mechanical properties of the as-rolled copper alloy did not show very significant differences between the CR and DSR for the microstructure and mechanical properties. However, those properties showed very significant differences in the case of the annealed samples. The effects of rolling method on the microstructure and mechanical properties of the as-rolled and subsequently annealed materials are discussed in terms of the shear strain.