Proceedings of the Korean Institute of Surface Engineering Conference (한국표면공학회:학술대회논문집)

The Korean Institute of Surface Engineering (한국표면공학회)
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Effect of Cu Dopping in Fe-35%Ni Sheet on Electromagnetic Properties

구리농도에 따른 Fe-Ni박막의 전자기적 특성에 대한 효과

  • Han, S.S. (Department of Materials Science and Engineering, Dankook University) ;
  • Koo, DY (Department of Materials Science and Engineering, Dankook University) ;
  • Choi, Y. (Department of Materials Science and Engineering, Dankook University)
  • Published : 2015.11.26
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Abstract

Various concentration of copper was dopped in Fe-35%Ni thin sheet by electroforming and their electromagnetic, surface properties were determined. Microstructure observation by scanning electron microscopy revealed that the thin sheet had columnar grains with about 150 nm long. Phase analysis by X-ray diffractometry revealed that the alloy thin sheets were fine crystalline. The average surface roughnesses measured by atomic force microscopy (AFM) were about 14.38 nm. Nano hardnesses determined by tribo-nano indenter were 4.13 GPa. The surface resistances were 2.28 ohm/sq. The maximum magnetization, residual magnetization and coercive force depended on the copper concentration.

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