• Journal of the Korean institute of surface engineering
• /
• v.45 no.1
• /
• pp.8-14
• /
• 2012

The effects of the alkali surface modification process on the adhesion strength between electroless-plated Cu and polyimide films were investigated. The polyimide surfaces were effectively modified by alkali surface treatments from the hydrophobic to the hydrophilic states, and it was confirmed by the results of the contact angle measurement. The surface roughness increased by alkali surface treatments and the adhesion strength was proportional to the surface roughness. The adhesion strength of Cu/polyimide interface treated by KOH + EDA (Ethylenediamine) was 874 gf/cm which is better than that treated by KOH and KOH + $KMnO_4$. The results of XPS spectra revealed that the alkali treatment formed oxygen functional groups such as carboxyl and amide groups on the polyimide films which is closely related to the interfacial bonding mechanism between electroless-plated Cu and polyimide films. It could be suggested that the species and contents of functional group on polyimide films, surface roughness and contact angle were related with the adhesion strength of Cu/polyimide in combination.

• Korean Journal of Materials Research
• /
• v.30 no.7
• /
• pp.327-332
• /
• 2020

Laser induced surface activation (LISA) technology requires refined selection of process variables to fabricate conductive microcircuits on a general polymer material. Among the process variables, laser mode is one of the crucial factors to make a reliable conductor pattern. Here we compare the continuous wave (CW) laser mode with the pulse wave (PW) laser mode through determination of the surface roughness and circuit accuracy. In the CW laser mode, the surface roughness is pronounced during the implementation of the conductive circuit, which results in uneven plating. In the PW laser mode, the surface is relatively smooth and uniform, and the formed conductive circuit layer has few defects with excellent adhesion to the polymer material. As a result of a change of laser mode from CW to PW, the value of Ra of the polymer material decreases from 0.6 ㎛ to 0.2 ㎛; the value of Ra after the plating process decreases from 0.8 ㎛ to 0.4 ㎛, and a tight bonding force between the polymer source material and the conductive copper plating layer is achieved. In conclusion, this study shows that the PW laser process yields an excellent conductive circuit on a polymeric material.

• Journal of the Korean institute of surface engineering
• /
• v.18 no.3
• /
• pp.105-115
• /
• 1985

Lead-tin-copper ternary alloy electrodeposition is conducted onto the inner bore surface of plain bearings as an overlay in order to investigate the effect of slot width, current density and fluoboric acid concentration on the uniformity of overlay. The thickness of overlay is analyzed by means of current distribution resulting from the overvoltage of plating bath and the apparent distance between cathode and anode. The result demonstrate that the uniformity of overlay is remarkably dependent of the slot size and current density, but has little bearing on the fluoboric acid concentration over 100g/L. This present study indicates that uniform overlay is obtainable within the tolerable thickness of ${\pm}2{\mu}m$ by using the slot width of 22mm. The surface morphology examination also shows the important role of concentration polarization of the micro-uniformity of overlay. The micro-uniformity has improved at the low concentration polarization which resulted from operating at the low current density and high fluoboric acid concentration. The surface morphology of deposits exhibits the vivid pyramid crystalline in the plating condition of low concentration polarizatio and all deposits have columnar structure parallel to the applied electric field regardless of the electroplating condition used.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2011.10a
• /
• pp.903-906
• /
• 2011

The electroplating and electro-less plating methods have been applied for the high density chip interconnect of the Copper Pillar Tin Bump (CPTB) preparation. The CPTB was prepared, which had been electroplated about $100{\mu}m$ pitch of copper layer firstly, and then the Tin layer was deposited on the copper pillar surface to protect the oxidation of it. It was also very important to get uniform thickness of electroplated copper layer, though it was difficult and sensitive. In order to control the thickness distribution, it was examined that the current separating disk of Insulating Gate with a hole in the center was installed between electrodes. The current flows through the center hole of the Insulating Gate in the cylindrical electroplating bath and the other parts were blocked to protect current flowing. The main current flowed through the center hole of the Insulating Gate directly to the opposite electrode of wafer disk. As the results, it was verified that the copper layer was thick in the center part of wafer disk with distribution of thinner to the outer part toward edge.

• Resources Recycling
• /
• v.28 no.1
• /
• pp.3-14
• /
• 2019

Copper is used in many electronic components and construction parts due to its excellent electrical conductivity and heat transfer characteristics, and also used for pre-plating for double layer coating such as nickel, so that copper is an essential material in modern industry. Despite the expected increase of usage and importance on wiring, sensors and data equipment in the next generation industries, it is hard for securing stable copper supply and resource management resulting from the copper prices are fluctuating owing to the economic crisis in Europe, the low economic growth trend in China, and President Trump's commitment to public industrial facilities investment in U.S.. Since most of the domestic copper consumption is used by electrolytic copper cathode, we studied not only copper recycling technology which is being commercialized but also current research trend under the research stage. This study aims to examine the characteristics of each process and the areas where future recycling technology development is required.

• Journal of Electrochemical Science and Technology
• /
• v.11 no.2
• /
• pp.180-186
• /
• 2020

In this work, a metal-ligand solution (Cu-EDTA) was prepared based on the molecular precursor method and the solution was spin-coated onto 3D printed flexible photosensitive resin sheets. After being processed by microwave, a laser with a wavelength of 355 nm was utilized to scan the spin-coated sheets and then the sheets were immersed in an electroless copper plating solution to deposit copper wires. With the help of microwave processing, the adhesion between copper wires and substrate was improved which should result from the increase of roughness, decrease of contact angle and the consistent orientation of coated film according to the results of 3D profilometer and SEM. XPS results showed that copper seeds formed after laser scanning. Using the 3D printed flexible sheets as cathode and galvanized iron as anode, electrochemical machining was conducted.

• Journal of the Korean Magnetics Society
• /
• v.15 no.3
• /
• pp.198-201
• /
• 2005

We investigated the effects of organic additives on the properties of nickel-copper thin films prepared by electroplating. Compared with thin films fabricated by pure electrolyte only, the films utilizing organic additives show different crystalline orientations. With no alteration of plating conditions simply adding the organic materials changed the composition of copper and nickel. The concentration of nickel could be varied to $65-95\%$ depending on the species and concentration of the additives. The change of material property has contributed to the increase or decrease of the magnetoresistance.

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.3
• /
• pp.37-42
• /
• 2007

Copper deposition studies have been actively studied since interests on 3D SiP were increased. The defects inside via can be easily formed due to the current density differences on entrance, bottom and wall of via. So far many different additives and current types were discussed and optimized to obtain void-free copper via filling. In this research acid cupric sulfate plating bath containing additives such as PEG, SPS, JGB, PEI and wave current applied electroplating were examined. The size and shape of grain were influenced by the types of organic additives. The cross section of specimen were analyzed by FESEM. When PEI was added, the denser copper deposits were obtained. Electroplaing time was reduced when 2 step via filling was employed.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.208-208
• /
• 2012

최근 환경문제가 많이 제기되면서 친환경적 운송수단인 자전거 개발과 관련하여 다양한 기술개발이 이루어지고 있다. 그 중 고부가가치의 서스펜션 포크의 프레임에 고기능성 표면처리로 Arc ion plating deposition system (AIPDS)을 이용하여 부식, 내마모 특성이 뛰어난 TiN 박막을 증착시켰다. AIPDS는 기존의 arc system과 달리 다원계 소재 코팅 공정조건 확립을 위하여 chamber wall에 2개의 rectangular type sputter source를 장착하고 소재의 pre-treatment 용 linear type ion source를 설치하였다. 장비의 Chamber 중앙에는 pipe형 arc cathode를 설치하였으며, 그 주위를 anode 역할을 하는 copper 코일로 감아 이는 발생한 arc를 target인 cathode 축을 중심으로 방향성을 가지고 회전하여 진행 할 수 있도록 유도 하였다. 이 시스템에서 증착된 TiN 박막은 bias 전압 변화에 따른 박막의 구조 및 물성을 평가하였다. XRD 장비를 통하여 TiN 박막의 상분석을 진행하였고, 마모테스터, 원자현미경, 마이크로 비커스 경도기 등을 이용하여 기계적 특성을 평가하였다.

• 한국생물공학회:학술대회논문집
• /
• 2000.04a
• /
• pp.357-360
• /
• 2000

Biosorption process is an economic and potential process for metal sequestering from the water. The oxidized Undaria pinnatifida by nitric acid had high uptake capacity for heavy metals of 4 - 6 meq / g dry mass. For the application of oxidized Undaria pinnatifida, recovery of metal in plating wastewater was studied. The uptake capacity of the oxidized Undaria pinnatifida was high compared to the ion exchanger IR-120 plus. The treatment efficiency of chromium and copper in the wastewater was 85% In batch. Activated carbon was used to assist the recovery of water by removing organic matters of the wastewater.