Journal of the Korean institute of surface engineering (한국표면공학회지)
- Volume 18 Issue 3
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- Pages.105-115
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- 1985
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
A study on the uniformity of the electrodeposits in Pb-Sn-Cu ternary alloy plating
Pb-Sn-Cu삼원 합금 전착층의 균일성 연구
- NamGoong, E. (Korea Institute of Machinery & Metals) ;
- Gwon, Sik-Cheol (Korea Institute of Machinery & Metals)
- Published : 1985.09.01
Abstract
Lead-tin-copper ternary alloy electrodeposition is conducted onto the inner bore surface of plain bearings as an overlay in order to investigate the effect of slot width, current density and fluoboric acid concentration on the uniformity of overlay. The thickness of overlay is analyzed by means of current distribution resulting from the overvoltage of plating bath and the apparent distance between cathode and anode. The result demonstrate that the uniformity of overlay is remarkably dependent of the slot size and current density, but has little bearing on the fluoboric acid concentration over 100g/L. This present study indicates that uniform overlay is obtainable within the tolerable thickness of
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