• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.47 no.1
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• pp.66-74
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• 2019

Instead of securing thermophysical properties throughout the entire lunar surface, a theoretical method to predict the lunar surface temperature accurately using improved Lumped System Model (LSM) was developed. Based on the recently published research, thermal mass per unit area at the top regolith layer is assumed uniform. The function of bottom conductive heat flux was introduced under the theoretical background. The LSM temperature prediction agrees well with the DLRE measurement except for dusk, dawn and high latitude region where the solar irradiation is weak. The relative large temperature discrepancy in such region is caused by the limit of the bottom conductive heat flux model. The surface temperature map of the moon generated by the LSM method is similar to the DLRE measurement except for the anomalous temperature zones where surface topography and thermophysical properties appear in highly uneven.

• Journal of the Korean Society of Clothing and Textiles
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• v.23 no.4
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• pp.584-592
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• 1999

Highly conductive polyaniline(PAn)-nylon 6 composite fabric was prepared by immersing the nylon 6 fabric in 0.5M aniline+0.35M HCl aqueous solution at 4$0^{\circ}C$ for 2hours, Polymerization was then followed by mixing the prepared oxidant and dopant solution(0.5M(NH4)2S2O+0.35M HCl) to the diffusion bath at 5$^{\circ}C$ for 30 minutes. The conductivity of prepared PAn-nylon 6 composite fabrics reached as high as 0.5$\times$10-1S/cm. Their conductivity were significantly affected by the aniline and oxidant concentration. As compared to those of nylon 6 fabric heat of fusion melting point the degree of crystallinity and tensile strength of PAn-nylon 6 did not significantly changed by inclusion of PAn. In the aspect of serviceability wheras the fabric conductivity was significantly decreased after multiple washion no significant changes in the fabric conductivity were observed after abrading the composite fabric over 50 cycles. However we found that the fabric conductivity could be recovered by acid re-doping with HCl.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.417-417
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• 2009

Although a transparent conductive film (TCF) belongs to essential supporting materials for many device applications such as touch screens, flat panel displays, and sensors, a conventional transparent conductive material, indium-tin oxide (ITO), suffers from considerable drawback because the price of indium has soared since 2001. Despite a recent falloff, a demand of ITO is expected to increase sharply in the future due to the trend of flat panel display technologies toward flexible, paper-like features. There have been recently extensive studies to replace ITO with new materials, in particular, carbon nanotubes (CNTs) since CNTs possess excellent properties such as flexibility, electrical conductivity, optical transparency, mechanical strength, etc., which are prerequisite to TCFs. This study fabricated TCFs with single-walled carbon nanotubes (SWCNTs) produced by arc discharge. The SWCNTs were dispersed in water with a surfactant of sodium dodecyl benzene sulfonate (NaDDBS) under sonication. Carbon black and fullerene nanoparticles were added to the SWCNT-dispersed solution to enhance contact resistance between CNTs. TCFs were manufactured by a filtration and transfer method. TCFs added with carbon black and fullerene nanoparticles were characterized by scanning electron microscopy (SEM), UV-vis spectroscopy (optical transmittance), and four-point probe measurement (sheet resistance).

• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.2
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• pp.71-82
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• 2011

Electronic display markets has been developed. The cathode ray tube of brown form recently celebrated their 100th by first display. Also LCD of flat form recently celebrated their 25th by second display and it has advantage of small volume, lower consumption power. But FPD has problem that is property of brittle and noncarrying by glass substrate. Therefore the arrival of portable electronics devices has put an increasing premium on durable, lightweight and inexpensive display components. It is flexible display by third display. Also electronics field such as printed wiring board, RFID, membrane switch prefer flexible display. The conductive pattern can be used mostly in field of electronic displays and electronics. This manufacture of conductive pattern in present used is screen printing. The the conductive pattern. It has advantages of flexibility, high conductivity, drying in low temperature, good conductivity. screen printing has problem that is low productivity and use not flexible substrate because of high fire temperature. This study was developed novel method to form the conductive pattern. It has advantages of flexibility, high conductivity, drying in low temperature, good conductivity.

• Journal of Fashion Business
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• v.18 no.4
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• pp.1-14
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• 2014

Currently smart textile market is rapidly expanding and the demand is increasing integration of an electronic fiber circuit. The garments are an attractive platform for wearable device. This is one of the integration techniques, which consists of is the selective introduction of conductive yarns into the fabric through knitting, weaving or embroidering. The aim of this work is to develop a golf bend driven prototype design for an attachable Arduino that can be used to assess elbow motion. The process begins with the development of a wearable device technique that uses conductive yarn and flex sensor for measurement of elbow bending movements. Also this paper describes and discusses resistance value of zigzag embroidery of the conductive yarns on the tensile properties of the fabrics. Furthermore, by forming a circuit using an Arduino and flex sensor the prototype was created with an assistance band for golf posture training. This study provides valuable information to those interested in the future directions of the smart fashion industry.

• Journal of the Korean Society for Nondestructive Testing
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• v.31 no.6
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• pp.609-615
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• 2011

Excitation and propagation of electromagnetic field of a cylindrical coil above an arbitrary number of conductive plates for pulsed eddy current testing(PECT) are very complex problems due to their complicated physical properties. In this paper, analytical modeling of PECT is established by Fourier series based on truncated region eigenfunction expansion(TREE) method for a single air-cored coil above stratified conductive structures(SCS) to investigate their integrity. From the presented expression of PECT, the coil impedance due to SCS is calculated based on analytical approach using the generalized reflection coefficient in series form. Then the multilayered structures manufactured by non-ferromagnetic (STS301L) and ferromagnetic materials (SS400) are investigated by the developed PECT model. Good prediction of analytical model of PECT not only contributes to the development of an efficient solver but also can be applied to optimize the conditions of experimental setup in PECT.

• Journal of the Korean Society of Safety
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• v.19 no.3 s.67
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• pp.51-56
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• 2004

Conductive polymer blends and composites are widely used for different safety application such as electrostatic charge dissipation(ESD), electromagnetic interference(EMI) shielding, electrostatic prevention and safety chemical sensor. In order to prepare a impedance-type humidity sensor that is durable at high humidities and high temperature, electically conductive polymer blends based on diallyldimethylammonium chloride(DADMAC) and epoxy were prepared in this study. The polymer blends type conductive ionomer exhibits reaction each other DADMAC and epoxy in FT-IR and DSC analysis. The blends material was traced by new peak at 1600cm-1 and appeard improvement of thermal resistance by melting point shift. Alumina substrate was deposited a pair of gold electrodes by screen printing. The blend material were spin-coated with a thin film type on the surface of alumina substrate. The polymer bleld type sensor exhibits a linear impedance increasing better than DADMAC coated humidity sensor. Also it shows good sensitivity, low hysteresis and durability against high humidity.

• Journal of the Korean Society of Clothing and Textiles
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• v.42 no.3
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• pp.474-485
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• 2018

Smart sensors and connected devices have changed the concept of garments along with IT technology convergent garments that transform the performance of basic functions. Various types of products have been researched and developed due to the increased interest in smart clothing; in addition, studies based on physical and mechanical properties have also been actively studied to improve accuracy and reliability. This study represents a basic study for the development of smart textiles based on motion recognition for the surfing practice of beginners interested in IT convergence type. A physical durability evaluation of conductive yarn according to sewing method was later carried out. This study is a conditional specimen sewn with cotton lower thread and 100mm pattern length based on the results of previous studies. The durability of the conductive yarn according to the sewing method was evaluated according to the sewing method. Durability was evaluated by two kinds of repeated strain and abrasion tests. The specimen with applied cotton in a lower thread zigzag pattern 2mm stitch size 100mm stitch length was shown to have the most suitable durability for smart textile.

• Korean Journal of Metals and Materials
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• v.47 no.7
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• pp.447-453
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• 2009

Isotropic conductive adhesives (ICAs) have been used or considered as an interconnect material for radio frequency identification (RFID) inlays or other flip chip assemblies due to the advantages of having a low temperature and high-speed bonding. In this work, the curing properties of commercial ICAs for the RFID tag application and the signal transmission in conductive lines that contained the ICA joints were evaluated as a function of the degree of cure at 900 MHz frequency range. The ICAs showed adequate signal transmission only after the curing process passed over the critical time. It was also found that the insertion loss of signal was more dependent on the contact states of Ag fillers in the bondline in preference to the electrical resistance of the ICA itself.