• 한국전기전자재료학회논문지
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• 제13권7호
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• pp.568-574
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• 2000

We have been optimized tungsten(W) plug CMP(chemical mechanical polishing) characteristics using two different kinds of component of slurry and two different kinds of pad which have different hardness. The comparison of oxide film roughness on around W plug after polishing has been carried out. And W plug recess for consumable sets and dishing effect at dense area according to the rate of over-polishing has been investigated. Also the analysis of residue on surface after cleaning have been performed. As a experimental result we have concluded that the consumable set of slurry A and hard pad was good for W plug CMP process. After decreasing the rate of chemical reaction of silica slurry and adding two step buffering we could reduce the expanding of W plug void however we are still recognizing to need a more development for those kinds of CMP consumables.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.151-155
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• 2003

The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the alumina substrate and the IMC layer between $Sn-37wt\%Pb$ solder and Ag-Pd thick film conductor after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, Ag-Pd conductor pad roughness were increased from 304nm to 330nm. $Cu_6Sn_5$ formed during initial ref]ow process at the interface between TiWN/Cu UBM and solder grew by the succeeding reflow process so the grains had a large diameter and dense interval. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about $0.1\~0.6{\mu}m$. And a needle-shaped $Ag_3Sn$ was also observed at the inside of the solder.

• International Journal of Advanced Culture Technology
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• 제3권1호
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• pp.13-20
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• 2015

The self-cleaning properties of nano-zinc oxide on cotton fabrics have been investigated. The cotton fabric has been prepared by pad-dry method. The nano-zinc oxide was encapsulated in the polystyrene particle by mini-emulsion process prior used. The loading amount of zinc oxide particles into the mini-emulsion were various from 1% wt to 40%wt. The particles sizes of ZnO-encapsulated polystyrene mini-emulsion were determined using dynamic light scattering. It was showed that the particle size of the mini-emulsion was in the range of 124-205 nm. The topography and morphology of ZnO-encapsulated polystyrene which coated on cotton fabrics was observed using scanning electron microscopy. The crystal structure of ZnO-coated on cotton fabrics was explored by X-ray diffraction spectroscopy. The photocatalytic activities of zinc oxide were present through the self-cleaning properties. The presents of the zinc oxide on cotton fabrics significantly showed the improving of the self-cleaning properties under UV radiation.

• Bulletin of the Korean Chemical Society
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• 제17권2호
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• pp.143-146
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• 1996

A continuous potential pulse is applied to a silver-working electrode on a pulsed amperometric detector (PAD) for detection of free cyanide and sulfide. The moving phase is 0.1 M sodium hydroxide, 0.5 M sodium acetate and 5% (v/v) ethylenediamine mixture, and the flow rate is 0.7 mL/min. Optimized pulse conditions include a -200 mV (vs. Ag/AgCl reference electrode) detection potential(Ed) for 60 msec and 50 mV cleaning potential (Ec) for 120 msec. The silver working electrode surface is not poisoned by cyanide or sulfide, and the PAD maintains long-term stability without loss of sensitivity and reproducibility at these pulse conditions. The detection limit of cyanide and sulfide separated by ion chromatography using an anion exchange column is 0.1 ppm and 0.05 ppm, respectively.

• ETRI Journal
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• 제35권6호
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• pp.1152-1155
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• 2013

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

• International Journal of Advanced Culture Technology
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• 제3권1호
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• pp.129-137
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• 2015

The study of photocatalysis of nano titanium dioxideon the cotton fabrics have been investigatedthrough self-cleaning properties. The mini-emulsion technique was employed to prepare the encapsulation of titanium dioxide nano particles in polystyrene beads prior used. The mini-emulsion was coated on the cotton fabrics using Pad-dry method.The loading amount of TiO2particles into the mini-emulsion were various from 1%wt to 40%wt. The particles sizes of the TiO2-encapsulated polystyrene mini-emulsion were investigated by dynamic light scattering. It was noticed that the particle size of the mini-emulsion was in the range of 100- 200 nm. The morphology of treated cotton fabrics were investigated using scanning electron microscopy. The crystal structure of TiO2-encapsulated PS mini emulsion which coated on cotton fabrics were examined by X-ray diffraction spectroscopy. In order to investigate the photocatalytic activities of TiO2 through the selfcleaning characteristics of the cotton fabrics, colorant stains were created on the samples. Coffee stains were used as colorant organic stains. The result shown that the coffee stained on the cotton fabrics significantly showed the improving of the self-cleaning properties under UV radiation.

• 마이크로전자및패키징학회지
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• 제22권2호
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• 한국의류학회지
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• 제45권3호
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• pp.409-422
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• 2021

A doctor's coat worn by Seo Jae-pil (1864-1951)-National Registered Cultural Heritage No. 607-was conserved with wet cleaning to remove thick wrinkles and brown stains that had been present for a long time. This paper also applied microscopic observation and infrared spectrophotometric analysis to obtain scientific investigation data on the cotton fabric of this doctor's coat. Information about Seo Jae-pil's time as a doctor, the process of changing his English name, and C.D.Williams & Co., which produced the medical coat, revealed that this doctor's coat was worn by Seo Jae-pil between 1892 and 1898 or 1926 and 1939. Additionally, this paper proposes a pad for filling relics that can protect the shape of modern and contemporary clothing, such as Seo Jae-pil's doctor's coat, for display at a museum site. Specifically, this research provides detailed information on the manufacturing of filling pads that can prevent damage to modern and contemporary jackets and coats so that they can be used in the cultural heritage field by developing filling materials for three-dimensional costume artifacts.

• 한국컴퓨터정보학회논문지
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• 제27권11호
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• pp.115-121
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• 2022

표면실장기술(SMT)에서 솔더 크림을 바르는 장비인 스크린 프린터는 패드가 작아지면서 도포 불량이 많이 발생한다. 이를 해결하기 위해 최근에는 젯 프린터를 사용하고 있다. 그런데 젯 프린터 헤드에 적용하는 밸브의 끝단 노즐을 깨끗하게 청소하지 않으면 과납이나 오도포가 발생한다. 이를 방지하기 위해서는 노즐을 주기적으로 청소해줘야 한다. 본 논문에서는 젯 프린터의 안정적인 솔더 크림 도포를 위하여 기존 기술보다 더욱 안정적으로 청소하는 방법을 제시하였다. 이 방법은 35mm 폭의 무진천을 재단하여 롤 형태로 감아 놓고, 반대쪽에 DC 기어드 모터로 회전시켜 닦는다. 그 결과 약 2,000회 도팅 주기로 청소를 했을 때 노즐 표면에 솔더 페이스트가 남지 않고 잘 닦이는 것을 확인하였다.

• 한국전기전자재료학회논문지
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• 제16권6호
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• pp.465-470
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• 2003

The chemical mechanical polishing (CMP) process has been widely used for the global planarization of multi-layer structures in semiconductor manufacturing. The CMP process can be optimized by several parameters such as equipment, consumables (pad, backing film and slurry), process variables and post-CMP cleaning. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, the slurry dominates more than 40 %. In this paper, we have studied the CMP characteristics of diluted silica slurry by adding of raw alumina abrasives and annealed alumina abrasives. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.