• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.11
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• pp.99-104
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• 1993

We analyzed the D.I. water used in wet cleaning process of semiconductor device manufacturing both at the D.I. water plant and at the wafer cleaning bath to detect the impurity source of D.I. water contamination. This shows that the quantity of impurity is related to the resistivity of D.I. water, and we found that the cleanliness of the wafer surface processed in D.I. water bath was affected by the degree of the ionic impurity contamination. So we evaluated the cleaning effect as different method for Fe ion, having the best adsoptivity on wafer surface. Moreover the temperature effect of the D.I. water is investigated in case of anion in order to remove the chemical residue after wet process. In addition to the control of D.I. water resistivity, chemical analysis of impurity control in D.I. water should be included and a suitable cleaning an drinsing method needs to be investigated for a high yielding semiconductor device.

• International conference on construction engineering and project management
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• 2022.06a
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• pp.295-303
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• 2022

Residential heating systems in South Korea are largely based on the use of ondol pipelines. Heat is transferred to the floor by passing hot water through a metal or plastic pipe buried within the concrete of the floor. Consequently, it is difficult to clean the inside of these pipes after installation. Over time, foreign substances such as scale accumulate in the pipe when the ondol heating method is used for an extended period. Therefore, in the past, pipes were cleaned by removing foreign substances attached to the inside surfaces of the pipes using high-pressure water or by disassembling the pipes and removing foreign substances with chemical agents. Recently, a method for removing foreign substances through the cavitation effect of ultrasound has been proposed. This idea might lead to the development of new technologies for cleaning pipe interiors. Consequently, this study investigated the use of ultrasound to clean pipes embedded in concrete. In this study, devices that generated ultrasonic waves with various frequencies and directions were prepared. After preparing arbitrarily contaminated pipes, the appropriate frequency, output strength, and output direction for each foreign substance were determined through repeated experiments. The results of this experiment could provide important information for future methods of cleaning the interior of ondol piping systems.

• Journal of Hydrogen and New Energy
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• v.35 no.4
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• pp.377-383
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• 2024

In this paper, the flow uniformity improvement and flow characteristic of the sensor condenser for a heat exchanger cleaning system were studied using response surface method and computational-fluid-dynamics. The design variable was defined as a shape for controllable sensor condenser area. The objective functions were defined as the improvement of flow uniformity in heat exchanger cleaning system tubes. The flow uniformity improvement and flow characteristic of optimum model was verified by numerical analysis and the reliability of the model was retained by comparison of numerical analysis and comparative analysis with the reference model.

• Korean Journal of Materials Research
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• v.27 no.11
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• pp.577-582
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• 2017

Self-cleaning and photocatalytic $TiO_2$ thin films were prepared by a facile sol-gel method followed by spin coating using peroxo titanic acid as a precursor. The as-prepared thin films were heated at low temperature($110^{\circ}C$) and high temperature ($400^{\circ}C$). Thin films were characterized by X-ray diffraction(XRD), Field-emission scanning electron microscopy(FESEM), UV-Visible spectroscopy and water contact angle measurement. XRD analysis confirms the low crystallinity of thin films prepared at low temperature, while crystalline anatase phase was found the for high temperature thin film. The photocatalytic activity of thin films was studied by the photocatalytic degradation of methylene blue dye solution. Self-cleaning and photocatalytic performance of both low and high temperature thin films were compared.

• Journal of Korean Society for Quality Management
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• v.30 no.2
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• pp.72-85
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• 2002

Advances in computer and sensor technology have made it possible to obtain superlarge manufacturing process data in real time, letting us extract meaningful information from these superlarge data sets. We propose a systematic data analysis procedure which field engineers can apply easily to manufacture quality products. The procedure consists of data cleaning and data analysis stages. Data cleaning stage is to construct a database suitable for statistical analysis from the original superlarge manufacturing process data. In the data analysis stage, we suggest a graphical easy-to-implement approach to extract practical information from the cleaned database. This study will help manufacturing companies to achieve six sigma quality.

• Laser Solutions
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• v.4 no.3
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• pp.22-29
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• 2001

A development of new surface clwaning technol ogies such as laser and aerosol in paeallel with the improvement of conventional wet mwthods becomes more essential in semiconductor industry due the confrontation of new challenges such as significant device shrink, environmental foralum inum do not work for copper as a new interconnection material, and more effective cleaning tools are required with decreasing the feature size less than 0.13 ㎛ as well as increasing the wafer size from 200 ㎜ to 300 ㎜. In this article, various cleaning techniques increasing laser cleaning are compared methodolgically hi order to understand their unique characteristics such as advantages and disadvantages according to the current clean ing issues. In particular, the current state of art of laser technique for semiconductors md prospects as a try cleaning method are described.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1769-1770
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• 2007

To prevent an insulator failure, an automatic cleaning robot was developed for suspension insulator strings. The robot autonomously moves along the insulator string using the clamps installed on its two moving frames, and adopts a dry cleaning method using rotating brushes and a circular motion guide. In addition, a mechanized brush bristles and a voltage-balancing contactor are devised to increase cleaning efficiency and to prevent arc generation under live-line conditions, respectively. Moreover, a manual tool for its installation and removal is presented. We confirmed its effectiveness through experiments.

• Laser Solutions
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• v.5 no.2
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• pp.9-15
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• 2002

Basic principles and unique characteristics of laser-induced shock cleaning have been described compared to a conventional laser cleaning method and the removal of small tungsten particles from silicon wafer surfaces was attempted using both methods. It was found that the conventional laser cleaning was not feasible to remove the tungsten particles whereas a successful removal of the particles was carried out by the laser-induced shock waves. From the quantitative analysis using a surface scanner, the average removal efficiency of the particles was more than 98% where smaller particles were slightly more difficult to remove probably due to the increased adhesion force with a decrease of the particle size. It was also seen that the gap distance between the laser focus and the wafer surface is an important processing parameter since the removal efficiency is strongly dependent on the gap distance.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.21-27
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• 2023

In this article, a plate-type megasonic cleaning system with cooling pins is proposed for the sliced ingot, which is a raw material of silicon (Si) wafers. The megasonic system is operated with a lead zirconate titanate (PZT) actuator, which has high electric resistance, thus when it is being operated, it dissipates much heat. So this article proposes a megasonic system with cooling pins. In the design process, finite element analysis was performed and the results were used for the design of the waveguide. The frequency with the maximum impedance value was 998 kHz, which agreed well with the measured value of 997 kHz with 0.1 % error. Based on the results, the 1 MHz waveguide was fabricated. Acoustic pressures were measured, and analyzed. Finally, cleaning tests were performed, and 90 % particle removal efficiency (PRE) was achieved over 10 W power. These results imply that the developed 1 MHz megasonic will effectively clean sliced ingot wafer surfaces.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.2015-2016
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• 2011

Detection of data cleaning bed of because method of communication uses AODV(Ad hoc On-demand Distance Vector) Zig-Bee communication though communication method is important being separated by several part structurally data monitor ring do it way to understand be. Although data that detect in transmitter will get into several kinds, data of each senses is detected by 4 - 20 mA conclusively and remainder data is consisted of temperature data. That is measured in transmitter in mast baud via conversion relation to do monitorring norm of data being decided to PC mistake of measured value so that can do control between enforcement compose. Speak that can manage equipment of cleaning bed by number of persons who write if detect data detection in wide cleaning bed through Zig-Bee communication and is easy because also administration of data consists of real time.