• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.7-12
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• 2010

In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.85-89
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• 2006

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.1049-1050
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.1053-1054
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• 2009

• Journal of the Korean Society for Precision Engineering
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• v.31 no.9
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• pp.831-838
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• 2014

Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.119-126
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• 2001

Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion(i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) was heated by an UV laser beam transmitted through the glass substrate. The laser energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, forming a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.53-81
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• 2006

A COG(Chip on Glass) bonding process that is one of display packaging technology and bonds between driver IC chip and a glass panel using ACF(Anisotropic Conductive Film)has been investigated by using diode laser. This method is possible to raise cure temperature of ACF within one second and can reduce the total process time for COG bonding by a conventional method such as a hot plate. Also we can get good pressure mark on the surface of electrodes and higher bonding strength than that by convention method. Results show that laser COG bonding can give low pressure bonding and decrease a warpage of panel. We believe that it can be applied to fine pitch module.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.6
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• pp.1282-1287
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• 2005

The accuracy of chip alignment in inferior product inspection of COG(Chip On Glass) to be measured a few micro unit is very important role since the accuracy of chip inspection depends on chip alignment. In this paper, we propose the area segmentation pattern matching method to enhance the accuracy of chip alignment. The area segmentation pattern matching method compares, and matches correlation coefficients between the characteristic features within the detailed area and the areas. The three areas of pattern circumference are learned to minimize the matching error by bad pattern. The proposed method has advantage such as reduction of matching time, and enhanced accuracy since the characteristic features are searched within the segmented area.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.67-67
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• 2004

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.613-614
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• 2010