Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Relationship between Contrast Ratio of Conductive Particle and Contact Resistance on COG Bonding using ACF

ACF를 이용한 COG 접합 공정에서 도전볼의 음영비와 접촉 저항과의 관계

  • Jin, Songwan (Department of Mechanical Engineering, Korea Polytechnic University) ;
  • Jeong, Young Hun (School of Mechanical Engineering, Kyungpook National University) ;
  • Choi, Eun Soo (Department of Mechanical system Engineering, Korea Polytechnic University) ;
  • Kim, Bosun (LG Display Co., Ltd.) ;
  • Yun, Won-Soo (Department of Mechanical Engineering, Korea Polytechnic University)
  • 진송완 (한국산업기술대학교 기계공학과) ;
  • 정영훈 (경북대학교 기계공학부) ;
  • 최은수 (한국산업기술대학교 대학원 기계시스템공학과) ;
  • 김보선 (LG 디스플레이(주)) ;
  • 윤원수 (한국산업기술대학교 기계공학과)
  • Received : 2013.12.09
  • Accepted : 2014.07.15
  • Published : 2014.09.01
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Abstract

Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.

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References

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