Proceedings of the Korean Society of Laser Processing Conference (한국레이저가공학회:학술대회논문집)
- 2006.11a
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- Pages.53-81
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- 2006
Magnetic Pulse Solutions
마그네틱 펄스 용접 및 성형기공
Abstract
A COG(Chip on Glass) bonding process that is one of display packaging technology and bonds between driver IC chip and a glass panel using ACF(Anisotropic Conductive Film)has been investigated by using diode laser. This method is possible to raise cure temperature of ACF within one second and can reduce the total process time for COG bonding by a conventional method such as a hot plate. Also we can get good pressure mark on the surface of electrodes and higher bonding strength than that by convention method. Results show that laser COG bonding can give low pressure bonding and decrease a warpage of panel. We believe that it can be applied to fine pitch module.
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