• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.3
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• pp.49-59
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• 2001

Wireless communication systems will be one of the biggest drivers of semiconductor products over the next decade. Global Positioning System (GPS) and Blue-tooth, HomeRF, and Wireless-LNA system are just a few of RF-module candidate awaiting integration into next generation mobile phone. Motivated by the growing needs for lowcost and multi-band/multi-function single chip wireless transceivers, CMOS technology has been recognized as a most promising candidate for the implementation of the future wireless communication systems. This paper presents recent developments in RF CMOS technology so far, much of them have been developed in ETRI, and from them forecasts technology trends in the near future.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.1075-1080
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• 2003

Design and fabrication process of a full inorganic electroluminescent microdislay based on aluminum / nanostructured porous silicon reverse biased light emitting Schottky diodes are discussing. Being of a solid state construction. this micro-display is cost-effective, thin and light in weight due to very simple device architecture. Its benefits include also super high resolution, wide viewing angles, fast response time and wide operating temperature range. The advantages of full integration of a LED-array and driving circuitry onto a Si-chip will be also discussed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.183-199
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• 2002

Reliability.The reliability strongly depended on the CTE of underfill resin..The fractured portion was identical with the maximum plastic equivalent strain..1 % or less value of the maximum plastic equivalent strain certified more than 1000 cycle of TCT life. UFB.Bonding accuracy was confirmed within2$2{\mu}{\textrm}{m}$..The fundamental bondability of UFB was confirmed with no damage around aluminum pads. Some dislocations and vacancies were observed at the interface, however, the atomic level bonding was confirmed. CBB.Dry process was applied to UBM removal.

• 제어로봇시스템학회:학술대회논문집
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• 1991.10a
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• pp.24-29
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• 1991

RCCL(Robot Control C Library) is general purpose robot control language. It is programmed with C language and composed of C library. So it is well portable and supports sensor integration control and high level force control algorithms. We implemented RCCL on PUMA. We developed servo controller of DDC(Direct Digital Control). We used intel 8097BH one chip micro controller as CPU. One digital servo board controls three motors. Host computer is IBM PC 386DX-33 with RCCL.

• The Magazine of the IEIE
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• v.29 no.9
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• pp.1020-1020
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• 2002

Wireless communication systems will be one of the biggest drivers of semiconductor products over the next decade. Global Positioning System (GPS) and Blue-tooth, HomeRF, and Wireless-LNA system are just a few of RF-module candidate awaiting integration into next generation mobile phone. Motivated by the growing needs for low-cost and multi-band/multi-function single chip wireless transceivers, CMOS technology has been recognized as a most promising candidate for the implementation of the future wireless communication systems. This paper presents recent developments in RF CMOS technology, which is classified into device technology and circuit technology and from them forecasts technology trends in the near future.

• The Magazine of the IEIE
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• v.29 no.9
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• pp.18-30
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• 2002

Wireless communication systems will be one of the biggest drivers of semiconductor products over the next decade. Global Positioning System (GPS) and Blue-tooth, HomeRF, and Wireless-LNA system are just a few of RF-module candidate awaiting integration into next generation mobile phone. Motivated by the generation mobile phone. Motivated by the growing needs for low-cost and multi-band/multi-function single chip wireless transceivers, CMOS technology has been recognized as a most promising candidate for the implementation of the future wireless communication systems. This paper presents recent developments in RF CMOS technology, which is classified into device technology and circuit technology and from them forecasts technology and from them forecasts technology trends in the near future.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.65-89
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• 2003

Next Highly sophisticated communication generation of the Advanced Electronics and Imaging processing society will require a vast information volume and super high speed signal transport and information instruction. This means that super high technology should be created for satisfying the demand. It's also required the high reliability of the communication system itself, It will be supported the new advanced packaging technology of the 3 Dimensional structured system and system integration technology. Here is introduced the new 3 Dimensional technology for IC nnd LSI packaging and Opt-electronics Packaging of ASET activity in Japan.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.38 no.3
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• pp.31-39
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• 2001

In this paper, we proposed a new pixel circuit of the CMOS image sensor for high dynamic range operation, which is based on a multiple sampling scheme and a conditional reset circuit. To expand the pixel dynamic range, the output is multiple-sampled in the integration time. In each sampling, the pixel output is compared with a reference voltage, and the result of comparison may activate the conditional reset circuit. The times of conditional reset, N, during the integration will contribute to the increase of the dynamic range by the times of N. The test chip was fabricated with 0.65-${\mu}m$ CMOS technology (2-P, 2-M).

• The Journal of Korean Institute of Communications and Information Sciences
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• v.18 no.10
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• pp.1553-1571
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• 1993

A significant amount of research has focused on the development of highly parallel architectures to obtain far more computational power than conventional computer systems. These architectures usually comprise of a large number of processors communicating through an interconnection network. The VLSI (Very Large Scale Integration) and WSI (Wafer Scale Integration) cellular arrays form one important class of those parallel architectures, and consist of a large number of simple processing cells, all on a single chip or wafer, each interconnected only to its neighbors. This paper studies three fundamental issues in these arrays : fault-tolerant reconfiguration. functional reconfiguration, and their integration. The paper examines conventional techniques, and gives an in-depth discussion about fault-tolerant reconfiguration and functional reconfiguration, presenting testing control strategy, configuration control strategy, steps required f4r each reconfiguration, and other relevant topics. The issue of integrating fault tolerant reconfiguration and functional reconfiguration has been addressed only recently. To tackle that problem, the paper identifies the relation between fault tolerant reconfiguration and functional reconfiguration, and discusses appropriate testing and configuration control strategy for integrated reconfiguration on VLSI and WSI cellular arrays.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.12
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• pp.1359-1364
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• 2012

The C-band semi-lumped lowpass filter with broad stopband and compact size characteristic using chip inductor is proposed. To provide an additional attenuation pole in stopband by SRF, a separable inductor is added to proposed structure, and it has broad stopband characteristic. The third order elliptic function lowpass filter with chip inductor(L: 9.1 nH, SRF: 5.5 GHz, Q: 25) has insertion loss of 0.38 dB, cutoff frequency of 920 MHz, broad stopband(below 20 dB) of 1.43~7.8 GHz and the size is reduced 37.4 % compared to distributed inductor.