• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.472-475
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• 2004

Microarray-based DNA chips provide an architecture for multi-analyte sensing. In this paper, we report a new approach for DNA chip microarray fabrication. Multifunctional DNA chip microarray was made by immobilizing many kinds of biomaterials on transducers (particles). DNA chip microarray was prepared by randomly distributing a mixture of the particles on a chip pattern containing thousands of m-scale sites. The particles occupied a different sites from site to site. The particles were arranged on the chip pattern by the random fluidic self-assembly (RFSA) method, using a hydrophobic interaction for assembly.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2005년도 학술발표대회 논문집
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• pp.51-67
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• 2005

General chip SMD parts(chip resistance, chip capacitor, chip varistor etc.) are very wide sed electronics parts for IT units. But, failure modes are indistinct for these chip parts. In factory and field the failure modes are recognized to accidental failure mope caused by potential defect. In this paper used chip varistor ALT(Accelerate Life Test) test for verify general failure modes in chip SMD parts. Also the results are useful for general chip SMD ALT tests.

• 한국정밀공학회지
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• 제11권6호
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• pp.179-184
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• 1994

In this study a nondimensional parameter, feed/land length(F/L) was introduced, and using this parameter, cutting performance and chip breaking characteristics of the groove and the land angle type chip formers were assessed. Specific cutting energy consumed and shape of broken chip with its breaking cycle time were appraised to find out the ranges of F/L value where efficient cutting and effective chip breaking could be achieved. C type chip was found out to be the most preferable in terms of cutting efficiency.

• 대한기계학회논문집
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• 제15권1호
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• pp.139-144
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• 1991

본 연구에서는 절삭가공시 생성되는 칩의 형상해석의 일환으로 2차원 절삭시 칩은 절삭날에 수직한 방향으로 공구경사면을 흘러간다는 기본적인 전제조건과 Kluft 등의 칩흐름각 예측에 대한 제안중 노으즈반경(nose radius) 및 기울임각의 영향을 중 첩시키고, 또한 절삭날에 연하여 미변형 칩두께(undeformed chip thickness)가 달라지 는 경우 칩흐름의 세기는 이에 비례한다는 Baart등의 가정을 도입하여 칩흐름각에 대 한 새로운 해석을 시도하였다.

• 한국정밀공학회지
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• 제20권11호
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• pp.64-70
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• 2003

This paper suggests a systematic methodology to predict chip forms using the experimental design technique and the neural network. Significant factors determined with ANOVA analysis are used as input variables of the neural network back-propagation algorithm. It has been shown that cutting conditions and cutting tool shapes have distinct effects on the chip forms, so chip breaking. Cutting tools are represented using the Z-map method, which differs from existing methods using some chip breaker parameters. After training the neural network with selected input variables, chip forms are predicted and compared with original chip forms obtained from experiments under same input conditions, showing that chip forms are same at all conditions. To verify the suggested model, one tool not used in training the model is chosen and input to the model. Under various cutting conditions, predicted chip forms agree well with those obtained from cutting experiments. The suggested method could reduce the cost and time significantly in designing cutting tools as well as replacing the“trial-and-error”design method.

• 한국생산제조학회지
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• 제20권5호
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• 한국시뮬레이션학회논문지
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• 제26권1호
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• pp.69-75
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• 2017

MCP(Multi-chip Package)는 두 개 이상의 Chip을 적층하여 하나의 패키지로 합친 제품이다. MCP를 만들기 위해서는 두 개 이상의 Chip이 동일한 Substrate에 적층되기 때문에 다수의 조립 공정이 필요하다. Package 공정에서는 Lot들이 동일한 특성을 가지는 Chip으로 구성되고 MCP를 구성하는 Chip의 특성은 Layer sequence에 의해 결정된다. MCP 생산 공정에서 WIP Balance 뿐만 아니라 Throughput을 달성하기 위해서는 Chip의 Layer sequence가 중요하다. 본 논문에서는 Chip들의 Layer sequence의 제약 조건을 고려한 스케쥴링 방법론을 제안한다.

• 미생물학회지
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• 제38권3호
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• pp.186-191
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• 2002

장내바이러스(enterovirus),로타바이러스(rotavirus),그리고 아데노바이러스(adenovirus)등 물을 통해 전파되는 환경바이러스의 신속한 검출 및 1 차적인 분류를 위해 올리고뉴클레오티드 DNA chip을 이용한 분석 시스템의 유용성에 대하여 연구하였다. BGM 세포배양실험에서 바이러스성 세포병변효과(cytopathic effect) 양성으로 판정된 세포단층으로부터 접종배양 3 일 후 세포내 모든 RNA를 분리하여 중합효소연쇄반응과 DNA chip으로 검출여부 및 유전형을 비교 분석한 결과 세포배양에서 양성으로 판정된 10개의 시료 중 3개가 바이러스 음성으로, 7개가 바이러스 양성으로 나타났다. 중합효소연쇄반응과 DNA chip에 의해 양성으로 나타난 7개 시료의 유전형은 두 방법에 의해 모두 장내바이러스로 동정되어 DNA chip에 의한 1차 동정의 유용성도 증명하였다. 세포배양 후 전기영동분석 없이 일차적인 동정과정까지 불과 3∼4 시간 이내에 수행해낼 수 있는 DNA chip분석은 특이성, 신속성, 및 경제성을 고루 갖추어 환경바이러스 검출방법론의 새로운 영역을 구성할 것으로 사료된다.

• 한국정밀공학회지
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• 제5권1호
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• pp.84-93
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• 1988

The on-line detection of the chip flow is one of the most important technologies in com- pletly automatic operation of machine tool, such as FMS and Unmanned Factories. This problem has been studied by many researchers, however, it is not solved as yet. For the recognition of chip flow in this study, the dynamic cutting force components due to the chip breaking were measured by dynamometer of piezo-electric type, and the frequency components of cutting force were also analyzed. From the measured results, the effect of cutting conditions and tool geometry on the dynamic cutting force component and chip formation were investigated in addition to the relationships between frequency of chip breaking (fB) and side serrated crack (fC) of chip. As a result, the following conclusions were obtaianed. 1) The chip formations have a large effect on the dynamic cutting force components. When chip breaking takes place, the dynamic cutting force component greatly increases, and the peridoic components appear, which correspond to maximum peak- frequency. 2) The crater wear of tool has a good effect on the chip control causing the chiup to be formed as upward-curl shape. In this case, the dymamic cutting force component greatly increases also 3) fB and fC of chip are closely corelated, and fC of chips has a large effect on the change of the situation of chip flow and dynamic cutting force component. 4) Under wide cutting conditions, the limit value (1.0 kgf) of dynamic cutting force component exists between the broken and continuous chips. Accordingly, this value is suitable for recognition of chip flow in on-line control of the cutting process.

• 대한기계학회논문집
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• 제16권6호
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• pp.1121-1140
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• 1992

본 연구에서는 부착형 칩절단구의 경사면 대신에 원고면으로 형성한 형태 칩 절단구를 고찰하고, 재래형과 비교하여 더 효과적인 칩절단구를 개발 실용화하고자 한 다. 가공법으로서는 연속칩의 처리가 가장 곤란한 선삭을, 공작물로서는 연속칩이 가장 잘 생성되는 SM 20 C의 연강을, 공구재료로서는 P계열의 초경합금을 써서 저속에 서 고속절삭속도까지 시험하였다.