• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1430-1432
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• 2003

Al doped Zinc Oxide(ZnO:Al) films, which is widely used as a transparent conductor in optoelectronic devices such as solar cell, plasma display panel, thermal heater, and other sensors, were prepared by using the capacitively coupled DC magnetron sputtering method. The influence of the substrate temperature, working gas pressure and deposition time on the electrical, optical and morphological properties were investigated experimentally. ZnO:Al films with the optimum growth conditions of working gas pressure and substrate temperature showed resistivity of $9.64{\times}10^{-4}\;{\Omega}$-cm and transmittance of 90.02% for a film 860nm thick in the wavelength range of the visible spectrum.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.453-453
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• 2007

Electrodeless fluorescent lamp exhibit two modes of operation: a low density mode in which the power is capacitively coupled to the plasma and which is known as the E-mode, and a higher density mode which is an inductive discharge known as the H-mode. The transition between these two(E to H) mode exhibits hysteresis. It is observed that transition currents change at different frequencies and hysteresis exists not only between the starting and minimum maintaining currents of the electromagnetic mode (H mode) discharge but also between the starting and minimum maintaining currents of the electrostatic mode (E mode) discharge. Hysteresis effect can be important role in dimming system.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.1183-1185
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• 1993

The plasma polymerized thin film of MMA+Sty was prepared using a capacitively coupled gas-flow-type reactor. This thin films were also delincated by the electron-beam apparatus with an acceleration voltage 30KV, and the pattern in the resist was developed with the gas-flow-type reactor using an argon as an etchant. The effect of discharge power on groth rate and etching rate of the thin film were studied. The molacular structure of the resist was investigated by ESCA and FT-IR.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.1189-1192
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• 1993

Organic thin films were fabricated an using interelectrode capacitively coupled type plasma polymerizaion apparatus, and their optical properties were investigated. A deposition rate of styrene thin films is linearly increased, but one or vinyl-pyridine thin films is nonlinearly increased with increasing of polymerization time, pressure and monomer flow rate. The transmittance of single layer thin films is constant, but that of multi-layer appeared irregular peak with increasing of the number of layers. And then the refractive index of organic thin films is various from 1.55 to 1.65 with wavelength, the extinction coefficient indicated $10^{-3}$.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1560-1561
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• 2007

Electrodeless fluorescent lamp exhibit two modes of operation : a low density mode in which the power is capacitively coupled to the plasma and which is known as the E-mode, and a higher density mode which is an inductive discharge known as the H-mode. The transition between these two(E to H) mode exhibits hysteresis. It is observed that transition currents change at different frequencies and hysteresis exists not only between the starting and minimum maintaining currents of the electromagnetic mode (H mode) discharge but also between the starting and minimum maintaining currents of the electrostatic mode (E mode) discharge. Hysteresis effect can be important role in dimming system.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.437-437
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• 2010

DC Hollow cathode 방전은 약 100여 년 전, Paschen에 의해 실험된 이후로 광원, 스퍼터링 공정, 이온빔 소스 등 다양한 분야에 이용되어 왔다. 최근 태양전지용 마이크로 결정질 실리콘 증착 시, RF CCP의 전극에 복수의 홀 혹은 트렌치 구조를 두어 Hollow cathode 방전 효과를 이용하여 향상된 공정 속도로 공정을 진행한다. 그러나 RF-MHCD (Multi hole cathode discharge) 공정을 위한 최적 규격의 홀 기에 관한 연구는 그 중요성과 응용성에도 불구하고 깊게 이루어지지 못한 바 있다. 그러므로 저자는 Capacitively Coupled Plasma (전극 간격 : 4cm, 전극 직경 : 14cm) 장비에서 평면 전극과 10mm 깊이와 각각 3.5mm, 5mm, 7mm, 10mm 직경의 홀이 있는 4개의 전극을 이용하여 Argon RF-MHCD 방전을 관찰하여 조건 별 최적의 홀 전극 디자인을 도출하였다. 실험 조건은 64.5mTorr ~ 645mTorr압력 범위/ 1A~9A이며, 플라즈마는 전극 사이 중앙에 설치한 RF-compensated Langmuir Probe와, 전극과 전기적으로 접촉하는 1000:1 Probe 와 Voltage-Current Probe를 이용하여 측정되었다. 실험 결과 압력 조건 별로, 최적의 전자 밀도를 유도하는 전극 상 홀의 직경이 달라짐을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.399-399
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• 2010

Polyethylene glycol(PEG)은 강력한 단백질 및 세포흡착 억제력을 가지고 있어 다양한 생물학적 연구에 사용되고 있으나, 기판과의 결합력이 무척 약해 기판 위에 박막을 형성하기가 매우 어렵다는 문제점이 있다. 이번 연구에서는 capacitively-coupled plasma chemical vapor deposition(CCP-CVD)를 이용하여 PEG를 유리 기판 위에 플라즈마 중합하여 plasma-polymerized PEG(PP-PEG) 기판을 만들었다. PP-PEG 박막은 FT-IR, XPS, ToF-SIMS 분석을 통하여 PEG와 매우 유사한 화학적 조성을 가지고 있음을 확인할 수 있었다. 또한 PP-PEG 기판은 photolithography 방법을 이용하여 표면에 photoresist를 패턴한 뒤 아민작용기를 가지는 plasma-polymerized ethylenediamine (PPEDA)를 증착하여 표면이 amine/PEG로 패턴화된 박막 기판을 만들었다. 패턴된 기판에 단백질 및 세포를 고정화하였을 때, 아민 작용기가 노출된 부분에만 고정화가 나타나고 PP-PEG 영역에는 단백질 및 세포의 흡착이 효율적으로 억제되는 것을 형광측정 및 ToF-SIMS chemical imaging 방법을 이용하여 확인하였다. 이러한 바이오칩 제작기술은 단백질 및 세포 칩을 포함한 여러 분야에서 폭넓게 응용될 수 있을 것으로 기대된다.

• Journal of Surface Science and Engineering
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• v.32 no.3
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• pp.461-466
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• 1999

Diamond-like carbon(DLC) films were directly deposited onto germanium(Ge) witness pieces and lenses by a capacitively coupled 13.56 MHz RF glow discharge plasma with $CH_4$ gas. The characterizations of DLC films were measured using a Raman and FTIR spectrometer. The configuration of Raman and FTIR spectra had a traditional shape. The IR transmittance was measured using an IR spectrophotometer. The maximum values of the IR transmission of Ge with the DLC/Ge/DLC, DLC/Ge/BBAR (broad band antireflection), DLC/Ge, and BBAR/Ge structures are 98%, 93%, 64%, and 63.5%, respectively, which come up to the theoretical values. The uniform DLC films were obtained by a rotation of the cathode at certain conditions.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.253-253
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• 2012

Low temperature SiOx film process has being required for both silicon and oxide (IGZO) based low temperature thin film transistor (TFT) for application of flexible display. In recent decades, from low density and high pressure such as capacitively coupled plasma (CCP) type plasma enhanced chemical vapor deposition (PECVD) to the high density plasma and low pressure such as inductively coupled plasma (ICP) and electron cyclotron resonance (ECR) have been used to researching to obtain high quality silicon oxide (SiOx) thin film at low temperature. However, these plasma deposition devices have limitation of controllability of process condition because process parameters of plasma deposition such as RF power, working pressure and gas ratio influence each other on plasma conditions which non-leanly influence depositing thin film. In compared to these plasma deposition devices, neutral beam assisted chemical vapor deposition (NBaCVD) has advantage of independence of control parameters. The energy of neutral beam (NB) can be controlled independently of other process conditions. In this manner, we obtained NB dependent high crystallized intrinsic and doped silicon thin film at low temperature in our another papers. We examine the properties of the low temperature processed silicon oxide thin films which are fabricated by the NBaCVD. NBaCVD deposition system consists of the internal inductively coupled plasma (ICP) antenna and the reflector. Internal ICP antenna generates high density plasma and reflector generates NB by auger recombination of ions at the surface of metal reflector. During deposition of silicon oxide thin film by using the NBaCVD process with a tungsten reflector, the energetic Neutral Beam (NB) that controlled by the reflector bias believed to help surface reaction. Electrical and structural properties of the silicon oxide are changed by the reflector bias, effectively. We measured the breakdown field and structure property of the Si oxide thin film by analysis of I-V, C-V and FTIR measurement.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.136.2-136.2
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• 2015

반도체 제조는 chip의 성능 향상 및 단가 하락을 위해 지속적으로 pattern size가 nano size로 감소해 왔고, capacitor 용량은 증가해 왔다. 이러한 현상은 contact hole의 aspect ratio를 지속적으로 증가시킨바, 그에 따라 최적의 HARC (high aspect ratio contact)을 확보하는 적합한 dry etch process가 필수적이다. 그러나 HARC dry etch process는 많은 critical plasma properties 에 의존하는 매우 복잡한 공정이다. 따라서, critical plasma properties를 적절히 조절하여 higher aspect ratio, higher etch selectivity, tighter critical dimension control, lower P2ID과 같은 plasma characteristics을 확보하는 것이 요구된다. 현재 critical plasma properties를 제어하기 위해 다양한 plasma etching 방법이 연구 되어왔다. 이 중 plasma를 낮은 kHz의 frequency에서 on/off 하는 pulsed plasma etching technique은 nanoscale semiconductor material의 etch 특성을 효과적으로 향상 시킬 수 있다. 따라서 본 실험에서는 dual-frequency capacitive coupled plasma (DF-CCP)을 사용하여 plasma operation 동안 duty ratio와 pulse frequency와 같은 pulse parameters를 적용하여 plasma의 특성을 각각 제어함으로써 etch selectivity와 uniformity를 향상 시키고자 하였다. Selective SiO2 contact etching을 위해 top electrode에는 60 MHz pulsed RF source power를, bottom electrode에는 2MHz pulse plasma를 인가하여 synchronously pulsed dual-frequency capacitive coupled plasma (DF-CCP)에서의 plasma 특성과 dual pulsed plasma의 sync. pulsing duty ratio의 영향에 따른 etching 특성 등을 연구 진행하였다. 또한 emissive probe를 통해 전자온도, OES를 통한 radical 분석으로 critical Plasma properties를 분석하였고 SEM을 통한 etch 특성분석과 XPS를 통한 표면분석도 함께 진행하였다. 그 결과 60%의 source duty percentage와 50%의 bias duty percentage에서 가장 향상된 etch 특성을 얻을 수 있었다.