• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.4
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• pp.211-216
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• 2003

This work describes a 3 V 12b 100 MS/s CMOS digital-to-analog converter (DAC) for high-speed communication system applications. The proposed DAC is composed of a unit current-cell matrix for 8 MSBs and a binary-weighted array for 4 LSBs, trading-off linearity, power consumption, chip area, and glitch energy with this process. The low-glitch switch driving circuits are employed to improve linearity and dynamic performance. Current sources of the DAC are laid out separately from the current-cell switch matrix core block to reduce transient noise coupling. The prototype DAC is implemented in a 0.35 um n-well single-poly quad-metal CMOS technology and the measured DNL and INL are within ${\pm}0.75$ LSB and ${\pm}1.73$ LSB at 12b, respectively. The spurious-free dynamic range (SFDR) is 64 dB at 100 MS/s with a 10 MHz input sinewave. The DAC dissipates 91 mW at 3 V and occupies the active die area of $2.2{\;}mm{\;}{\times}{\;}2.0{\;}mm$

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.4
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• pp.511-519
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• 2016

This paper proposes a CMOS 6-bit phase shifter with low RMS phase and amplitude errors for an X-band phased array antenna. The phase shifter combines a switched-path topology for coarse phase states and a switch-filter topology for fine phase states. The coarse phase shifter is composed of phase shifting elements, single-pole double-throw (SPDT), and double-pole double-throw (DPDT) switches. The fine phase shifter uses a switched LC filter. The phase coverage is $354.35^{\circ}$ with an LSB of $5.625^{\circ}$. The RMS phase error is < $6^{\circ}$ and the RMS amplitude error is < 0.45 dB at 8-12 GHz. The measured insertion loss is < 15 dB, and the return losses for input and output are > 13 dB at 8-12 GHz. The input P1dB of the phase shifter achieves > 11 dBm at 8-12 GHz. The current consumption is zero with a 1.2-V supply voltage. The chip size is $1.46{\times}0.83mm^2$, including pads.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.49 no.1
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• pp.57-63
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• 2012

In this paper, a switch sizing method is proposed in order to prevent the cross-regulation in the TM type SIDO DC-DC buck converter. In TM type SIDO DC-DC buck converter, a DCM operation is required. In the DCM operation, the inductor peak current is larger than that in the CCM. Because of the larger inductor peak current and the added switch resistance, the voltage drop is increased, resulting in possible cross-regulation. To solve this problem, the switch resistance must be considered in sizing the switch. To simplify the calculation of the resistance, the inductor current was replaced by the average load current. Using the proposed method, TM type SIDO DC-DC buck converter for camera module was designed to provide two independent supply voltage(2.8 V and 1.8 V). The designed circuit was fabricated in a standard $0.35{\mu}m$ CMOS process. At a switching frequency of 1 MHz and a load current of 200 mA, a power effciency of 80.7% was achieved.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.6
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• pp.760-767
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• 2014

This paper describes a high-radix crossbar switch design with low latency and power dissipation for Network-on-Chip (NoC) applications. The reduction in latency and power is achieved by employing a folded-clos topology, implementing the switch organized as three stages of low-radix switches connected in cascade. In addition, to facilitate the uniform placement of wires among the sub-switch stages, this paper proposes a Mux-Matrix-Mux structure, which implements the first and third switch stages as multiplexer-based crossbars and the second stage as a matrix-type crossbar. The proposed 256-radix, 8-bit crossbar switch designed in a 65nm CMOS has the simulated power dissipation of 1.92-W and worst-case propagation delay of 0.991-ns while operating at 1.2-V supply and 500-MHz frequency. Compared with the state-of-the-art designs in literature, the proposed crossbar switch achieves the best energy-delay-area efficiency of $0.73-fJ/cycle{\cdot}ns{\cdot}{\lambda}^2$.

• Transactions on Electrical and Electronic Materials
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• v.10 no.2
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• pp.44-48
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• 2009

A simulation study of a 10-bit two-stage DAC was done by using a conventional current switch cell. The DAC adopts the segmented architecture in order to reduce the circuit complexity and the die area. The 10-bit CMOS DAC was designed in 2 blocks, a unary cell matrix for 6 MSBs and a binary weighted array for 4 LSBs, for fabrication in a 0.35-${\mu}m$ CMOS process. To cancel the accumulation of errors in each current cell, a symmetrical switching sequence is applied in the unary cell matrix for 6 MSBs. To ensure high-speed operation, a decoding circuit with one stage latch and a cascode current source were developed. Simulations show that the maximum power consumption of the 10-bit DAC is 74 mW with a sampling frequency of 100 MHz.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.518-521
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• 1998

This paper describes a 3.3V-65MHz 12BIT CMOS current-mode DAC designed with a 8 MSB current matirx stage and a 4 LSB binary weighting stage. The linearity errors caused by a voltage drop of the ground line and a threshold voltage mismatch of transistors have been reduced by the symmetrical routing method with ground line and the tree structure bias circuit, respectively. In order to realize a low glitch energy, a cascode current switch ahs been employed. The simulation results of the designed DAC show a coversion rate of 65MHz, a powr dissipation of 71.7mW, a DNL of .+-.0.2LSB and an INL of .+-.0.8LSB with a single powr supply of 3.3V for a CMOS 0.6.mu.m n-well technology.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.863-866
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• 2003

Recently, there has been growing interests in the magneto-resistive random access memory (MRAM) because of its great potential as a future nonvolatile memory. In this paper, a CMOS macro-model for MRAM cell based on a twin cell structure is proposed. The READ and WRITE operations of the MTJ cell can be emulated by adopting data latch and switch blocks. The behavior of the circuit is confirmed by HSPICE simulations in a 0.35-${\mu}{\textrm}{m}$ CMOS process. We expect the macro model can be utilized to develope the core architecture and the peripheral circuitry. It can also be used for the characterization and the direction of the real MTJ cells.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.3
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• pp.417-422
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• 2015

A 6.5 - 8.5 GHz CMOS UWB transmitter is implemented using $0.18{\mu}m$ CMOS technology. The transmitter is mainly composed of switched LC VCO and digital pulse generator (DPG). Using RF switch and DPG, the uniform power and sidelobe rejection are achieved irrespective of the carrier frequency. The measured UWB carrier frequency range is 7 ~ 8 GHz and the pulse width is tunable from 1 to 2 ns. The measured energy efficiency per pulse is 2.1 % and the power consumption is 0.6 mW at 10 Mbps without the buffer amplifier. The chip core size is $0.72mm^2$.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.26 no.10
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• pp.1567-1570
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• 2022

This paper, we presents a RF protection technique of antenna switch by improving the power handling capability in worst case environment mode for mobile phone applications without critical payment of circuit performances such as insertion loss, isolation and ACBV (AC breakdown voltage). By applying a additional capacitive path located in front of the antenna in cell-phone, it performs the effective reduction of input power in high voltage standing wave ratio (VSWR) condition. Under the all-path off condition which causes a high VSWR, it achieved 37.7dBm power handling level as high as 5.7dB compared to that of conventional one at 2GHz. In addition, insertion loss and isolation performances were 0.31dB and 42.72dB at 2 GHz, respectively which were almost similar to that of the conventional circuit. The proposed antenna switch was fabricated in 130nm CMOS SOI technology.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.11
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• pp.39-47
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• 1998

This paper describes high-speed pipelined memory architecture for a shared buffer ATM switch. The memory architecture provides high speed and scalability. It eliminates the restriction of memory cycle time in a shared buffer ATM switch. It provides versatile performance in a shared buffer ATM switch using its scalability. It consists of a 2-D array configuration of small memory banks. Increasing the array configuration enlarges the entire memory capacity. Maximum cycle time of the designed pipelined memory is 4 ns with 5 V V$\_$dd/ and 25$^{\circ}C$. It is embedded in the prototype chip of a shared scalable buffer ATM switch with 4 x 4 configuration of 4160-bit SRAM memory banks. It is integrated in 0.6 $\mu\textrm{m}$ 2-metal 1-poly CMOS technology.